EP0111482A1 - Appareil d'ajustage de composants piezoelectriques - Google Patents

Appareil d'ajustage de composants piezoelectriques

Info

Publication number
EP0111482A1
EP0111482A1 EP82902309A EP82902309A EP0111482A1 EP 0111482 A1 EP0111482 A1 EP 0111482A1 EP 82902309 A EP82902309 A EP 82902309A EP 82902309 A EP82902309 A EP 82902309A EP 0111482 A1 EP0111482 A1 EP 0111482A1
Authority
EP
European Patent Office
Prior art keywords
housing
laser
electromagnetic energy
trimming
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP82902309A
Other languages
German (de)
English (en)
Other versions
EP0111482A4 (fr
Inventor
Roger Claes
Jean Vannoppen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Sylvania Inc
Original Assignee
GTE Products Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GTE Products Corp filed Critical GTE Products Corp
Publication of EP0111482A1 publication Critical patent/EP0111482A1/fr
Publication of EP0111482A4 publication Critical patent/EP0111482A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H13/00—Measuring resonant frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient

Definitions

  • the subject invention relates to the fabrication of piezoelectric components and, more particularly, to the frequency trimming of same.
  • piezoelectric materials that is materials characterized by an ability to transform elec ⁇ trical energy to mechanical energy, and vice versa, have widespread application in electronic equipment.
  • such materials are extensively used, for example, as resonators and filters and as such are required to exhi ⁇ bit stringent frequency response (accuracy and stability) characteristics.
  • both bulk and surface wave filters and resonators typically demand some degree of "trimming" to compensate for finite tolerances attribut ⁇ able to material and production variances.
  • quartz filters are typically comprised of two or more resonators arranged in various configurations.
  • the filters composite frequency response can be trimmed by adjusting the resonant frequency of the component resonators irrespective of whether the resonator are arranged as discrete blanks, stacked arrays or multi-resonator structures deposited on a single wafer.
  • FIG. 1 depicts a representative surface acoustic wave (SAW) filter including a number of interdigitated fingers (21), some of which (22), have been disconnected so as to achieve frequency trimming.
  • SAW surface acoustic wave
  • Such effects are posited to to have their origin in the thermal or mechanical stres ⁇ ses induced by moisture, changes in air pressure, and stray capacitance introduced by the encapsulation process. Because such phenomena are effectively inamenable to amelioration once the component has been sealed, it is necessary that they be anticipated and, to the extent predictable, accomodated during the trimming procedure. That is, the resonant frequency of the device is trimmed to a frequency offset by a predetermined amount from the desired frequency with the expectation that the final frequency, after encapulation, will be accurate.
  • an apparatus for trimming piezoelectric components of the type chracterized by a piezoelectric substrate upon which is depositied a conductive material includes a housing for the device at least a portion of which is substantially transparent to electromagnetic energy at a predetermined wavelength.
  • Laser means pro ⁇ vides energy at the predetermined wavelength and with sufficient intensity to evaporated the conductive mater ⁇ ial.
  • a test circuit coupled to the device monitors specific frequency-related characteristics and provides a corresponding output to a control system. The control system dictates the operation of a deflection system that
  • OMPI s V ⁇ p0 v_ * directs the electromagnetic energy provided by the laser means and a laser power control device that regulates the intensity of that energy.
  • Figure 1 depicts a typical quartz crystal filter including the quartz blank, frequency plating, and conductive electrodes.
  • Figure 2 depicts a representative SAW (Surface Acoustic Wave) filter including a number of interdigi- tated conductive fingers, some of which have been severed so as to achieve frequency trimming.
  • SAW Surface Acoustic Wave
  • Figure 3 illustrates an apparatus for effecting frequency trimming of an encapsualted piezoelectric component, for example, a quartz crystal resonator.
  • a quartz resonator including a quartz blank, con ⁇ ductive electrodes and a glass cover, especially amenable to laser trimming is illustrated in Figure 4.
  • OMPI in accordance with this invention, there is illus ⁇ trated in Figure 3 an apparatus for providing a frequency trimming of an encapulated piezoelectric component, be it a quartz crystal resonator, surface acoustic wave filter or similar device.
  • the device to be trimmed, 1, is in ⁇ serted in a test circuit 2 in such a manner that it is directed toward an optical beam 3 generated by Q-switched Nd-YAG laser 4.
  • the laser is a pulsed Nd-YAG type capa ⁇ ble of delivering a focused beam that will produce sufficient heat to evaporate metal from the electrodes of, for example, a quartz resonator.
  • the laser beam is appropriately directed by an X-Y deflection system 5 equipped with the necessary optical devices including, by way of illustration, a pair of optical mirrors 6.
  • the direction of the beam is controlled by a test system 7 that delivers control signals to the deflection system and to the laser power control 8.
  • the test system, power control and x-y deflection system operate to control the intensity and direction of the laserbeam so as to simul- taneously scan the surface of the device to be trimmed and to modulate the trimming rate as the resonant fre ⁇ quency (or some other specified characteristic frequency) approaches its final value.
  • a quartz resonator especially amenable to trimming is illustrated in Figure 4.
  • the resonator includes a quartz blank 41, electrodes 42 and a glass cover 43.
  • a salient feature of the resonator is the glass cover 43.
  • the cover is transparent to the optical energy generated by the laser so that the laserbeam is allowed to impinge on the electrodes of the resonator and thereby cause the evaporation of sufficient electrode mass to achieve trim ⁇ ming.
  • Such a quartz resonator may be fabricated according to the following technique.
  • the quartz crystal is conductively bonded to lead-in wires, that is to say, one electrode is electrically and physically connected to one of the lead-in wires and the other electrode is electri ⁇ cally and physically connected to the other lead-in wire.
  • the conductive bond may be made, for example, by electri- cally conductive bonding material, for example, silver- filled epoxy. Or it may be made by soldering, welding and the like.
  • the quartz crystal is then inserted into an open-ended glass tube of suitable diameter and length. The extremities of the lead-in wires protrude outside the glass tube and are secured in a suitable external holder to properly position the quartz crystal within the glass tube.
  • the end of the glass tube is then heated to its softening point and pressed together to seal the end by forming a press seal, the lead-in wires being embedded in the press seal.
  • the lead-in wires are of a type readily sealable to glass, for example, Dumet wire for sealing to soft glass.
  • Dumet comprises a nickel-iron core within a copper sheath.
  • the press seal solidifies and rigidly holds the lead-in wires and quartz crystal.
  • a circumferential section of the glass tube near the other end thereof is heated to its softening point and the end is then drawn apart from the main body of the glass tube to form a necked-down portion in the glass tube.
  • the necked-down portion which is of smaller diameter than the glass tube and is suitable as an exhaust tubulation to exhaust, tipoff and seal the glass tube with the quartz crystal therewithin.
  • the exhaust tubulation may be tipped off under vacuum, to maintain a vacuum within the glass tube.
  • an inert gas for example, dry nitrogen, may be introduced into the glass tube prior to tip-off of the exhaust tube.
  • a cooling gas e.g.
  • OMPI nitrogen may be flowed into the glass tube during the sealing steps in order to cool the quartz crystal and prevent it from being heated above the curie point of the quartz material.
  • Figure 4 shows one embodiment of an encapsulated quartz crystal in accordance with this invention.
  • the quartz crystal comprises a flat circular disk about 8mm in diameter by 0.5mm thick.
  • the metallized portion of each surface is about 6mm in diameter.
  • Lead-in wires are made of Dumet, 0.35mm thick, and are fastened to the electrodes.
  • a glass tube is 11mm outside diameter by 20mm long (internal length).
  • a press seal about 9mm wide by about 7mm long and is about 2.5mm thick. After exhausting and filling with nitrogen, the glass tube is sealed at tip-off.
  • the lead-in wires can be embedded in glass bead prior to press sealing in order to bend and hold the wires in the correct position for fast ⁇ ening the crystal.
  • the glass tube be flattened into, say a flat sub- stantially rectangular, as opposed to circular shape, in order to reduce the size of the glass tube or in order to accommodate a rectangular quartz crystal.
  • the open-ended round glass tube would be heated and flattened prior to mounting of the quartz crystal/lead-in wire assembly therein. After embedment of said assembly in a press seal at one end of the flatened glass tube, the other end could also be sealed by a press seal with ⁇ out the need of an exhaust tubulation.
  • nitrogen for example, could be introduced into the interior of the flattened glass tube by means of a small diameter hollow metal needle inserted therein while the glass was heated to its softened point. At the proper time, the needle would be removed and the press seal made immediately, thereby providing the desired nitrogen fill within the glass tube.
  • OMPI ⁇ tfNATlC-$> The technique described above results in a resonator entirely enclosed by glass.
  • the reso ⁇ nator may be enclosed by a standard metal cover which has been provided with a glass window as shown in Figure 5.
  • the window 51 may be comprised of any otherwise suitable material transparent to energy at the laserbeam wave ⁇ length. (In a particular embodiment this wavelength was 1.06 micrometers.)
  • the window may be preferrably disc ⁇ shaped and susceptible to attachment to the metal cover 52 by, for example, glue or a glass-to-metal seal. The diameter of the disc-shaped window should be large enough so that the laserbeam is allowed to impinge on substan ⁇ tially the entire electrode surface.
  • a SAW structure such as the one illustrated in Figure 6 is amenable to the laser trimming technique described herein.
  • the trimming technique and implementing apparatus have been found to offer numerous significant advantages in the area fabrication and trimming of piezoelectric components. To wit: The post-encapsulation trimming of those devices permits less stringent handling procedures resulting in fewer rejected parts. Avoidance of the pre- encapsulation offset trimming technique provides more precise trimming and a closer approach to the desired ultimate frequency characteristics of the device.
  • the post-encapsulation trim- ming technique allows the encapsulated device to be stored for a period of time before the final trimming procedure is performed.
  • This is decidedly an advantage because of the "aging" effect characteristics of such device. That is to say, a large portion of the total frequency shift of the device is found to occur within a relative short period after fabrication.
  • the effects of this "short term" aging can be accordingly circumvented.
  • the total long-term frequency drift i.e., the total drift after a period on the order of one year
  • the total long-term frequency drift can be expeced to be reduced from approximate 10 ppm (parts per million) when trimmed before encapsulation to about 3 ppm when trimmed subsequent encapsulation.
  • the subject invention is useful in the fabrication of frequency selective piezoelectric devices.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

Appareil d'ajustage de composants piézoélectriques du type caractérisé par un substrat piézoélectrique (41) sur lequel est déposé un matériau conducteur (42). L'appareil comprend un boîtier (52) pour le dispositif dont au moins une partie (51) est sensiblement transparente à l'énergie électromagnétique à une longueur d'onde prédéterminée. Un laser (4) fournit de l'énergie à la longueur d'onde prédéterminée et avec une intensité suffisante pour produire l'évaporation du matériau conducteur. Un circuit de test couplé (2) au dispositif contrôle les caractéristiques spécifiques liées à la fréquence et envoie un signal de sortie correspondant à un système de commande (7). Le système de commande (7) détermine le fonctionnement d'un système de déviation qui dirige l'énergie électromagnétique fournie par le laser (4) et d'un dispositif de commande de la puissance du laser (8) qui règle l'intensité de cette énergie.
EP19820902309 1982-06-14 1982-06-14 Appareil d'ajustage de composants piezoelectriques. Withdrawn EP0111482A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1982/000822 WO1984000081A1 (fr) 1982-06-14 1982-06-14 Appareil d'ajustage de composants piezoelectriques

Publications (2)

Publication Number Publication Date
EP0111482A1 true EP0111482A1 (fr) 1984-06-27
EP0111482A4 EP0111482A4 (fr) 1986-12-01

Family

ID=22168044

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19820902309 Withdrawn EP0111482A4 (fr) 1982-06-14 1982-06-14 Appareil d'ajustage de composants piezoelectriques.

Country Status (2)

Country Link
EP (1) EP0111482A4 (fr)
WO (1) WO1984000081A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108548656A (zh) * 2018-03-29 2018-09-18 昂纳信息技术（深圳）有限公司 一种用于to-can激光器的测试装置和测试系统

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI78782C (fi) * 1986-01-10 1989-09-11 Valmet Oy Foerfarande foer framstaellning av ett piezoresistivt motstaondselement samt en anordning som tillaempar foerfarandet och en med foerfarandet framstaelld givare speciellt en tryckgivare eller motsvarande.
GB2199985B (en) * 1986-12-22 1991-09-11 Raytheon Co Surface acoustic wave device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3768157A (en) * 1971-03-31 1973-10-30 Trw Inc Process of manufacture of semiconductor product
US3766616A (en) * 1972-03-22 1973-10-23 Statek Corp Microresonator packaging and tuning
US3840804A (en) * 1973-05-21 1974-10-08 F Sauerland Crystal frequency monitor
US3913195A (en) * 1974-05-28 1975-10-21 William D Beaver Method of making piezoelectric devices
US4021898A (en) * 1976-05-20 1977-05-10 Timex Corporation Method of adjusting the frequency of vibration of piezoelectric resonators
US4154530A (en) * 1977-12-22 1979-05-15 National Semiconductor Corporation Laser beam error correcting process
US4131484A (en) * 1978-02-13 1978-12-26 Western Electric Company, Inc. Frequency adjusting a piezoelectric device by lasering
JP3130373B2 (ja) * 1992-06-09 2001-01-31 川研ファインケミカル株式会社 洗浄剤組成物

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No relevant documents have been disclosed. *
See also references of WO8400081A1 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108548656A (zh) * 2018-03-29 2018-09-18 昂纳信息技术（深圳）有限公司 一种用于to-can激光器的测试装置和测试系统
CN108548656B (zh) * 2018-03-29 2021-08-03 昂纳信息技术（深圳）有限公司 一种用于to-can激光器的测试装置和测试系统

Also Published As

Publication number Publication date
EP0111482A4 (fr) 1986-12-01
WO1984000081A1 (fr) 1984-01-05

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