EP0028684A1 - Fabrication et post-traitement d'un objet revêtu d'or et article ainsi obtenu - Google Patents

Fabrication et post-traitement d'un objet revêtu d'or et article ainsi obtenu Download PDF

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Publication number
EP0028684A1
EP0028684A1 EP80105297A EP80105297A EP0028684A1 EP 0028684 A1 EP0028684 A1 EP 0028684A1 EP 80105297 A EP80105297 A EP 80105297A EP 80105297 A EP80105297 A EP 80105297A EP 0028684 A1 EP0028684 A1 EP 0028684A1
Authority
EP
European Patent Office
Prior art keywords
gold
fluid
electroplated
process according
percent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP80105297A
Other languages
German (de)
English (en)
Inventor
Frederick Bayard Koch
Richard Sard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of EP0028684A1 publication Critical patent/EP0028684A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H2011/046—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion by plating

Definitions

  • the invention is concerned with fabrication of devices including gold surfaced regions. More particularly, devices of greatest immediate concern are those in which gold surfaces are electrical contact surfaces produced by electroplating.
  • Gold early of interest for a number of uses based on its excellent resistance to corrosion, was found to have nonideal characteristics. Flexibility of processing was thought possible on the basis of gold characteristics, per se. Gold is a pliable metal, and, generally, is forgiving during a vast variety of processing steps. Wear resistance of pure gold however was found to be poor. This problem was solved by admixture with a variety of alloying ingredients.
  • Alloy hardened gold is now in prevalent use. Alloying ingredients, such as cobalt, nickel, cadmium, and arsenic, are used in very small amounts, sometimes tenths of a precent by weight, to markedly improve wear qualities. .These materials are in worldwide use for ornamentation as well as in electrical contacts in a vast variety of device designs. Unfortunately, alloying admixture has been found to have an undesirable side effect. Resulting material is quite brittle--specifically, is of very low ductility--and this restricts the type of handling after initial formation. Gold electroplating, for example, must be carried out on already formed substrates, since any attempt to substantially alter shape or to cut to size may result in cracking or even in flaking.
  • Processes include those in which plated members are permanently deformed by strains larger than the elastic limit, as well as those in which deformation is transitory--i.e., short of the elastic limit at least for substrate material so that the part returns to its original shape.
  • Operations which are so permitted include, for example, those in which plated foils are wrapped around a mandrel.
  • Another important category of procedures involves stamping and/or cutting operations in which plated sheets are divided into members of smaller device dimensions. Such a category includes switch contact paddles in which economies are realized by plating large sheets.
  • the Figure is a schematic view of a device including gold switch contacts which are cold worked subsequent to electroplating.
  • the Figure depicts a prototype remanent reed structure of a type described in U. S. Patent No. 3,059,075.
  • the Figure depicts a glass envelope 1 containing two reeds 2 and 3 each of which is provided with contacting regions 4 and 5 of electroplated AFHG, respectively.
  • the larger part of each of reeds-2-and 3 is flattened from its initial round wire configuration and unflattened regions 6 and 7 are hermetically sealed at glass sealed regions 8 and 9.
  • Coils 10 and 11 are arranged to produce magnetizations of directions which oppose or cooperate to permit use of the switch in a crosspoint array.
  • the remanent reed structures 2 and 3 are, at this time, made of Remendur, a remanent magnetic material containing cobalt, iron, vanadium, and manganese. Development of appropriate square loop and remanent magnetic properties require a critical set of processing steps terminating in annealing and cold working.
  • Contact material at 4 and 5 is electroplated hard gold which, in the past has been plated on already cold worked reed structures 2 and 3. With the advent of AFHG, small gold plated members, serving as contacts 4 and 5, may be formed by electroplating on Remedur sheets and the entire composite bodies may subsequently be stamped or cut to paddle shapes.
  • AFHG Conventional electroplated alloy hardened gold is extremely brittle and is chacterized by cracking if elongated by more than about 1 percent (J. M. Deuber and G. R. Lurie, Plating, 60, 715 (1973)].
  • AFHG is characterized by reduced brittleness and freedom from cracking for elongation in a range up to about 30 percent as measured in terms of cross-sectional area reduction at the point of fracture during simple uniaxial tensile test.
  • the invention may be described as permitting cold working operation subsequent to hard gold plating.
  • the gold surfacing layer is assumed to have a thickness of the order of one or a few micrometers while the substrate is at least twenty-five times thicker.
  • the strain produced in the surfacing layer can be sufficiently well approximated by a classical strain analysis of the substrate alone, i.e., with a coating of negligible thickness.
  • R B radius of bending
  • Shearing and stamping manufacturing operations invariably produce a deformation of the substrate.
  • One such operation involves shearing of epoxy-fiberglass printed circuit boards.
  • the epoxy-fiberglass substrate is momentarily bent into a cylindrical surface over an area along the line of shearing and extending 1 or 2 mm away from the line of cutting.
  • the radius of bending is several times 25 millimeters (several inches) and produces cracking of conventional hard gold plating which has been applied to form contact fingers within the deformed area of the printed circuit board.
  • the critical radius for bending of AFHG in this application is only 25 millimeters (one inch) [ten times the board thickness of 2.5 millimeters (0.1 inch)] and therefore the deformation involved in shearing does not produce cracking of AFHG contact fingers.
  • AFHG plating is described in detail in the above-mentioned copending U. S. application Serial No. 073,066. Attainment of Knoop hardness numbers of 100, or even 200, if needed, results from plating at temperatures reduced with relation to those already used for soft gold plating from the same types of bath compositions. Temperatures are necessarily below 50 degrees C and, preferably, below 45 degrees C to result in the desired degree of hardness which is considered to derive from inclusion of gold cyanide in the plating. The cyanide, as retained, is believed to serve as a grain refining agent and to stabilize submicrometer grains.
  • plating conditions usefully employed for AFHG plating include
  • Contemplated procedures involve any processing which results in residual deformation of the already plated member.
  • a simple form of deformation involves parts plated in a flat condition and subsequently bent around a mandrel to produce a curved surface in the final member.
  • Other procedures involve drawing (e.g., to reduce diameter of a wire), flat rolling (e.g., to increase dimension of an already flat surface), roll flattening (e.g., for producing a tape from wire), swaging (e.g., to increase dimension by a hammering action), bending as well as subdividing as by shearing or blanking.
  • the elastic limit of concern is that primarily of the substrate.
  • Significant operations permitted by use of AFHG are those in which the deformation, however, produced entails more than the 1 percent elongation permitted for alloy hardened gold.
  • deformation producing failure may not be apparent in whole or in part from the cold-worked member.
  • Such operations as carried out on a substrate of high elastic deformability may result in relaxation after deformation to return the plating to its near unworked state.
  • inventive teaching entails electroplated AFHG.
  • AFHG electroplating is described in detail in the above-mentioned copending U. S. application Serial No. 073,066.
  • coatings of concern are primarily gold but may contain specified amounts of metallic ingredients.
  • Total content of hardening ingredients i.e., of cobalt, nickel, arsenic, cadmium, etc. is at a maximum of 0.1 weight percent based on the total coating.
  • Other ingredients predominantly carbon, hydrogen, nitrogen and oxygen, are generally present as contaminants may be at a somewhat higher level, but the totality does not exceed about 1 weight percent.
  • AFHG is further characterized by a Knoop hardness number of at least 100. Smoothness generally measured over at least 95 percent of a major face is within a 5 ⁇ m square sample area. This deviation is generally measured as a peak-to-valley dimension and is less than 0.5 ⁇ m.
  • Thickness of AFHG coatings is generally sufficiently small that distortion measurements are not complicated by internal shear stress.
  • Device grade coatings are likely to be nor more than a few m.
  • Substrates on the other hand are likely to be relatively thick--at least thousands of micrometers (mils) so that the relevant distortion of the coating is easily determined. It is the general thesis that failure is due to the coating itself since most substrate maerials have substantially greater elongation and other distortion limits.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP80105297A 1979-09-06 1980-09-05 Fabrication et post-traitement d'un objet revêtu d'or et article ainsi obtenu Withdrawn EP0028684A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7306779A 1979-09-06 1979-09-06
US73067 1979-09-06

Publications (1)

Publication Number Publication Date
EP0028684A1 true EP0028684A1 (fr) 1981-05-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP80105297A Withdrawn EP0028684A1 (fr) 1979-09-06 1980-09-05 Fabrication et post-traitement d'un objet revêtu d'or et article ainsi obtenu

Country Status (2)

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EP (1) EP0028684A1 (fr)
JP (1) JPS5644792A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6158846A (ja) * 1984-08-31 1986-03-26 株式会社竹中工務店 溶融スラグの発泡方法
JP2525770B2 (ja) * 1986-04-25 1996-08-21 日本重化学工業株式会社 クロム含有スラグの無害化処理方法およびクロム含有溶融スラグ風砕用ノズル
JPH08165152A (ja) * 1994-12-07 1996-06-25 Shinko Flex:Kk 製鋼スラグ用処理剤および処理方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH444608A (de) * 1964-04-01 1967-09-30 Engelhard Ind Inc Elektrolytlösung zur Verwendung beim Gold-Elektroplattieren
CH480444A (de) * 1966-01-21 1969-10-31 Engelhard Ind Inc Elektrolytlösung zur elektrolytischen Ablagerung von Goldlegierungen
CH485863A (de) * 1966-02-23 1970-02-15 Engelhard Ind Inc Elektrolytlösung zur Verwendung bei der elektrolytischen Ablagerung von Gold
DE1941822B2 (de) * 1969-08-16 1972-12-28 Deutsch Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches goldlegierungsbad zur abscheidung definiert hoch- und niedriglegierter goldueberzuege
CH552069A (de) * 1969-07-03 1974-07-31 Engelhard Min & Chem Verfahren zum elektrolytischen ablagern von gold allein oder zusammen mit anderen matallen.
DE2523510B1 (de) * 1975-05-27 1976-10-14 Siemens Ag Saures galvanisches goldbad zum abscheiden von gold- oder goldlegierungsueberzuegen

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH444608A (de) * 1964-04-01 1967-09-30 Engelhard Ind Inc Elektrolytlösung zur Verwendung beim Gold-Elektroplattieren
CH480444A (de) * 1966-01-21 1969-10-31 Engelhard Ind Inc Elektrolytlösung zur elektrolytischen Ablagerung von Goldlegierungen
CH485863A (de) * 1966-02-23 1970-02-15 Engelhard Ind Inc Elektrolytlösung zur Verwendung bei der elektrolytischen Ablagerung von Gold
CH552069A (de) * 1969-07-03 1974-07-31 Engelhard Min & Chem Verfahren zum elektrolytischen ablagern von gold allein oder zusammen mit anderen matallen.
DE1941822B2 (de) * 1969-08-16 1972-12-28 Deutsch Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches goldlegierungsbad zur abscheidung definiert hoch- und niedriglegierter goldueberzuege
DE2523510B1 (de) * 1975-05-27 1976-10-14 Siemens Ag Saures galvanisches goldbad zum abscheiden von gold- oder goldlegierungsueberzuegen

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JPS5644792A (en) 1981-04-24

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Inventor name: KOCH, FREDERICK BAYARD

Inventor name: SARD, RICHARD