EP0048579A1 - Procédé pour le dépôt électrolytique d'alliages de plomb - Google Patents

Procédé pour le dépôt électrolytique d'alliages de plomb Download PDF

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Publication number
EP0048579A1
EP0048579A1 EP81304194A EP81304194A EP0048579A1 EP 0048579 A1 EP0048579 A1 EP 0048579A1 EP 81304194 A EP81304194 A EP 81304194A EP 81304194 A EP81304194 A EP 81304194A EP 0048579 A1 EP0048579 A1 EP 0048579A1
Authority
EP
European Patent Office
Prior art keywords
lead
solution
anode
tin
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP81304194A
Other languages
German (de)
English (en)
Other versions
EP0048579B1 (fr
Inventor
William John Waterman
Miachel Gordon Brook
Lita Elizabeth Jenni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Federal Mogul Shoreham Ltd
Dana Inc
Original Assignee
GKN Vandervell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GKN Vandervell Ltd filed Critical GKN Vandervell Ltd
Priority to AT81304194T priority Critical patent/ATE10862T1/de
Publication of EP0048579A1 publication Critical patent/EP0048579A1/fr
Application granted granted Critical
Publication of EP0048579B1 publication Critical patent/EP0048579B1/fr
Expired legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Conductive Materials (AREA)
EP81304194A 1980-09-23 1981-09-14 Procédé pour le dépôt électrolytique d'alliages de plomb Expired EP0048579B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT81304194T ATE10862T1 (de) 1980-09-23 1981-09-14 Verfahren zur galvanischen abscheidung von bleilegierungen.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8030638A GB2084191A (en) 1980-09-23 1980-09-23 Electro-deposition of alloys
GB8030638 1980-09-23

Publications (2)

Publication Number Publication Date
EP0048579A1 true EP0048579A1 (fr) 1982-03-31
EP0048579B1 EP0048579B1 (fr) 1984-12-19

Family

ID=10516222

Family Applications (1)

Application Number Title Priority Date Filing Date
EP81304194A Expired EP0048579B1 (fr) 1980-09-23 1981-09-14 Procédé pour le dépôt électrolytique d'alliages de plomb

Country Status (6)

Country Link
EP (1) EP0048579B1 (fr)
AT (1) ATE10862T1 (fr)
BR (1) BR8106041A (fr)
CA (1) CA1172599A (fr)
DE (1) DE3167841D1 (fr)
GB (1) GB2084191A (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0218772A1 (fr) * 1984-08-22 1987-04-22 MIBA Gleitlager Aktiengesellschaft Couche de roulement pour un palier déposée par voie galvanique
WO1997031138A1 (fr) * 1996-02-24 1997-08-28 Glyco-Metall-Werke, Glyco B.V. & Co. Kg Procede de production d'un materiau stratifie pour paliers lisses et bain electrolytique approprie pour mettre ledit procede en oeuvre
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
WO2005003411A1 (fr) * 2003-06-06 2005-01-13 Taskem, Inc. Systeme d'electrodeposition d'alliage d'etain
FR2864553A1 (fr) * 2003-12-31 2005-07-01 Coventya Installation de depot de zinc ou d'alliages de zinc
US7239747B2 (en) 2002-01-24 2007-07-03 Chatterbox Systems, Inc. Method and system for locating position in printed texts and delivering multimedia information
US20130334052A1 (en) * 2012-06-05 2013-12-19 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
CN103849915A (zh) * 2012-12-06 2014-06-11 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
US9139927B2 (en) 2010-03-19 2015-09-22 Novellus Systems, Inc. Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
US9404194B2 (en) 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
RU2739899C1 (ru) * 2020-07-27 2020-12-29 Алексей Игоревич Буянов Кислый электролит для нанесения антифрикционного покрытия сплавом свинец-олово-медь
US10927475B2 (en) 2017-11-01 2021-02-23 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus
CN113195798A (zh) * 2019-11-28 2021-07-30 油研工业股份有限公司 抑制镀覆液的锌浓度上升的方法以及锌系镀覆构件的制造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3335716A1 (de) * 1983-10-01 1985-05-02 Glyco-Metall-Werke Daelen & Loos Gmbh, 6200 Wiesbaden Gleitlager und verfahren zu seiner herstellung
CA2034568C (fr) * 1990-01-19 1995-08-29 Yoshikazu Fujisawa Coulisseau
CA2069988C (fr) * 1991-05-31 1997-03-04 Yoshikazu Fujisawa Element coulissant avec une surface composee de microprojections pyramidaux
CA2070932C (fr) * 1991-06-11 1995-11-07 Yoshikazu Fujisawa Appui a glissiere
CA2074114C (fr) * 1991-07-18 1999-01-19 Yoshikazu Fujisawa Glissiere
GB2324805A (en) * 1997-04-30 1998-11-04 Platt Electromeck Limited Electroplating
CN105350063B (zh) * 2015-11-09 2018-10-30 科文特亚环保电镀技术（江苏）有限公司 一种电镀液分离的阳极系统

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB577335A (en) * 1944-02-10 1946-05-14 Vandervell Products Ltd Improvements in and relating to bearings and bearing surfaces
GB628459A (en) * 1945-07-10 1949-08-30 Cleveland Graphite Bronze Co Electrodeposition of lead-antimony-tin alloys
GB679947A (en) * 1950-06-09 1952-09-24 Cleveland Graphite Bronze Co Improvements in bearings
US2793990A (en) * 1952-06-04 1957-05-28 Silvercrown Ltd Electrodeposition of alloys containing copper and tin
US3616305A (en) * 1967-01-18 1971-10-26 Eugene Arbez Ets Process for depositing lead
GB2007713A (en) * 1977-10-21 1979-05-23 Dipsol Chem Method for stabilizing tin or tin alloy electroplating baths
US4217198A (en) * 1979-03-23 1980-08-12 Olin Corporation Coated perfluorosulfonic acid resin membranes and a method for their preparation

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB577335A (en) * 1944-02-10 1946-05-14 Vandervell Products Ltd Improvements in and relating to bearings and bearing surfaces
GB628459A (en) * 1945-07-10 1949-08-30 Cleveland Graphite Bronze Co Electrodeposition of lead-antimony-tin alloys
GB679947A (en) * 1950-06-09 1952-09-24 Cleveland Graphite Bronze Co Improvements in bearings
US2793990A (en) * 1952-06-04 1957-05-28 Silvercrown Ltd Electrodeposition of alloys containing copper and tin
US3616305A (en) * 1967-01-18 1971-10-26 Eugene Arbez Ets Process for depositing lead
GB2007713A (en) * 1977-10-21 1979-05-23 Dipsol Chem Method for stabilizing tin or tin alloy electroplating baths
US4217198A (en) * 1979-03-23 1980-08-12 Olin Corporation Coated perfluorosulfonic acid resin membranes and a method for their preparation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
METAL FINISHING, vol. 74, no. 1, January 1976, METALS AND PLASTICS PUBLICATIONS, INC., Hackensach, N.J. USA Pages 30-34 * Page 34, especially "Lead Alloy Deposition " * *

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0218772A1 (fr) * 1984-08-22 1987-04-22 MIBA Gleitlager Aktiengesellschaft Couche de roulement pour un palier déposée par voie galvanique
WO1997031138A1 (fr) * 1996-02-24 1997-08-28 Glyco-Metall-Werke, Glyco B.V. & Co. Kg Procede de production d'un materiau stratifie pour paliers lisses et bain electrolytique approprie pour mettre ledit procede en oeuvre
US6086742A (en) * 1996-02-24 2000-07-11 Glyco-Metall-Werke, Glyco B.V. & Co. Kg Method of producing layered material for sliding bearings and an electroplating bath for carrying out this method
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
US7239747B2 (en) 2002-01-24 2007-07-03 Chatterbox Systems, Inc. Method and system for locating position in printed texts and delivering multimedia information
WO2005003411A1 (fr) * 2003-06-06 2005-01-13 Taskem, Inc. Systeme d'electrodeposition d'alliage d'etain
US7195702B2 (en) 2003-06-06 2007-03-27 Taskem, Inc. Tin alloy electroplating system
FR2864553A1 (fr) * 2003-12-31 2005-07-01 Coventya Installation de depot de zinc ou d'alliages de zinc
WO2005073438A1 (fr) * 2003-12-31 2005-08-11 Coventya Sas Installation de depot de zinc ou d’alliages de zinc
US9139927B2 (en) 2010-03-19 2015-09-22 Novellus Systems, Inc. Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
US9404194B2 (en) 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
TWI585823B (zh) * 2010-12-01 2017-06-01 諾菲勒斯系統公司 電鍍裝置及晶圓級封裝製程
US10309024B2 (en) 2010-12-01 2019-06-04 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
US9982357B2 (en) 2010-12-01 2018-05-29 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
US9534308B2 (en) 2012-06-05 2017-01-03 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
US20170137960A1 (en) * 2012-06-05 2017-05-18 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
US10106907B2 (en) 2012-06-05 2018-10-23 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
US20130334052A1 (en) * 2012-06-05 2013-12-19 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
US10954605B2 (en) 2012-06-05 2021-03-23 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
CN103849915A (zh) * 2012-12-06 2014-06-11 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
CN103849915B (zh) * 2012-12-06 2016-08-31 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
US10927475B2 (en) 2017-11-01 2021-02-23 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus
US11401623B2 (en) 2017-11-01 2022-08-02 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus
CN113195798A (zh) * 2019-11-28 2021-07-30 油研工业股份有限公司 抑制镀覆液的锌浓度上升的方法以及锌系镀覆构件的制造方法
US20220298668A1 (en) * 2019-11-28 2022-09-22 Yuken Industry Co., Ltd. Method for suppressing increase in zinc concentration of plating solution and method for manufacturing zinc-based plating member
RU2739899C1 (ru) * 2020-07-27 2020-12-29 Алексей Игоревич Буянов Кислый электролит для нанесения антифрикционного покрытия сплавом свинец-олово-медь

Also Published As

Publication number Publication date
GB2084191A (en) 1982-04-07
BR8106041A (pt) 1982-06-08
ATE10862T1 (de) 1985-01-15
EP0048579B1 (fr) 1984-12-19
DE3167841D1 (en) 1985-01-31
CA1172599A (fr) 1984-08-14

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