Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
  • B29C70/003—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised by the matrix material, e.g. material composition or physical properties
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B38/00—Ancillary operations in connection with laminating processes
  • B32B38/0036—Heat treatment
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
  • C08K7/02—Fibres or whiskers
  • C08K7/04—Fibres or whiskers inorganic
  • C08K7/14—Glass
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/032—Organic insulating material consisting of one material
  • H05K1/0333—Organic insulating material consisting of one material containing S
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
  • B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
  • B29K2309/08—Glass
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
  • B32B2262/10—Inorganic fibres
  • B32B2262/101—Glass fibres
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/08—PCBs, i.e. printed circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
  • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
  • H05K2201/0203—Fillers and particles
  • H05K2201/0242—Shape of an individual particle
  • H05K2201/0251—Non-conductive microfibers

Definitions

• This invention relates to a reinforced polyphenylene sulfide (hereinafter referred to as "PPS" for brevity) molded board which is excellent in the mechanical I properties such as the impact resistance and the thermal properties such as the heat distortion temperature and solder resistance, and which provides a very strong adhesion to a metallic foil even without using an adhesive.
• PPS polyphenylene sulfide
• This invention also relates to a printed circuit board comprising such a reinforced PPS molded board as an insulating substrate, and a process for preparing this printed circuit board with ease and at low costs.
• So-called printed circuit boards comprising an insulating substrate and a conductor composed of a metallic foil such as a copper foil, which is flatly bonded onto the substrate, are used in large quantities for electric circuits in various household electric appliances, electronic computers, communication facilities and various meters and instruments.
• thermosetting resin such as an epoxy resin, a phenol resin or an unsaturated polyester resin
• base sheet composed of paper, glass fibers or synthetic fibers.
• These composite sheets are prepared by a process wherein a base sheet composed of paper, glass fibers or synthetic fibers is coated or impregnated with a resin solution so-called "varnish", which is formed by dissolving a thermosetting resin in a solvent; the coated or impregnated base sheet is heated in a drier, thereby to vaporize the solvent in the varnish and remove the solvent and to effect polymerization of the resin to form a prepreg of the so-called B-stage; a predetermined number of the so-formed prepregs are superposed upon another and compressed under heating to cure the resin.
• a resin solution so-called "varnish" which is formed by dissolving a thermosetting resin in a solvent
• the coated or impregnated base sheet is heated in a drier, thereby to vaporize the solvent in the varnish and remove the solvent and to effect polymerization of the resin to form a prepreg of the so-called B-stage; a predetermined number of the so-formed prepregs are
• thermoplastic resin such as polyethylene, polytetrafluoroethylene or polyphenylene oxide may also be used as the insulating substrate for a printed circuit board.
• thermoplastic resins can provide printed circuit boards which are satisfactorily balanced among the thermal properties, the mechanical properties, the chemical resistance and the manufacturing costs.
• JP-A Japanese Patent Laid-open Application
• JP-A Japanese Patent Laid-open Application
• JP-A Japanese Patent Laid-open Application
• No. 85,380/79 proposes a printed circuit board comprising as an insulating substrate a molded board comprising PPS, which is excellent by itself in the heat resistance, the chemical resistance, the electric properties and the flame retardancy, and glass fibers (hereinafter referred to as "GF" for brevity) having a length smaller than 3 mm, and a metallic foil bonded to said substrate through an epoxy type adhesive.
• this printed circuit board is poor in the mechanical properties and is especially poor in the resistance to the soldering operation indispensable for processing and attachment of the printed circuit board, that is, the solder resistance.
• the process for preparing this printed circuit board involves various complicated steps such as the steps of mixing PPS with GS , the melt-kneading step, the injection molding step, the adhesive-coating step and the metal foil-bonding step, and the obtained printed circuit board is very expensive.
• Another object of the present invention is to provide a process for preparing the above-mentioned excellent printed circuit board at low costs by simplified process steps.
• a reinforced polyphenylene sulfide molded board comprising, based on the weight of the molded board, 20 to 85% by weight of polyphenylene sulfide and 15 to 80% by weight of glass fibers having a length of at least 5 mm.
• a printed circuit board comprising as an insulating substrate a glass fiber--reinforced polyphenylene sulfide molded board comprising, based on the weight of the molded board, 20 to 85% by weight of polyphenylene sulfide having a degree of crystallinity of at least 40% and 15 to 80% by weight of glass fibers having a length of at least 5 mm, and a metallic foil bonded to the surface of said insulating substrate.
• a process for the preparation of printed circuit boards which comprises compressing under heating a mixture or laminate comprising 20 to 85% by weight of polyphenylene sulfide and 15 to 80% by weight of glass fibers having a length of at least 5 mm to form a composite molded board, and, at or after the compression step, bonding a metallic foil to the surface of the molded board.
• the printed circuit board of the present invention is prepared from PPS and GF without subjecting the mixture of PPS and GF to the melt-kneading step, the process steps can be simplified, and since GF contained in the obtained printed circuit board retains a length of at least 5 mm, the reinforcing efficiency is high and the mechanical properties such as the impact resistance are very high. Furthermore, the printed circuit board of the present invention is excellent in the solder resistance over the conventional printed circuit board comprising as an insulating substrate a PPS molded board comprising GF having a length smaller than 3 mm, and therefore, an effect of providing a high adhesion between the substrate and metallic foil without using an adhesive can be attained according to the present invention.
• PPS that is used in the present invention is a polymer comprising at least 90 mol %, preferably at least 95 mol %, of repeating units represented by the structural formula
• PPS that is used in the present invention may comprise up to.10 mol % of repeating units represented by the structural formula:
• PPS used in the present invention should have a melt viscosity of 50 to 50,000 poises, especially 100 to 5,000 poises, as determined at a temperature of 300°C and an apparent shear rate of 200 sec -1 . If the melt viscosity is lower than 50 poises, satisfactory mechanical strength and impact resistance cannot be obtained. If the melt viscosity is higher than 50,000 poises, when GF is combined with PPS, voids among GF are not sufficiently filled with PPS and attainment of the desired mechanical strength cannot be expected.
• ordinary additives such as an antioxidant, a heat stabilizer, a lubricant, a crystal nucleating agent, an ultraviolet absorber, a coloring agent, a filler and a parting agent may be incorporated into PPS used in the present invention. Furthermore, a small amount of other polymer may be blended in PPS used in the present invention, so far as attainment of the objects of the present invention is not inhibited.
• GF used in the present invention is not particularly limited, so far as the length of GF is at least 5 mm.
• GF may be used in the form of a chopped fiber, a chopped fiber mat, a continuous filament mat, a woven fabric, a knitted fabric or a combination of two or more of them.
• the degree of crystallinity of the PPS matrix in the insulating substrate be at least 40%, especially at least 50%. This degree of crystallinity is important in the case where the glass fiber-reinforced PPS molded board is used as an insulating substrate of a printed circuit board. This is because, if the degree of crystallinity is lower than 40%, deformation is large under heating and the heat resistance is insufficient. It is preferred that the degree of crystallinity be not i pore than about 75%. If the degree of crystallinity exceeds about 75 % , a substantially long period of time is necessary for crystallization.
• the length of GF is shortened to less than 3 mm, particularly less than 0.5 mm, by a shearing force imposed at the melt-kneading or injection molding step, and therefore, the resulting molded board becomes poor in impact strength, and comes to have anisotropic characteristics and readily warp.
• the printed circuit board prepared according to the simplified process of the present invention has excellent thermal and mechanical properties and a good solder resistance, and therefore, application of this printed circuit board to electric and electronic industries is very promising.

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• Chemical & Material Sciences (AREA)
• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Mathematical Physics (AREA)
• Composite Materials (AREA)
• Mechanical Engineering (AREA)
• Health & Medical Sciences (AREA)
• Thermal Sciences (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Laminated Bodies (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Reinforced Plastic Materials (AREA)

Priority Applications (2)

Applications Claiming Priority (1)

Publications (2)

Family

ID=8189692

Family Applications (1)

Country Status (2)

Cited By (4)

Citations (3)

• 1982
  • 1982-06-04 DE DE8282302887T patent/DE3273422D1/de not_active Expired
  • 1982-06-04 EP EP82302887A patent/EP0096122B1/fr not_active Expired

Patent Citations (3)

Non-Patent Citations (1)

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