EP0285491B1 - Tiefsttemperaturkälteanlage - Google Patents

Tiefsttemperaturkälteanlage Download PDF

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Publication number
EP0285491B1
EP0285491B1 EP88400648A EP88400648A EP0285491B1 EP 0285491 B1 EP0285491 B1 EP 0285491B1 EP 88400648 A EP88400648 A EP 88400648A EP 88400648 A EP88400648 A EP 88400648A EP 0285491 B1 EP0285491 B1 EP 0285491B1
Authority
EP
European Patent Office
Prior art keywords
base
probe
cryostat
thermal connection
connection piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP88400648A
Other languages
English (en)
French (fr)
Other versions
EP0285491A1 (de
Inventor
Henri Cremont
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABG Semca SA
Original Assignee
ABG Semca SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ABG Semca SA filed Critical ABG Semca SA
Priority to AT88400648T priority Critical patent/ATE79949T1/de
Publication of EP0285491A1 publication Critical patent/EP0285491A1/de
Application granted granted Critical
Publication of EP0285491B1 publication Critical patent/EP0285491B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface

Definitions

  • the invention relates to a cryogenic cooler, of the type comprising a probe provided with an end cooled by expansion of a gas; it particularly targets chillers operating in a closed circuit following the thermodynamic cycles of Stirling, Gifford, Vuilleumier, Brayton or Joule-Thomson.
  • coolers are used to cool a sample, in particular one or more infrared detectors, and to keep it at a very low temperature, for example of the order of 70 ° to 80 ° K (Kelvin degree).
  • a vacuum jacketed cryostat is preferably used in which the sample is fixed, so that this sample and the cryostat form an independent assembly with respect to the probe, which can be separated from the latter without having to redo the empty at each installation.
  • the sample being located in the double envelope of the cryostat, it is necessary in this type of device to ensure a thermal connection between the cooled end of the probe and the interior envelope of the cryostat on which the sample is fixed.
  • the inner envelope of the cryostat is formed by a cylindrical wall closed by a circular bottom below which the sample is fixed, and all the solutions used consisted in making a thermal connection between the cooled end of the probe and the bottom circular of the internal envelope; however, none of these solutions is entirely satisfactory, each having specific faults which are summarized below.
  • a first solution (US Pat. No. 4,194,119) consists in placing a metal spring between the cooled end of the probe and the bottom of the envelope; however, the thermal transmission obtained is very poor due to the small thermal conduction section and the reduced surface contacts between the spring and the two ends which it connects.
  • Another solution consists in stuffing the space between the cooled end of the probe and the bottom of the envelope by means of metal flakes, metal sponges or equivalent material. This solution is impractical and the placement of the material is a delicate operation; in addition, each time the probe is dismantled (relative to the cryostat), these elements must be carefully cleaned, the material ensuring the thermal connection being changed each time.
  • Another solution consists in placing between the cooled end of the probe and the bottom of the envelope a soft metal pellet, which is crushed between these two elements; however, this type of device is unable to allow significant longitudinal expansions of the probe and can only operate in a narrow temperature range; in addition, the parts forming the probe and the internal envelope of the cryostat must be machined with very small tolerances so that the assembly can be carried out correctly.
  • the longitudinal vibrations of the probe are directly transmitted to the envelope of the cryostat and therefore to the sample, which constitutes a very serious defect in the case where the sample is formed by infrared detectors.
  • the crushed soft metal pellet causes the formation of incrustations in the probe and the envelope, and the cleaning of these elements is difficult to carry out with each dismantling, the soft metal pellet being generally to be changed.
  • Another solution is to fix the probe in the cryostat by means of a spring device which maintains the end of the probe directly in abutment against the bottom of the internal envelope (with the possible presence of a grease or a varnish).
  • This solution has the disadvantage of leading to greater mechanical complexity; moreover, it does not eliminate the defect of the previous solution, relating to the transmission of longitudinal vibrations from the probe to the sample.
  • US Patent 3,306,075 describes a thermal spring connection system interposed between the cylindrical side wall of the probe and the cylindrical side wall of the inner envelope of the cryostat.
  • This known system is of a complex and bulky construction; moreover it cannot be used with cryostats where the probe is adjusted in said cryostat with a relatively small peripheral clearance.
  • US Patent 3,807,188 describes a thermal bonding system comprising a chamber whose external wall has flexibility in the longitudinal direction and which is filled with a liquid such as mercury.
  • This known system is very complex and requires the provision of an internal cryostat envelope having a bottom of special shape.
  • European patent 0 059 272 filed by the applicant describes a cryogenic cooler in which there is provided a thermal connection piece which has a general shape of revolution around the longitudinal axis of the probe and which has a plurality of longitudinal slots distributed over its periphery in order to give them a radial elasticity.
  • the tabs defined by the slots have a surface in the form of a cylinder portion which comes to rest against the cylindrical wall of the internal envelope of the cryostat.
  • the disadvantage of this embodiment is that the force exerted by each tab against the cylindrical wall of the internal envelope of the cryostat is not only carried out in the radial direction but also in the longitudinal direction. Therefore, the contact with the cylindrical wall does not take place over the entire outer surface of the tongues but only over a reduced part of the latter.
  • the present invention therefore proposes to provide a solution to the problem of thermal bonding between the probe and the sample to be cooled by a cryogenic cooler which is free from the defects of the solutions described briefly above.
  • an object of the present invention is to provide a cryogenic cooler having a good quality thermal connection between the cooled end of the probe and the envelope of the cryostat on which the sample to be cooled is fixed.
  • the present invention therefore relates to a cryogenic cooler of the type comprising a probe provided with an end cooled by gas expansion and closed by a bottom, a vacuum jacketed cryostat, the inner jacket of which is formed by a closed cylindrical wall. by a bottom, is adapted to contain the cooled end of the probe, a sample to be cooled, in particular one or more infrared detectors, fixed in the double jacket of the cryostat on the bottom of the inner jacket and a connecting piece thermal revolution, in one piece and good conductor of heat, positioned in the free space between said bottom of the probe and the bottom of the inner casing of the cryostat, said cryogenic cooler being characterized in that the part thermal link has on its cylindrical side wall a groove in which is housed a ring which is in contact with the cylindrical wall of the envelope eg inside the cryostat, this ring having a slot which gives it elasticity in the radial direction and allows its mounting.
  • a cavity is dug in the front face of said part and the bottom of this cavity can have a circular groove.
  • the thermal connection part has an axial opening which cooperates with a central rod-shaped part of the bottom of the probe, this cooperation being effected by means of threads. carried by the two elements to be fixed one on the other.
  • the cryogenic cooler shown schematically by way of example in FIG. 1 comprises two separate assemblies 1 and 2 connected by a connecting tube 3.
  • the assembly 1 can be a motor-compressor group or a motor-oscillator group, suitable for generating pressurized gas flow or pressure oscillation in tube 3.
  • the assembly 2 comprises a probe shown diagrammatically at 4 (per se well known) comprising a cooled end 5 in which an expansion of the cold producing gas takes place.
  • This probe is fixed by conventional fixing means (not shown) on a cryostat 6 formed by an external envelope 7 and an internal envelope 8 between which a high vacuum is produced.
  • the internal envelope 8 is constituted by a cylindrical wall 9 and by a circular bottom 10, the cooled end 5 of the probe is housed in the envelope 8 near the bottom 10.
  • a sample to be cooled for example one or more detectors infrared 11, is fixed under the bottom 10 between the two envelopes of the cryostat.
  • the thermal bond between the end cooled 5 of the probe 4 and the inner casing 8 of the cryostat 6 so as to cool the sample 11 fixed to the bottom 10 is produced by a part 12 called thermal connection.
  • This part 12 is in contact, on the one hand, with the cooled end 5 and, on the other hand, with the cylindrical wall 9 of the internal envelope 8 in the vicinity of the bottom 10.
  • the thermal connection part 12 has a general shape of revolution and comprises a base or heel 13, a cylindrical side wall 14 and a front face 15.
  • the side wall 14 has a groove 16 in which is housed a ring 17.
  • the base 13 is in contact with the end cooled 5 by means of a flat circular bottom 18 which closes the probe at its end.
  • the flat bottom 18 is usually welded to the end of the cylindrical tube of the probe 4 while the base 13 is glued or screwed to the flat bottom 18 or by any known means.
  • the circular groove 16 extends over a substantial part of the wall 14 and receives the ring 17 which has an internal face 19 and edges 20 and 21 in as close contact as possible with the groove 16 ( Figure 4).
  • the ring 17 has an external face 22 and its thickness is greater than the depth of the groove 16 so that only this external face 22 is in as close contact as possible with the wall 9 of the internal envelope 8.
  • the ring 17 is provided with a certain elasticity which is obtained by a slot 32 made on the ring itself. This slot also allows the mounting of the ring in the groove 16. It will be noted that in order to obtain as close contact as possible between the groove 16 and the ring 17 and between the latter and the wall 9, the groove 16 and the ring 17 must be made with great precision, the clearance between the ring and the groove being negligible.
  • the thermal connection part 12 which has just been described in relation to FIG. 1 has satisfactory performance for many applications. Its performance can be improved if it takes the form which will be described in relation to FIGS. 2 and 3.
  • part 12 The modifications made to the shape of part 12 are intended to main objective of reducing the volume of said part so that its thermal resistance is as low as possible and that the heat transfer takes place as efficiently as possible between the bottom 18 of the probe 4 and the ring 17.
  • the front face 15 has a cavity 23 having a circular edge 24 sufficiently thick to accommodate the groove 16 and a depth which does not alter the mechanical strength of the part 12 at cryogenic temperatures.
  • the part 12 is pierced with an axial opening 25 which defines an annular base or heel 26. This heel 26 and this opening 25 are in close contact with the bottom 18 of the probe 4 which then has an appropriate shape.
  • the bottom 18 has an annular cavity with an outer edge 27 which is in contact with the peripheral part of the annular heel 26, this peripheral part having a shoulder 29.
  • the central part of the bottom 18 has the shape of 'a rod 28 which fits into the axial opening 25.
  • this rod 28 is threaded at its end and cooperates with a thread carried by the axial opening 25 so as to fix the part 12 on the bottom 18
  • various means can be provided.
  • a circular groove is made in the bottom of the cavity 23
  • the internal edge of this groove would have the shape of a nut to accommodate an appropriate key.
  • two diametrically opposite holes 30 which are drilled in the bottom of the cavity 23 and which cooperate with a key having two lugs.
  • FIG. 4 The partial sectional view of the ring 17 in FIG. 4 shows that the external edges 31 of the ring are chamfered to allow better sliding on the wall 9 of the envelope 8.
  • the materials which can be used to produce the various elements described above, namely the wall of the probe, the bottom 18, the thermal connection piece 12 and the ring 17 are those which are good thermal conductors at cryogenic temperatures and which have good mechanical strength at these temperatures. This is the case for copper, brass, aluminum, stainless steel, etc.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Combustion & Propulsion (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Radiation Pyrometers (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Separation By Low-Temperature Treatments (AREA)

Claims (6)

  1. Tieftemperatur-Kühleinrichtung vom Typ mit einer Sonde (4) in einem durch Entspannung von Gas gekühltem, durch einen Boden (18) verschlossenen Ende (5), einem Kryostaten (6) mit evakuiertem Doppelmantel, dessen Innenmantel (8), der eine durch einen Boden (10) verschlossene zylindrische Wand (9) aufweist, so ausgebildet ist, daß er das gekühlte Sondenende (5) aufnehmen kann, einer zu kühlenden Probe (11), insbesondere einem oder mehreren Infrarotdetektoren, die in dem Doppelmantel des Kryostaten am Boden (10) des Innenmantels befestigt sind, und einem rotationssymmetrischen einstückigen Verbindungsstück (12) guter Wärmeleitfähigkeit, das im freien Raum zwischen dem Boden (18) der Sonde und dem Boden (10) des Innenmantels (8) des Kryostaten angeordnet ist, dadurch gekennzeichnet, daß das thermische Verbindungsstück (12) an seiner seitlichen zylindrischen Wand eine Nut (16) aufweist, in der ein Ring (18) untergebracht ist, der in Berührung mit der zylindrischen Wand (9) des Innenmantels (8) des Kryostaten (6) steht, wobei dieser Ring einen Schlitz (32) aufweist, der ihm Elastizität in radialer Richtung verleiht und seine Montage ermöglicht.
  2. Tieftemperatur-Kühleinrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Vorderseite (15) des thermischen Verbindungsstücks (12) eine Aussparung (23) aufweist, die einen Rand (24) freischneidet, in dessen Dicke die Nut (16) angeordnet ist.
  3. Tieftemperatur-Kühleinrichtung nach Anspruch 2, dadurch gekennzeichnet, daß der Boden der Aussparung (23) eine kreisförmige Rille aufweist.
  4. Tieftemperatur-Kühleinrichtung gemäß einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das thermische Verbindungsstück (12) eine axiale Öffnung (25) aufweist, die einen ringförmigen Absatz (26) begrenzt, der von einem ringförmigen Hohlraum im Boden (18) der Sonde (4) aufzunehmen ist und mit einem Mittelteil (28) des Bodens (18) zusammenwirkt, um das thermische Verbindungsstück (12) am Boden (18) zu befestigen, wobei der Rand (24) des ringförmigen Hohlraums im Boden (18) in Kontakt mit der Seitenwand des Absatzes (26) steht.
  5. Tieftemperatur-Kühleinrichtung nach Anspruch 4, dadurch gekennzeichnet, daß der Mittelteil (28) des Bodens (18) mit einem Gewinde versehen ist und mit einem Gewinde zusammenwirkt, das von der axialen Öffnung (25) des thermischen Verbindungsstücks (12) getragen wird.
  6. Tieftemperatur-Kühleinrichtung nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Vorderseite (15) des thermischen Verbindungsstücks (12) Angriffsmittel, wie Löcher (30), aufweist, die zum Zusammenwirken mit einem Schlüssel dienen.
EP88400648A 1987-03-23 1988-03-18 Tiefsttemperaturkälteanlage Expired - Lifetime EP0285491B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT88400648T ATE79949T1 (de) 1987-03-23 1988-03-18 Tiefsttemperaturkaelteanlage.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8703990A FR2613046B1 (fr) 1987-03-23 1987-03-23 Refroidisseur cryogenique
FR8703990 1987-03-23

Publications (2)

Publication Number Publication Date
EP0285491A1 EP0285491A1 (de) 1988-10-05
EP0285491B1 true EP0285491B1 (de) 1992-08-26

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ID=9349302

Family Applications (1)

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EP88400648A Expired - Lifetime EP0285491B1 (de) 1987-03-23 1988-03-18 Tiefsttemperaturkälteanlage

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Country Link
EP (1) EP0285491B1 (de)
AT (1) ATE79949T1 (de)
DE (1) DE3873954T2 (de)
FR (1) FR2613046B1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2699263B1 (fr) * 1992-12-15 1995-01-27 Cryotechnologies Refroidisseur muni d'un doigt froid équipé d'un coupleur thermique.

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3060338A (en) * 1959-10-20 1962-10-23 Philco Corp Photoconductor device
US3193610A (en) * 1962-08-10 1965-07-06 Atlee Corp Shields for vacuum tubes and the like
FR2345890A1 (fr) * 1976-03-25 1977-10-21 Telecommunications Sa Dispositif cryostatique pour machine cryogenique
FR2500581A1 (fr) * 1981-02-26 1982-08-27 Abg Semca Refroidisseur cryogenique a liaison thermique perfectionnee
US4344302A (en) * 1981-06-08 1982-08-17 Hughes Aircraft Company Thermal coupling structure for cryogenic refrigeration
US4562703A (en) * 1984-11-29 1986-01-07 General Electric Company Plug tube for NMR magnet cryostat

Also Published As

Publication number Publication date
ATE79949T1 (de) 1992-09-15
EP0285491A1 (de) 1988-10-05
DE3873954D1 (de) 1992-10-01
FR2613046B1 (fr) 1989-06-23
FR2613046A1 (fr) 1988-09-30
DE3873954T2 (de) 1993-01-21

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