JPS5913412A - Package structure of oscillator - Google Patents

Package structure of oscillator

Info

Publication number
JPS5913412A
JPS5913412A JP12264282A JP12264282A JPS5913412A JP S5913412 A JPS5913412 A JP S5913412A JP 12264282 A JP12264282 A JP 12264282A JP 12264282 A JP12264282 A JP 12264282A JP S5913412 A JPS5913412 A JP S5913412A
Authority
JP
Japan
Prior art keywords
glass tube
oscillation element
terminal
electrode patterns
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12264282A
Other languages
Japanese (ja)
Inventor
Noboru Wakatsuki
昇 若月
Sumio Yamada
澄夫 山田
Yuji Kojima
雄次 小島
Yoshiaki Fujiwara
嘉朗 藤原
Toshito Hara
原 敏人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12264282A priority Critical patent/JPS5913412A/en
Publication of JPS5913412A publication Critical patent/JPS5913412A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H2009/02165Tuning

Abstract

PURPOSE:To obtain an oscillator of high quality by incorporating and sealing an oscillation element and then adjusting the frequency of the sealed oscillation element from the external by laser trimming means. CONSTITUTION:A package consists of a glass tube 33 into which YAG laser is transmitted and a pair of terminal boards (external terminals) 34, 35 obtained by plating nickel on copper plates 34, 35. The oscillation element 32 is obtained by coating T-shaped electrode patterns 37, 38 on the opposed main surfaces of an LiTaO3 piezoelectric plate 36 and forming terminal electrodes 39, 40 like thick films on both end parts of the length direction. The oscillation element 32 is inserted into the glass tube 33 along its center axis without contacting with the glass tube 33 and the terminal electrodes 39, 40 of the element 32 are connected through a conductive bonding agent to the inside surfaces of terminal boards 34, 35 air-tightly jointed with the opening ends of the glass tube 33 through a bonding agent 41 for sealing. Consequently, prescribed high frequency field can be impressed to the electrode patterns 37, 38 through the terminal boards 34, 35 and the frequency adjustment of the sealed oscillation element 32 is executed by irradiating the YAG laser to the electrode patterns 7, 38 to remove a part of the patterns and reduce its mass.

Description

【発明の詳細な説明】 (a)  発明の技術分野 本発明は振動子のパッケージ構造、特に振動素子を内装
封止したのち外部よりレーザトリミング手段で周波数調
整が可能なパッケージ構造に関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a package structure for a vibrator, and more particularly to a package structure in which a vibrating element is internally sealed and then its frequency can be adjusted from the outside by laser trimming means.

(b)  技術の背景 氷晶やLiTaQ、等の圧電体に適当な電極パターンを
被着し、該電極パターンに交流電界を印加すると、圧電
体は印加電昇に等しい周波数の応力を生じ、かつ、印加
電界の周波数が圧電体の固有周波数に一致すると共振し
て強勢な振動が得られるようになる。
(b) Background of the technology When a suitable electrode pattern is applied to a piezoelectric material such as ice crystal or LiTaQ, and an alternating current electric field is applied to the electrode pattern, the piezoelectric material generates a stress with a frequency equal to the applied electric charge, and When the frequency of the applied electric field matches the natural frequency of the piezoelectric material, it resonates and produces strong vibrations.

かかる現象を利用した振動子は小型高性能であるため、
通信装置等の発振回路やフィルタとして広く用いられて
いるが、所望の共振周波数を得るだめの調整及び振動素
子を閉空間に保持するパッケージが必要となる。
Since the resonator that utilizes this phenomenon is small and has high performance,
Although it is widely used as an oscillation circuit or filter for communication devices, it requires adjustment to obtain a desired resonant frequency and a package that holds the vibrating element in a closed space.

(e)  従来技術と問題点 第1図と第2図は従来構成の代表的パッケージに振動素
子を内蔵した振動子の側断面、第3図はストリップ型振
動素子を説明するだめの図である。
(e) Prior art and problems Figures 1 and 2 are side cross-sections of a vibrator with a built-in vibrating element in a typical package with a conventional configuration, and Figure 3 is a diagram for explaining a strip-type vibrating element. .

第1図において、1はSIP形振動子、2は振動素子で
あシ、パッケージは1対のハーメチック端子3を設けた
基板4に金属ケース5を気密接合して構成され、素子2
の対向主面それぞれに破着された電極パターン6は、1
対のワイヤ7を介してそれぞれの端子3に接続されてい
る。
In FIG. 1, 1 is a SIP type vibrator, 2 is a vibrating element, the package is constructed by hermetically bonding a metal case 5 to a substrate 4 provided with a pair of hermetic terminals 3, and the element 2
The electrode pattern 6 torn on each of the opposing principal surfaces is 1
It is connected to each terminal 3 via a pair of wires 7.

第2図において、11はチップ形撮動子、12はストリ
ップ形振動素子であり、パッケージはセラミック基板1
3にセラミックケース14を気密接合して構成され、素
子12の対向主面それぞれに被着された電極パターン1
5は、素子12の一方の対向端部をそれぞれに形成され
た電極16と、基板13の表面に被着され7対向する電
極16を接続した1対の導体パターン17とを介して、
パッケージの外面に導出されている。
In FIG. 2, 11 is a chip type sensor, 12 is a strip type vibrating element, and the package is a ceramic substrate 1.
3 and a ceramic case 14 hermetically sealed, the electrode pattern 1 is adhered to each of the opposing main surfaces of the element 12.
5 connects one opposing end of the element 12 with electrodes 16 formed respectively, and a pair of conductor patterns 17 attached to the surface of the substrate 13 and connecting the 7 opposing electrodes 16.
Exposed to the outside of the package.

第3図において、イは斜視図、口は厚みすべり振動の大
きさを説明するだめの図であり、21はストリップ型振
動素子、22はLiTa0.単結晶のXri、よシ切9
串した圧電板、23は圧電板22の対向主面それぞれに
被着した電極パターンを示したものである。そして、厚
さがHの圧電板22は結晶X軸に垂直な面を主面とした
短冊形であり、非調和振動を無くするため幅全体にわた
り被着した長さtの電極パターン23に、高周波電界を
印加すると素子21はイ図の矢印方向へ厚みすベシ振動
を生じ、その大きさはロスの如く中央部(電極パターン
23の被着部)で最も大きく両端へ行くほど小さくなる
In FIG. 3, A is a perspective view, the opening is a diagram for explaining the magnitude of thickness-shear vibration, 21 is a strip type vibrating element, 22 is a LiTa0. Single crystal Xri, horizontal cut 9
The skewered piezoelectric plate 23 shows electrode patterns attached to each of the opposing main surfaces of the piezoelectric plate 22. The piezoelectric plate 22 with a thickness of H has a rectangular shape with the main surface perpendicular to the crystal X axis, and an electrode pattern 23 with a length t is attached to the entire width in order to eliminate anharmonic vibration. When a high frequency electric field is applied, the element 21 vibrates through its thickness in the direction of the arrow in FIG.

かかるJ辰動素子21(及び2.12)において、圧電
板22を切用し電極パターン23(及び6゜15)を形
成する等の作成技術のみにより、所望の周波数を得るこ
とは困難である。そのため、該周波数を調整するマス・
ローディング(massloading’)法には、め
っきや蒸着等の手段により電極パターンの質量を増加さ
せる方法と、YAGレーザ等を用いて電極パターンの質
量を低減させる方法がある。しかし、−従来は前記側れ
の方法で周波数調整するに拘わらず、パッケージへ封入
される以前に該調整を終了させる必要があシ、ケースを
気密接合したのちの周波数ずれが調整できないという欠
点があった。
It is difficult to obtain a desired frequency in such a J-dynamic element 21 (and 2.12) using only a manufacturing technique such as cutting out the piezoelectric plate 22 and forming the electrode pattern 23 (and 6° 15). . Therefore, the mass that adjusts the frequency
The loading (massloading') method includes a method in which the mass of the electrode pattern is increased by means such as plating or vapor deposition, and a method in which the mass of the electrode pattern is reduced by using a YAG laser or the like. However, in the past, even though the frequency was adjusted using the above-mentioned method, it was necessary to complete the adjustment before the case was sealed in the package, and there was a drawback that the frequency shift could not be adjusted after the case was hermetically sealed. there were.

(d)  発明の目的 本発明は、上記欠点を除去した高品質の振動子を提供す
るととである。
(d) Object of the Invention The present invention aims to provide a high-quality vibrator that eliminates the above-mentioned drawbacks.

(e)  発明の構成 上記目的は、YAGレーザが透過するガラス等にてなる
絶縁管に電界印加用電極パターンが被着され〆こ振動素
子を内蔵し、該絶縁管の両端部それぞれには該電極パタ
ーンに接続され該素子を保持する外部端子が気密接合さ
れ、該電極パターンが該絶縁管の長さ方向にほぼ沿うこ
とを特做とする振動子のパッケージ構造によυ達成され
る。
(e) Structure of the Invention The above object is to provide an insulated tube made of glass or the like through which a YAG laser passes through, an electrode pattern for applying an electric field is adhered thereto, a vertical vibration element is built in, and each end of the insulated tube has a corresponding one. This is achieved by a vibrator package structure in which an external terminal connected to the electrode pattern and holding the element is hermetically sealed, and the electrode pattern extends substantially along the length direction of the insulating tube.

(f)  発明の実施例 以下、図面を用いて本発明の詳細な説明する。(f) Examples of the invention Hereinafter, the present invention will be explained in detail using the drawings.

第4図は本発明の一実施例に係わるストリップ型振動子
の側断面図、第5図は前記振動子の分解斜視図、第6図
は第4図に示した端子板の変形例を示す側断面図、第7
図は本発明の他の一実施例に係わるス) IJツブ型型
動動子側断面図である。
4 is a side sectional view of a strip type vibrator according to an embodiment of the present invention, FIG. 5 is an exploded perspective view of the vibrator, and FIG. 6 is a modification of the terminal plate shown in FIG. 4. Side sectional view, 7th
The figure is a sectional side view of an IJ knob type moving element according to another embodiment of the present invention.

第4図及び第5図において、31は振由り子、32はス
トリップ型振動素子であり、パッケージはYAGレーザ
が透過するガラス管33と銅板にニッケルめっき等して
なる1対の端芋板(外部端子)34.35にて構成され
ている。振動素子32はLiTaO3圧電板36の対向
主面それぞれに丁字形電極パターン37と38が被着さ
れ、長さ方向両端部に端子電極39と40が厚膜形成さ
れている。
In FIGS. 4 and 5, 31 is a pendulum, 32 is a strip-type vibrating element, and the package is a glass tube 33 through which the YAG laser passes and a pair of nickel-plated copper plates. (External terminal) Consists of 34.35. In the vibrating element 32, T-shaped electrode patterns 37 and 38 are adhered to the opposing main surfaces of a LiTaO3 piezoelectric plate 36, respectively, and terminal electrodes 39 and 40 are formed as thick films at both lengthwise ends.

k7介してガラス管33の開口端に気密接合された端子
板34と35の内側面になよ、導電性接着利(例えば銀
ペースト)42を介して素子32の端子電極39と40
がそれぞれ接続されている。その結果、電極パターン3
7と38には、端子板34と35を介して所定の高周波
電界が印加可能でちゃい該密封された振動素子32の周
波数調整は、ガラス管33全通して電極パターン37及
び38にYAGレーザを照射してその一部を除去し、電
極パターン37と38の何れか一方又は双方の質量を低
減さぜることにより実行される。
Terminal electrodes 39 and 40 of the element 32 are attached to the inner surfaces of the terminal plates 34 and 35, which are hermetically sealed to the open end of the glass tube 33 via the conductive adhesive (for example, silver paste) 42.
are connected to each other. As a result, electrode pattern 3
A predetermined high frequency electric field can be applied to 7 and 38 via the terminal plates 34 and 35. The frequency of the sealed vibrating element 32 can be adjusted by applying a YAG laser to the electrode patterns 37 and 38 through the entire glass tube 33. This is carried out by removing a portion of the electrode patterns 37 and 38 by irradiation and reducing the mass of one or both of the electrode patterns 37 and 38.

第6図において、第4図の端子8i34及び35に置換
えて使用するφ:M子イ反(外部+Q子)45はキャッ
プ形であり、ガラス管(33)の開口端外側に嵌合させ
接着材(41)で気密接合される。従って、第4図の振
動子31にあっては振動素子32とガラス管33とをt
lは同じ長さに揃えなければならないが、端子#45を
使用することによりガラス管33は素子32よりもa−
短くてよく、ガラス管加工及び素子組立作業が容易とな
シ、ガラス管封止部強度を増大させる利点が生じる。
In FIG. 6, the φ:M terminal (external + Q terminal) 45 used in place of the terminals 8i and 35 in FIG. The material (41) is hermetically sealed. Therefore, in the vibrator 31 of FIG. 4, the vibrating element 32 and the glass tube 33 are
l must be the same length, but by using terminal #45, the glass tube 33 is shorter than the element 32.
It can be short, facilitates glass tube processing and device assembly work, and has the advantage of increasing the strength of the glass tube sealing portion.

第7図において、前出の振動素子32を内蔵した振動子
51のパッケージは、平面視長方形のセラミック基板5
2と、基板52の表面に気密接合され半円形断面の空洞
を形成するガラス蓋体53と、同じ長さの基板52と蓋
部τで構成する絶縁管の開口両端に封止用接着材56を
介してそれぞれ気密接合される1対の端子8i(外部端
子)54゜55にて構成されている。ただし、蓋体53
はYAGレーザが透過可能なガラスにてなり、ri1子
板54と55は銅板にニッケルめっきを施す等により耐
食処理した導電体であり、素子端子39と40は導電性
接着材57にて端子板54と55にそれぞれ接合されて
いる。
In FIG. 7, the package of the vibrator 51 containing the aforementioned vibrating element 32 is a ceramic substrate 5 which is rectangular in plan view.
2, a glass lid body 53 that is hermetically sealed to the surface of the substrate 52 to form a cavity with a semicircular cross section, and a sealing adhesive 56 at both ends of the opening of the insulating tube, which is composed of the substrate 52 and the lid portion τ having the same length. It is composed of a pair of terminals 8i (external terminals) 54 and 55 that are hermetically connected to each other through the terminals. However, the lid body 53
is made of glass through which the YAG laser can pass through, the ri1 daughter plates 54 and 55 are conductors that have been treated to resist corrosion by applying nickel plating to copper plates, etc., and the element terminals 39 and 40 are made of a terminal plate using a conductive adhesive 57. 54 and 55, respectively.

従って、素子32の電極パターン37及び38には端子
板54と55を介して所定の高周波電界が印加され、そ
の周波数調整はYAGレーザにより電標ハターン37の
質量を低減させて実行される。
Therefore, a predetermined high frequency electric field is applied to the electrode patterns 37 and 38 of the element 32 via the terminal plates 54 and 55, and the frequency adjustment is performed by reducing the mass of the electric standard pattern 37 using a YAG laser.

(g)  発明の詳細 な説明した如く本発明によれば、パッケージに封入され
た振動素子の周波数調整が可能となり、振動子を高品質
にした効果が顕著である。とともに、パッケージは従来
のものより安価な材料で構成され、実施例に示す如きチ
ップ形パッケージと実施例の端子板に外部リードを突出
形成させた如きSIP形パッケージと(は、準備する端
子板を変えて容易に選別作成できる効果がある。
(g) Detailed Description of the Invention According to the present invention, it is possible to adjust the frequency of the vibrating element enclosed in the package, and the effect of making the vibrator high quality is remarkable. At the same time, the packages are made of materials cheaper than conventional ones, and include a chip type package as shown in the example and an SIP type package such as the one in which external leads are formed protruding from the terminal plate of the example (hereinafter referred to as the terminal plate to be prepared). It has the effect of being easy to select and create by changing it.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来構成のSIP形振動子を示す側断面図、第
2図は従来構成のチップ形振動子を示す側断面図、第3
図はストリップ型振動素子を説明するための図、第4図
は本発明の一実施例に係わるストリップ型振動子の側断
面図、第5図は第4図に示した振動子の分解斜視図、第
6図は第4図に示した端子板の変形例を示す側断面図、
第7図は本発明の他の一実施例に係わるストリップ型振
動子の側断面図である。 ただし図中において、1,11.21.51は振動子、
2,12,22.32は振動素子、6゜15.23.3
’7.38は電極)くターン、33はガラス管(絶縁管
)、34,35,45,54゜55は端子e<外部端子
)、41.56は気密封止用接着材、42.57は導電
性接着材、52はセラミック基板、53はガラス蓋体を
示す。 晃1 図 イ 晃2図 1 is       f7 第3図 (4)   互 j (ロ) 第4躬 憲52 3ダ 第62      N7図
Figure 1 is a side sectional view showing a SIP type vibrator with a conventional configuration, Figure 2 is a side sectional view showing a chip type vibrator with a conventional configuration, and Figure 3 is a side sectional view showing a chip type vibrator with a conventional configuration.
The figure is a diagram for explaining a strip type vibrating element, Figure 4 is a side sectional view of a strip type vibrator according to an embodiment of the present invention, and Figure 5 is an exploded perspective view of the vibrator shown in Figure 4. , FIG. 6 is a side sectional view showing a modification of the terminal plate shown in FIG. 4,
FIG. 7 is a side sectional view of a strip type vibrator according to another embodiment of the present invention. However, in the figure, 1, 11, 21, 51 are vibrators,
2, 12, 22.32 are vibration elements, 6゜15.23.3
'7.38 is an electrode) turn, 33 is a glass tube (insulating tube), 34, 35, 45, 54゜55 is a terminal e<external terminal), 41.56 is an adhesive for airtight sealing, 42.57 52 represents a conductive adhesive, 52 represents a ceramic substrate, and 53 represents a glass lid. Akira 1 Diagram I Akira 2 Diagram 1 is f7 Diagram 3 (4) Mutual j (B) 4th Fukken 52 3rd Da 62 N7 Diagram

Claims (1)

【特許請求の範囲】[Claims] レーザ光が透過するガラス等にてなる絶縁管に電界印加
用電極パターンが被着された振動素子を内蔵し、該絶縁
管の両端部それぞれには該電極パターンに接続されI該
素子を保持する外部端子が気密接合され、該電極パター
ンが該絶縁管の長さ方向にほぼ沿うことを4?徴とする
振動子のパッケージ構造。
A vibrating element having an electrode pattern for applying an electric field attached thereto is built into an insulating tube made of glass or the like through which laser light can pass, and each end of the insulating tube is connected to the electrode pattern to hold the element. 4? Make sure that the external terminals are hermetically sealed and that the electrode pattern runs substantially along the length of the insulating tube. The characteristic package structure of the resonator.
JP12264282A 1982-07-14 1982-07-14 Package structure of oscillator Pending JPS5913412A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12264282A JPS5913412A (en) 1982-07-14 1982-07-14 Package structure of oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12264282A JPS5913412A (en) 1982-07-14 1982-07-14 Package structure of oscillator

Publications (1)

Publication Number Publication Date
JPS5913412A true JPS5913412A (en) 1984-01-24

Family

ID=14841016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12264282A Pending JPS5913412A (en) 1982-07-14 1982-07-14 Package structure of oscillator

Country Status (1)

Country Link
JP (1) JPS5913412A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6192019A (en) * 1984-10-11 1986-05-10 Matsushita Electric Ind Co Ltd Piezoelectric ceramic vibrator
JPS61199312A (en) * 1985-02-28 1986-09-03 Matsushita Electric Ind Co Ltd Ceramic oscillator
JPH01209810A (en) * 1988-02-17 1989-08-23 Matsushita Electric Ind Co Ltd Piezoelectric vibrator and fine adjustment method of its frequency

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193178A (en) * 1975-02-12 1976-08-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193178A (en) * 1975-02-12 1976-08-16

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6192019A (en) * 1984-10-11 1986-05-10 Matsushita Electric Ind Co Ltd Piezoelectric ceramic vibrator
JPS61199312A (en) * 1985-02-28 1986-09-03 Matsushita Electric Ind Co Ltd Ceramic oscillator
JPH01209810A (en) * 1988-02-17 1989-08-23 Matsushita Electric Ind Co Ltd Piezoelectric vibrator and fine adjustment method of its frequency

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