EP0059272B1 - Kryogene Kühlvorrichtung mit verbesserter thermischer Verbindung - Google Patents

Kryogene Kühlvorrichtung mit verbesserter thermischer Verbindung Download PDF

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Publication number
EP0059272B1
EP0059272B1 EP19810200646 EP81200646A EP0059272B1 EP 0059272 B1 EP0059272 B1 EP 0059272B1 EP 19810200646 EP19810200646 EP 19810200646 EP 81200646 A EP81200646 A EP 81200646A EP 0059272 B1 EP0059272 B1 EP 0059272B1
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EP
European Patent Office
Prior art keywords
probe
cooled
cooling device
heel
cryostat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP19810200646
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English (en)
French (fr)
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EP0059272A1 (de
Inventor
Gérard Jaecques
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABG Semca SA
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ABG Semca SA
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Filing date
Publication date
Application filed by ABG Semca SA filed Critical ABG Semca SA
Publication of EP0059272A1 publication Critical patent/EP0059272A1/de
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25J—LIQUEFACTION, SOLIDIFICATION OR SEPARATION OF GASES OR GASEOUS OR LIQUEFIED GASEOUS MIXTURES BY PRESSURE AND COLD TREATMENT OR BY BRINGING THEM INTO THE SUPERCRITICAL STATE
    • F25J1/00—Processes or apparatus for liquefying or solidifying gases or gaseous mixtures
    • F25J1/02—Processes or apparatus for liquefying or solidifying gases or gaseous mixtures requiring the use of refrigeration, e.g. of helium or hydrogen ; Details and kind of the refrigeration system used; Integration with other units or processes; Controlling aspects of the process
    • F25J1/0243—Start-up or control of the process; Details of the apparatus used; Details of the refrigerant compression system used
    • F25J1/0257—Construction and layout of liquefaction equipments, e.g. valves, machines
    • F25J1/0275—Construction and layout of liquefaction equipments, e.g. valves, machines adapted for special use of the liquefaction unit, e.g. portable or transportable devices
    • F25J1/0276—Laboratory or other miniature devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface

Definitions

  • the invention relates to a cryogenic cooler, of the type comprising a probe provided with a cooled end by expansion of a gas; it particularly targets chillers operating in a closed circuit following the thermodynamic cycles of Stirling, Gifford, Vuileumeum, Brayton or Joule-Thomson.
  • coolers are used to cool a sample, in particular one or more infrared detectors, and to keep it at a very low temperature, for example of the order of 70 ° to 80 ° K (Kelvin degree). It is preferable to use a vacuum jacketed cryostat in which the sample is fixed, so that this sample and the cryostat form an independent unit with respect to the probe, which can be separated from the latter without having to redo the vacuum at each installation.
  • the sample being located in the double envelope of the cryostat, it is necessary in this type of device to ensure a thermal connection between the cooled end of the probe and the interior envelope of the cryostat on which the sample is fixed.
  • the inner envelope of the cryostat is formed by a cylindrical wall closed by a circular bottom below which the sample is fixed, and all the solutions used consisted in making a thermal connection between the cooled end of the probe and the bottom inner envelope circular; however, none of these solutions is entirely satisfactory, each having specific faults which are summarized below.
  • a first solution (US patent 4194119) consists in placing a metal spring between the cooled end of the probe and the bottom of the envelope; however, the thermal transmission obtained is very poor due to the small thermal conduction section and the reduced surface contacts between the spring and the two elements which it connects.
  • Another solution consists in stuffing the space between the cooled end of the probe and the bottom of the envelope by means of metal flakes, metal sponges or equivalent material. This solution is impractical and the placement of the material is a delicate operation; in addition, each time the probe is dismantled (relative to the cryostat), these elements must be carefully cleaned, the material ensuring the thermal connection being changed each time.
  • Another solution consists in placing between the cooled end of the probe and the bottom of the envelope a soft metal pellet, which is crushed between these two elements; however, this type of device is unable to allow significant longitudinal expansions of the probe and can only operate in a narrow temperature range; in addition, the parts forming the probe and the internal envelope of the cryostat must be machined with very small tolerances so that the assembly can be carried out correctly.
  • the longitudinal vibrations of the probe are directly transmitted to the envelope of the cryostat and therefore to the sample, which constitutes a very serious defect in the case where the sample is formed by infrared detectors.
  • the crushed soft metal pellet causes the formation of incrustations in the probe and the envelope, and the cleaning of these elements is difficult to carry out with each disassembly, the soft metal pellet being generally to be changed.
  • Another solution consists in fixing the probe in the cryostat by means of a spring device which maintains the end of the probe directly in support against the bottom of the internal envelope (with possibly presence of a grease or 'a varnish).
  • This solution has the disadvantage of leading to greater mechanical complexity; moreover, it does not eliminate the defect of the previous solution, relating to the transmission of longitudinal vibrations from the probe to the sample.
  • the present invention proposes to provide a solution to the problem of thermal bonding of cryogenic coolers, which is free from the defects of traditional solutions and gives complete satisfaction.
  • An object of the invention is in particular to provide a cryogenic cooler benefiting from a good quality thermal bond between the cooled end of the probe and the envelope of the cryostat on which the sample is fixed.
  • Another object of the invention is to provide a cryogenic cooler, the probe of which can be easily mounted in the cryostat or disassembled relative thereto, without having to change any element or to carry out any cleaning.
  • Another essential objective of the invention is to avoid any transmission of longitudinal vibrations between the probe and the sample.
  • Another objective is to allow operation of the cooler over a wide temperature range.
  • Another objective is to provide a cryogenic cooler which achieves the preceding objectives, while being simple in structure and allowing wide manufacturing tolerances for the probe and the cryostat.
  • the term “longitudinal” designates the direction extending along the probe or the cryostat, parallel to the axis of these elements, and the term “radial” designates a perpendicular direction going from the axis from the probe to the periphery or vice versa.
  • said part preferably comprises a plurality of longitudinal slots distributed over its periphery with the exception of its heel.
  • the invention provides a thermal connection between the cooled end of the probe and the cylindrical wall of the cryostat, the connection piece or pieces being in abutment against this cylindrical wall and fixed on the probe.
  • the contact of the thermal connection part (s) with the cryostat and the probe made by a plurality of contact surfaces or by an extended contact surface, while the conduction section extending along a cylinder may be of dimension important, so that the invention makes it possible to achieve excellent thermal performance and to obtain a very small temperature difference between the cooled end of the probe and the sample.
  • the probe and the thermal connection piece or pieces attached to it are free longitudinally since these pieces simply come to bear against the cylindrical wall of the cryostat: the probe is therefore free to deform longitudinally, which allows operation cooler in a wide temperature range; in addition, the manufacturing tolerances are very wide, both in the longitudinal and radial directions (since the support of the thermal connection part (s) is produced by the radial elasticity of the latter without contact with the internal bottom of the cryostat) ; moreover, the longitudinal vibrations of the probe are not transmitted to the sample due in particular to this absence of contact between the probe and the bottom of the internal envelope of the cryostat.
  • the cryogenic cooler shown schematically by way of example in FIG. 1 comprises two separate assemblies 1 and 2 connected by a connecting tube 3.
  • the assembly 1 can be a motor-compressor group or a motor-oscillator group, suitable for generating a flow of gas under pressure or a pressure oscillation in the tube 3.
  • the assembly 2 comprises a probe shown diagrammatically at 4 (per se well known), comprising a cooled end 5 in which an expansion of the cold producing gas takes place.
  • This probe is fixed by conventional fixing means (not shown) on a cryostat 6 formed by an external envelope 7 and an internal envelope 8 between which a high vacuum is produced.
  • the internal envelope 8 is constituted by a cylindrical wall 8a and by a circular bottom 8b; the cooled end 5 of the probe is housed in the casing 8 in the vicinity of the bottom 8b.
  • a sample to be cooled for example one or more infrared detectors 9, is bonded under the bottom 8b between the two envelopes of the cryostat.
  • thermal connection piece 10 which has been shown in perspective on an expanded scale in FIG. 2, is fixed to the cooled end 5 of the probe.
  • This part made of metal which is a good conductor of heat such as copper, brass, aluminum, etc. comprises a fixing heel 11 which makes it possible to fix it on the cooled end 5 and support tabs such as 12 separated by slots longitudinal such as 13, which have radial elasticity.
  • the support heel 11 is adapted to be fixed on the end 5 of the probe with an extended surface contact.
  • the heel 11 has the shape of a flat disc applied and glued against the flat bottom 5a.
  • Each support tongue 12 has a support surface in the form of a cylinder portion and is radially projecting relative to the heel 11 so as to come to bear against the cylindrical wall 8a of the casing 8, without contact with the background 8b.
  • the part 10 thus achieves a thermal connection with the internal envelope 8 by a plurality of contacts distributed around its periphery. If necessary, the quality of these contacts can be increased by covering the contact surfaces of the tabs with a viscous product (good conductive grease, etc.).
  • the thermal connection piece 10 slides by the effect of its radial elasticity along the cylindrical wall 8a of the cryostat without any difficulty in positioning.
  • Fig. 3 shows a variant of connecting piece 14 in which the heel 15 has the same diameter as the circular flat bottom of the probe and is bonded over the entire surface of the latter to increase the surface contact between these elements.
  • the tongues 16 radially project in abutment against the cylindrical wall thanks to an external excess thickness which they present.
  • Fig. 4 shows another variant in which the cooled end of the probe comprises a head 5b of reduced diameter; the connecting piece 17 has a perforated heel 18 which is adapted to engage around this head.
  • the head is smooth and the heel 18 is glued around it.
  • the head 5c is full and threaded around its periphery, and the heel 19 of the connecting piece is tapped and screwed onto this head.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Radiation Pyrometers (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)

Claims (8)

1. Tiefsttemperatur-Kühlvorrichtung, vom Typ mit einer Sonde (4), die ein durch Entspannung eines Gases gekühltes Ende (5) aufweist, das durch einen Boden (5a) geschlossen ist, einem Kryostat (6) mit doppelwandiger evakuierter Hülle, deren durch eine zylindrische Wandung (8a) und durch einen Boden (8b) geschlossene Innenhülle (8) so ausgebildet ist, daß sie das gekühlte Ende (5) der Sonde enthalten kann, einer zu kühlenden Probe (9), insbesondere ein oder mehrere Infrarotdetektoren, die in der Doppelhülle des Kryostats auf dem Boden (8b) der Innenhülle befestigt sind, und einem gut wärmeleitenden thermischen Verbindungsteil (10), das in dem freien Raum zwischen dem genannten Boden (5a) der Sonde und dem Boden (8b) der Innenhülle (8) des Kryostats angeordnet ist, wobei die Tiefsttemperatur-Kühlvorrichtung dadurch gekennzeichnet ist, daß das thermische Verbindungsteil:
a) einteilig ist,
b) einen zentralen Befestigungsabsatz (11) besitzt, durch den es auf dem Boden (5a) befestigt ist, welcher das Ende der Sonde verschließt,
c) eine allgemein rotationssymmetrische Form um die Längsachse der Sonde aufweist, die geeignet ist, um ihm eine radiale Eigenelastizität zu verleihen,
d) mit Umfangsflächen versehen ist, die unter der Wirkung der genannten Elastizität gegen die zylindrische Wandung (8a) der Innenhülle abgestützt sind, und zwar am Umfang des genannten freien Raumes zwischen dem Boden (5a) der Sonde und dem Boden (8b) der Innenhülle des Kryostats.
2. Tiefsttemperatur-Kühlvorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß das thermische Verbindungsteil eine Mehrzahl von Längsschlitzen (13) besitzt, die über seinen Umfang mit Ausnahme seines Absatzes (11) verteilt sind, um ihm die genannte radiale Elastizität zu verleihen.
3. Tiefsttemperatur-Kühlvorrichtung nach Anspruch 1 oder 2, bei welcher die Sonde (4) ein gekühltes Ende (5) besitzt, welches durch einen kreisrunden flachen Boden (5a) verschlossen ist, dadurch gekennzeichnet, daß das thermische Verbindungsteil (10, 14) auf diesem flachen Boden (5a) über seinen Absatz (11, 15) in Form einer flachen Scheibe befestigt ist, welche gegen diesen flachen Boden angelegt ist.
4. Tiefsttemperatur-Kühlvorrichtung nach Anspruch 3, dadurch gekennzeichnet, daß der die Form einer flachen Scheibe aufweisende Absatz (11, 15) gegen den flachen Boden (5a) des gekühlten Endes (5) der Sonde geklebt ist.
5. Tiefsttemperatur-Kühlvorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Sonde (4) ein gekühltes Ende (5) umfaßt, dessen Boden die Form eines Kopfstücks (5b, 5c) verminderten Durchmessers aufweist, wobei das thermische Verbindungsteil einen mit einer Aussparung versehenen Absatz (18,19) aufweist, der an das genannte Kopfstück angepaßt und um dieses herum aufgesetzt ist.
6. Tiefsttemperatur-Kühlvorrichtung nach Anspruch 5, dadurch gekennzeichnet, daß das Kopfstück (5c) des gekühlten Endes (5) mit Gewinde versehen ist und der Absatz (19) des Verbindungsteiles ein Gewinde aufweist und darauf aufgeschraubt ist.
7. Tiefsttemperatur-Kühlvorrichtung nach Anspruch 5, dadurch gekennzeichnet, daß der Absatz (18) des Teiles um das Kopfstück (5b) des gekühlten Endes (5) herum angeklebt ist.
8. Tiefsttemperatur-Kühlvorrichtung nach einem der vorstehenden Ansprüche, bei welcher das thermische Verbindungsteil aus gut wärmeleitfähigem Metall gebildet ist.
EP19810200646 1981-02-26 1981-06-12 Kryogene Kühlvorrichtung mit verbesserter thermischer Verbindung Expired EP0059272B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8104070 1981-02-26
FR8104070A FR2500581A1 (fr) 1981-02-26 1981-02-26 Refroidisseur cryogenique a liaison thermique perfectionnee

Publications (2)

Publication Number Publication Date
EP0059272A1 EP0059272A1 (de) 1982-09-08
EP0059272B1 true EP0059272B1 (de) 1984-08-29

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EP19810200646 Expired EP0059272B1 (de) 1981-02-26 1981-06-12 Kryogene Kühlvorrichtung mit verbesserter thermischer Verbindung

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EP (1) EP0059272B1 (de)
DE (1) DE3165767D1 (de)
FR (1) FR2500581A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4514204A (en) * 1983-03-21 1985-04-30 Air Products And Chemicals, Inc. Bakeable cryopump
FR2613046B1 (fr) * 1987-03-23 1989-06-23 Abg Semca Refroidisseur cryogenique
FR2699263B1 (fr) * 1992-12-15 1995-01-27 Cryotechnologies Refroidisseur muni d'un doigt froid équipé d'un coupleur thermique.
GB2297844A (en) * 1995-02-10 1996-08-14 Oxford Magnet Tech Flexible thermal connectors for a superconducting MRI magnet
US6070414A (en) * 1998-04-03 2000-06-06 Raytheon Company Cryogenic cooler with mechanically-flexible thermal interface
US6604366B1 (en) * 2002-09-19 2003-08-12 Raytheon Company Solid cryogen cooling system for focal plane arrays
CN102538551A (zh) * 2012-01-20 2012-07-04 中国科学院上海技术物理研究所 一种用于空间制冷机大冷量传输的圆柱型柔性冷链

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3435137A (en) * 1965-06-14 1969-03-25 Us Navy Infrared camera tube utilizing a superconductor material detector
US3306075A (en) * 1965-10-04 1967-02-28 Hughes Aircraft Co Thermal coupling structure for cryogenic refrigeration
FR1468862A (fr) * 1965-10-21 1967-02-10 Air Liquide Réfrigérateur miniature; notamment pour détecteur quantique
US3693374A (en) * 1970-11-18 1972-09-26 Honeywell Inc Variable temperature cooling apparatus
US3807188A (en) * 1973-05-11 1974-04-30 Hughes Aircraft Co Thermal coupling device for cryogenic refrigeration
US4194119A (en) * 1977-11-30 1980-03-18 Ford Motor Company Self-adjusting cryogenic thermal interface assembly

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FR2500581B1 (de) 1983-12-09
EP0059272A1 (de) 1982-09-08
DE3165767D1 (en) 1984-10-04
FR2500581A1 (fr) 1982-08-27

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