EA014277B1 - Method of aligning elements of multichip modules for capillary assembly and installation for the realization thereof - Google Patents

Abstract

The invention relates to electronic engineering, particularly, to instrument engineering, specializing in designing and producing equipment for assembly of nodes and means of microelectronic equipment, including development and producing equipment of alignment and soldering during assembly of densely packed microelectronic equipment, and also multichip modules (MCM). Proposed is a method of aligning elements of the multichip modules for capillary assembly during which aligning three systems of contacts arranged on three carriers: a chip + a switching substrate + a carrier of capillaries between the chip and the substrate is provided. In addition, to realize advantages of MCM capillary assembly process, vacuum soldering is used with controlled chip clamping to the substrate in compliance with preset cyclogram. Proposed is an installation for realizing the method of aligning elements of the multichip modules for capillary assembly, including a base with an opto-mechanical system of aligning opposite contacts of chips placed thereon and the switching substrate, comprising two-coordinate table with manipulators to control switching substrate moves in horizontal plane along X and Y axes, that is attached onto the table, a node with a manipulator of chip vertical motions and rotations along axis Z with the help of a rod with a vacuum pincette arranged on its lower end face connected to a vacuum pump, and aforesaid node is provided with a horizontal motion drive allowing to reach the area of technological underpan location with chips placed thereon, to carry out their grip by turn, to deliver them into alignment zone, and to place them onto the switching substrate, fixed on aforesaid two-coordinate table, the installation also includes a double prism of the opto-mechanical aligning system, a colour video camera and a colour display, a node of vacuum fixation of the chips and a node of vacuum fixation of the switching substrate, and the nodes of the vacuum fixation are fixed on the two-coordinate table and connected to the vacuum pump via independent channels.

Description

Technical field

The invention relates to electronic equipment, and in particular to instrument making, specializing in the design and manufacture of equipment for assembling nodes and devices of microelectronic equipment, and specifically to the development and manufacture of equipment for combining close-packed microelectronic equipment during assembly, including multi-chip modules (MKM).

State of the art

In the process of assembling microelectronic equipment, one of the essential requirements is the accuracy of the combination of the MKM elements, their mutual positioning during the manufacturing of the MKM. The process of combining MKM elements is one of the most complex and time-consuming operations in the manufacturing technology of MKM. The prior art knows a large number of technical solutions related to the implementation of the process of combining various elements in the manufacture of microelectronic equipment. So, the process of combining various elements in the manufacture of printed circuit boards is thoroughly developed.

For example, there is a known method of manufacturing printed circuit boards by the method of screen printing, in which a mesh stencil is combined with a pattern on a control substrate made of opaque material, by relative movement of the stencil and the control substrate, followed by the replacement of the control substrate with a working board, after which a drawing is applied through it stencil (M.Topfer Microelectronics of thick films, M. Mir, 1973, p.102). One of the significant disadvantages of this method is the large consumption of material and its high complexity, because due to the use of an opaque control substrate and a stencil, the combined patterns are difficult to view and several test paste applications are required at each alignment.

A known method of manufacturing printed circuit boards, in accordance with which between the mesh stencil and the control substrate is fixed motionless relative to the stencil, the transparent technological film is applied to it through a mesh stencil, the resulting pattern is combined with the reference marks on the control substrate, after which the process film is removed, replaced control substrate on the worker and produce printing (USSR copyright certificate No. 437257, IPC N05K 3/12, 1974). The use of a transparent film and an opaque control substrate with printed reference marks allows to increase the productivity of the printed circuit board manufacturing process, since the transparency of the technological film provides visual control of the combination of patterns: a pattern transferred from a stencil to a film and a pattern on an opaque control substrate. Despite the increase in productivity of the manufacturing process of printed circuit boards, the method involves an additional consumption of pastes when combining the patterns of the stencil and the control substrate, since in order to transfer the image of the pattern of the stencil to a transparent medium - a transparent film, a preliminary preliminary drawing of the drawing is done before the operation of combining with an opaque control substrate.

The noted drawbacks are eliminated by the fact that in the above-described method for manufacturing multi-level thick-film printed circuit boards, a control board is used as a conductor, made with negative and positive reference signs, corresponding reference signs of patterns of stencils of dielectric and conductive layers, repeating the shape of the working board, and exceeding the thickness in form it is the amount of clearance between the mesh stencil and the working board, and before applying the drawing of the next layer on the working board contact combine in ohodyaschem light back on image fiducials of the stencil and the control board until a uniform to mark the lumen (RF patent number 2,025,058, MPK5 N05K 3/12, 1989). This technical solution eliminates the drawbacks noted above, because the proposed sign system allows you to translate the combination from one sign system to another by simply rotating the microscope around the axis of rotation, thereby eliminating the need for test application and subsequent erasing of the paste on an auxiliary technological film in the process manufacturing thick-film printed circuit boards.

A combination and exposure apparatus is known in which atmospheric air pressure is used to increase the substrate pressure to the photomask by creating a vacuum between the photomask and the table with the substrate fixed on it. Mentioned substrate is laid on the pin surface of the metal table, closed with a template fixed in a template holder. Between the template and the table, with the substrate installed on it, a sealed cavity is formed, communicating with the means of creating a vacuum. After pumping air out of the space under the photomask, the entire table is pressed closer to the photomask with a fixed substrate, and not the substrate itself, which is squeezed by a large force between the photomask and the table. Since the surface of the substrate and the surface of the table do not have perfect flatness, the substrate will be firmly pressed to the template with only protruding parts. And the flatness of the surface of the table also affects the quality of the clip, however, a further increase in the pressing force of the table does not improve the contact of the substrate with the photomask, but only increases its wear. In addition, the presence of a constant effort to press the table against the photomask leads to poor contact due to possible deflection of the template, the greater the greater the applied force. Thus, when ma

- 1 014277 scrap of the pressing force does not provide tight contact, although the template is practically not deformed, and with a large pressing force, tight contact is not provided over the entire surface of the substrate due to the deflection of the photomask. It is known that a loose adherence of the substrate to the photomask leads to a decrease in the quality of exposure due to diffraction phenomena leading to distortion of the pattern reproduced on the substrate, which is a significant drawback of the known installation (Installation of semi-automatic alignment and exposure of UPSE-3 DEM 2.207.010. Technical description and form).

The noted drawbacks are eliminated in the known device for combining and exhibiting, containing a table for mounting the substrate, kinematically connected with the mechanism of its vertical movement, a photo template placed above the table, mounted with the possibility of linear and angular movements with respect to the table surface and forming a sealed cavity when installing the substrate on it associated with the means of pumping air, illuminator and optical device for controlling alignment, socket with hole, made in the table ke for connection with the external environment, an elastic membrane rigidly fixed around the periphery of the table, while the minimum distance between the inner contour of the elastic membrane and the side surface of the substrate is at least two thicknesses of the elastic membrane (RF patent No. 1817659, IPC 6 H05K 3/00, 1991). This installation has significantly improved the performance of the process of combining and exposure.

A device for combining and fixing a metal mask with a substrate, used in the manufacture of multi-chip modules on the LSI, containing a base with guides in the form of rods, a mask holder with a permanent magnet, a substrate holder, a removable permanent magnet mounted on the base under the substrate holder with the ability to move along guiding the base in a plane perpendicular to the working surface of the substrate holder, a microscope with a lighting system and a combination manipulator, removable carrier a magnet with base holes arranged to interact with base guides made of non-magnetic material, said base being provided with uprights, and a substrate holder made in the form of a slot formed by grooves made in the base uprights (RF patent No. 1811041, IPC 5, H05K 3/14, 1991). This device made it possible to preserve the combined metal mask with the substrate, excluding special permanent magnets and a vacuum system from the structure, i.e. significantly increase the manufacturability of the device. At the same time, the use of a removable permanent magnet to fix the mask creates problems when removing the magnetic fixation, since it is impossible to ensure a smooth separation of the magnet - it occurs with a hard-to-adjust jerk, which can lead to a loss of mask alignment accuracy.

The technological operations of the alignment process are most thoroughly worked out for screen printing. Known methods of screen printing using manual adjustment of the mesh screen on top of the processed substrate, so that marks alignment marks, called coordinate marks located on the screen and the processed substrate, are aligned when viewed through the screen.

However, this technology assumed a large share of subjectivity, which ultimately led to a trial and error system, and several attempts were required to achieve the desired result.

The reliability of the results obtained in the process of implementing this method of combining depended on the coincidence of similar elements of the substrates, the accuracy of the placement of each processed substrate on the coordinate table for screen printing and the possibility of installing screen printing to keep the mesh screen in its original position.

The use of screen printing technology for the manufacture of multi-color graphic images and for the deposition of resist and solder material in the technology for the production of printed circuit boards has led to an increase in the requirements for alignment accuracy. Increasing requirements for alignment accuracy were designed to satisfy systems that included one or more cameras on charge-coupled devices (CCDs) equipped with a set of lenses, while the system was controlled by a microprocessor, providing an increase in images of alignment characters displayed on an indicator device (display). Such indicator devices, in addition to all, had electronically created coordinate grids that made it possible to fine-tune the mesh stencil and substrate using micrometric adjustments, usually performed manually. In separate copies of such devices, semi-automatic or automatic modes have been tested, for example, in EP No. 204901 a semi-automatic screen printing device is disclosed in which it is proposed to use step-by-step electric drives.

In the aforementioned known systems, video cameras were mounted directly above or at an angle by means of additional subframes with respect to the main frame of the screen printing device. This placement of cameras led to the emergence of several methodological positioning errors, such as: mounting a mesh stencil on the main frame of the screen printing device, repeatability of the input position of the coordinate table, repeatability of the position of care coordinates

- 2 014277 dinate table, the repeatability of the position of the substrate on the coordinate table and the rigidity of the cameras. To reduce the mentioned errors in a number of developments, the main emphasis was placed on increasing the mechanical integrity of the screen printing device, namely, on reducing errors caused by the displacement of moving parts. In the process of detailed studies that accompanied the aforementioned developments, it was revealed that if the three most critical parameters are controlled with a tolerance of 0.0025 cm, which with such a shift of the coordinate table correspond to an error of 0.003%, then in this case the total maximum error of combining such a system will be 0 , 0075 cm. This alignment accuracy no longer met the requirements of most similar next-generation alignment systems, one of which is a system for using a stencil th printing, comprising a coordinate table, a frame system, the visual control device, a device for fixing the substrate on the coordinate table and means for fastening the mesh stencil (№ EP 0137659). In this system, the main disadvantages mentioned above, inherent in known devices characterizing the prior art, have been substantially eliminated. At the same time, a significant complication of such systems, saturation of them with complex optical-electronic devices and nodes, led to the following complications in their use. One of the features of this system is the need for simultaneous observation of the alignment marks both on the product and on the mesh screen using an observation device, but at the same time its connection with the product or with the mesh screen is undefined. Another feature is the ability to adjust the system until the stencil or mask is in the position where they should be relative to the stencil mounted on the coordinate table. However, when installing a new stencil, it must also be adjusted to the correct position, since it cannot be determined whether it is in exactly the same position when placed. During operation, it was found that inevitably there is a relative displacement and new errors are introduced with each use.

The noted disadvantages are eliminated in the device used for screen printing containing a coordinate table, a bed, a visual control device, a device for fixing a substrate on a coordinate table and a device for fixing a mesh screen, in which, in accordance with the invention, the coordinate table is mounted on a device bed, the supporting device is rigidly attached to the coordinate table, the visual control device is mounted on the supporting device, located so that the device is visually The control unit looks at the main part of the surface of the coordinate table, and this device additionally contains a device for relative movement between the coordinate table and a device for attaching a mesh stencil, while the visual control device is positioned with the possibility of observing alignment marks applied to the substrate, so that when the mesh the stencil is between the visual control device and the substrate, the visual control device can observe the alignment marks, applied data on the mesh screen, whereby it is easier to adjust the relative positions of the mesh screen and the substrate to align the alignment marks on the mesh screen and the substrate, and thus, the mesh screen and the substrate are aligned. The support device contains elements that are rigidly connected in the form of a support frame, rigidly attached to the support unit, on which the visual control device is installed by means of a mechanism that is motionless and firmly, but with the ability to adjust the position, if necessary, secures the visual control device.

The device may contain means for processing image data coming from the visual control device, and for outputting the processed image data to the display, while in the process of processing these data, an image is generated that can be viewed by the visual control device using an additional superimposed coordinate grid with smooth positioning. The device is additionally equipped with a grid positioning mechanism with smooth positioning, adapted to control the operator.

On the coordinate table, a fixture is installed with the processed substrate fixed in it, and the mesh stencil is installed in the fixture for attaching the mesh stencil.

There is also known a method of combining the alignment marks and the mesh screen applied to the substrate, which is implemented using the above device, in accordance with which the substrate and the mesh screen are fixed rigidly in the device located on the coordinate table, the location of the alignment signs of the substrate is marked using a coordinate grid, offset the supporting frame and the mesh stencil relative to each other so that the alignment marks of the mesh screen coincide with the alignment marks of the coordinate grid By carrying out the combination of the treated substrate and the stencil. After marking the location of the alignment marks of the processed substrate, the coordinate grid location is changed by the parametric correction coefficient obtained from the previous control experience of screen printing (RF patent No. 2189707, IPC 7 Н05К 3/12, В41Е 15/08, 603Е 9/00).

Technical solutions protected by this patent have largely eliminated most of the shortcomings of the above technical solutions and significantly developed the technology

- 3 014277 the process of combining in screen printing. The accumulated experience and unique techniques successfully used in the combination technology for screen printing have been transferred to the processes of combining elements of multi-chip modules in their manufacture, of course, taking into account the features and specifics of microelectronic technology.

One of the main trends in the development of assemblies in microelectronic technology is the search for physical, structural and technological principles that would allow integrating (assembling) chips into microelectronic devices in such a way that:

provide high packing density of chips in the composition of microelectronic equipment (MKM);

collect in a single microelectronic node (MKM) heterogeneous (by functions and manufacturing technologies) chips;

to provide high assembly performance and low cost of microelectronic equipment (MKM).

The task of the assembly equipment is, ultimately, the formation of an array of contact nodes that provide electrical and mechanical pairing of the component contacts (element base) and the switching substrate, through which the source element base is integrated into a single electrical circuit that implements a given functional unit of the equipment (MKM).

Depending on the design of contact nodes (KU), one or another method of their formation (assembly) is used.

So for the assembly of KU, consisting of two contact pads (KP), placed on coplanar carriers and spaced horizontally in space, with a connecting element made of an extended conductor (round wire or flat bus on a film carrier), the ends of which are connected to the KP welding method (method \ Uys Vopb = \ UV).

\ ¥ В method has been used in microelectronics for more than 50 years, which explains its prevalence in the assembly market - more than 90%, as well as its undeniable advantages:

process maturity and a high yield rate (up to 98-99%);

the presence on the market of HC-assembly equipment of various capacities (from desktop systems for manual assembly to high-performance machines - 10-12 pairs of welds per second);

developed infrastructure ^ B-assembly (a wide range of gold and aluminum wires, accessories and fixtures).

In the presence of the listed advantages, the ^ B-assembly method has at least two significant drawbacks.

As you know, welding is a piecewise operation, i.e. All MKM contacts are serviced by a welding tool sequentially, contact by contact. So when assembling MKM from 10 chips with 400 contacts each, the welding machine needs to run 4000 pairs without failures, or 8000 contacts, which, even for a super-automatic machine with a productivity of 10 pairs of welds / s, takes about seven minutes.

But if the non-group nature of the welding process can be fought, for example, by increasing the productivity of the welding machine, then the limitations for welding caused by the second drawback become fundamental.

The fact is that the contact pads on the chip for welding can be placed only on the periphery of the crystal (welding cannot be used on the main working surface of the chip). But the peripheral region, and hence the number of contacts on it, grows in proportion to the size of the chip (for example, for a square chip with an area of 1 cm ^{2, the} length of the peripheral region for placing contacts is about 4 cm or 4x10 ⁴ microns, which allows you to place only ~ 400 contacts with a width of 80 microns with gaps between them of 20 microns - this is almost the limit for the peripheral arrangement of contacts).

With an increase in the functional density of the chips, the number of I / O pins also increases, but welding assembly constraints prevent this.

It is necessary to move on to such an assembly that would allow the use of contacts placed over the entire surface of the chip. Then, for example, on one square centimeter of the chip, it will be possible to place a matrix of two to three thousand contacts with gaps between them more than 100 microns.

Such assembly methods are known in the art. They are based on soldering the matrix of oncoming contacts. Soldering, as a milder process than welding, the chips carry normally.

These methods include:

flip chip assembly method (proposed by 1ВМ in 1964);

capillary assembly method С2 / С3-MKM-technology (designations С2 - СарШата Соппесюоп = capillary connection and С3 - СарШата Сипк Сопесйоп = capillary connection of chips - were proposed, in the process of creation and development of a method of capillary assembly, the authors of this invention since 1998 in the company Multi-chip technology, Zelenograd.The main development results are protected by RF patent No. 2134498 and Eurasian patent No. 010269).

Closest to the claimed group of inventions, in terms of the method of combining elements of multichip modules for capillary assembly, is a method of combining elements of multichip modules, implemented on a semi-automatic installation of mounting crystals T-3002-PC3,

- 4 014277 including preparation of contacts on chips and a switching substrate for flip-chip soldering, placement and fixing of a switching substrate, contacts up, on the coordinate table of the alignment installation, with manipulators providing movement of the switching substrate in the ΧΥ plane, capture of the first chip, contacts down, from the technological tray with vacuum manipulator tweezers along the оси axis of the alignment installation and its placement above the switching substrate in the field of combining the oncoming contacts of the first chip and the switching input substrate into the space between the aforementioned chip and the area of the switching substrate with the reciprocal contacts of the dual prism of the optical-mechanical system for combining the images of the oncoming contacts, combining on the color screen of the monitor the images of the contacts of the first chip with the images of the reciprocal of the oncoming contacts of the switching substrate, recorded by the video camera through the said dual prisms, controlling the coordinates X, Υ of the switching substrate fixed on the coordinate table of the installation, and rotating the first around the Ζ axis, removing, upon completion of alignment, the dual prism of the optical system for combining images of oncoming contacts from the space between the first chip and the switching substrate, precision, without losing mutual orientation along the Χ, Υ axes, lowering the first chip along the оси axis until its contacts come into contact with response contacts of the switching substrate and its temporary, until soldering, fixing in this position by the manipulator along the оси axis, the final fixing of the combined on-board contacts of the chip and switching substrate ykoy, retraction of the manipulator Ζ axis from the first chip, fixed by soldering to the circuit substrate, and repeating the above operations with all other chip multichip module.

From the prior art, as well as based on the results of monitoring the market for equipment for flip-chip assembly in small-scale production (up to 100 MKM / h), it follows that there is a wide range of desktop installations for manual and semi-automatic assembly of microelectronic equipment units on a frameless base.

The following installations can be mentioned as typical representatives of flexible desktop semiautomatic devices for R&D prototyping and pilot (in small batches) production of microelectronic modules and MCMs, including the flip chip method.

This is the installation ΟΝΥΧ-24 (Fig. 1) of the company ΖΕΥΛΟ (Germany). Semi-automatic installation of selective soldering / desoldering of surface-mounted components is equipment that guarantees reliability and ease of use. A unique machine vision system allows precise positioning of components with a fine pitch. Components with positioning defects can be moved, components that are defective in parameters can be replaced, expensive components can be removed from the defective board for reuse. The installation is used as a precision tool for mounting components on a board of any degree of complexity.

With the help of можно 24, it is possible to install and solder components of any standard size on the prototype of the product in the experimental design production. These components can subsequently be removed and reused. It is possible to selectively install components, for example, if they were in short supply during automated assembly. Another example is the installation of components that cannot be installed on an existing automated line for technical reasons.

The process of capturing a component, applying flux, soldering (in compliance with a given regime of thermo profiling) is carried out automatically.

The ΖΕΎΛΟ nozzles used on the ΌΚ.8 series units can be used without any problems on the ΟΝΥΧ 24 series installation. The installation can install and dismantle components of any standard size, such as chip components, flip chip components, housing of the IBSL, С8Р, VOL series, LLS, MH, SOA, TCP, OEP and other small-pitch ICs, connectors and microprocessor sockets, RF shielding elements and all non-standard components.

High installation accuracy is ensured by a semi-automatic process control system. The installation provides infrared preheating of boards and switching substrates up to 300x300 mm in size for lead-free and traditional solders. An optional board air cooler is provided. Provides positioning of components with a given clamping force. An automated manipulator along the оси axis places the component on the board and presses it with the force specified by the operator during programming. The force is given in grams of force. The unit is equipped with a multifunctional heating head, which can be used in the following cases:

soldering in air or nitrogen of all surface-mounted components (including lead-free solders);

removal of solder residues (a special tool can be installed on the head that will remove solder residues from the board surface automatically);

dosing (a dispenser can be installed);

special operations, according to customer requirements.

The unit is also equipped with a machine vision system, which is the latest multi-window vision system (ΜΕΟΥ). With the latest machine vision system, you can install

- 5 014277 standard sizes of components from 0201 to VOL with an area of up to 75 square meters. mm with a given accuracy. The integrated LED backlight (on the component side and on the PCB side) ensures that the contrast necessary for the positioning system is achieved. Calibration is fully automatic.

The automatic installation (Fig. 2) of mounting the BAM42 semiconductor components manufactured by the German company ΑΜΑΌΥΝΕ is designed to work with components of any type and size. Typical use of the installation is component placement, sorting, testing. Flexibility and a large number of options allows you to use the installation for installation of both standard microelectronic products and components of high complexity such as: a crystal on a board (СОВ - СЫр op Лоатб), an assembly of multi-chip modules (wide part), a crystal on a chip (part one) , flip, chip (ShrSyr), installation by eutectic soldering (eiSeiss koettsd rgosekkek).

The main characteristics of the installation:

free division of the working area (400x400 mm) into the feed zone and the placement zone; work with packages like \ WaGG1e Rusk, OE RASK (up to 12) or with a tape feeder; installation accuracy: ± 25 microns;

the ability to work with 300 mm semiconductor wafers;

installation of components of a high degree of complexity (SOV, MSM, SMO8, AirSyr);

the ability to install in an automatic line;

automatic tool change;

open architecture software;

modular installation structure;

readjustment flexibility, focus on specific user requirements;

easy access to all parts of the installation;

Dimensions: 1050x900x1800 mm.

The basic configuration contains: a working platform, a robot, a tool store, a S’E camera. Additional modules may include: an expanded tool store, chip ejector, dispenser, stamp module, flip chip module, bottom view camera, belt feeder, eutectic module.

The working platform is extendable, providing easy access to the entire working area. In accordance with the 8AM42 concept, the user is able to freely divide the entire working area into component supply zones (rukir) and placement zones (p1ace). A vacuum is used to trap the components with a tool.

The robot works in 4 coordinates and is equipped with an integrated instrument landing sensor (1oisy bo \ tp). It has the function of rotating the tool through 360 °, an SSI video camera with annular, coaxial and contrast lighting.

Tool store - for 6 or 12 tools (option) - is equipped with an automatic tool change system.

The chip ejector includes a replaceable single or multi-needle head designed to work with semiconductor wafers up to 12 in size.

The flip chip module has a rotation programming function for working with components of any kind.

A dispenser with a micro-nozzle produces an arbitrary-patterned adhesive with control of the necessary time and pressure. It has a rotation function and an extensive library of templates.

The stamp module is a rotating container with adhesive. It has a double squeegee, a mechanism for regulating the thickness of the adhesive layer and the rotation speed of the container. The adhesive is transferred to the substrate with a special tool.

The lower view camera is equipped with coaxial and ring illumination and is designed to increase optimization accuracy before placement.

The tape feeder can include up to 10 feeders with a width of flax of 8, 12, 16 and 24 mm.

The eutectic module is designed to work with substrates up to 25 mm in size and temperatures up to 450 ° C in an inert gas atmosphere.

The software is characterized by ease of management, fast programming, open and extensible architecture.

Options: layout of a semiconductor wafer, import of SAE data, offline programming, process simulation mode, programming macro language.

Basic Interface - ease, intuitiveness, window menu, real video and status window. Programming the structure of the component store. Interactive graphical programming of component store with learning function. There is a function of interactive presentation of the structure of the working area. The layout of the semiconductor wafer. Display a map of a semiconductor wafer on the screen. Interactive and file-based planning is done in full compliance with BEM! 081-1000. Service menu - drive control, status display

- 6 014277 sensors, system diagnostics. Autonomous programming is performed on an external PC station. It is possible to import CAO positioning data. In the process control window, you can easily configure process parameters for each component, display a process graph, as well as personal process control for each component. Macro-language programming allows you to create a custom application in a short time.

A vacuum brazing unit is also known (Fig. 3). UO 20, manufactured by the German company Sep1go111sgsh. proposed for research and small-scale production. Application areas: hybrid microassemblies, power semiconductor components, optoelectronic components, hermetic sealing of cases, crystal packaging, LED packaging, MEMS packaging. The installation differs in the following functional features and advantages: it provides temperature control of the process up to 450 ° C with high uniformity of the temperature profile, heating rate up to 50 K / min, cooling rate up to 180 K / min, vacuum up to 10 ² mbar, has a short duty cycle. The main technical characteristics of the installation are as follows: the size of the plates (LxW) - 230x400 mm; heating system - 1 heating plate; the maximum height of the substrates is 100 mm, when using plasma (optional) - 50 mm; chamber size - 20 l; dimensions - 1200 mm (W) x600 mm (D) x1300 mm (H), adjustable leg height 40-110 mm; working gases - Ν ₂ ; H ₂ to 100%; Ν ₂ / Η ₂ to 95/5%; power supply - 400v / 30A, 12 kW (peak); water for cooling - 15 l / min, 15-25 ° C; maximum load on the plate - 7.5 kg; weight - 400 kg. Pumping speed when creating a vacuum - up to 18 m ³ / h.

Similar equipment is produced in Europe, as well as in the USA, Japan and countries of Southeast Asia.

Closest to the claimed group of inventions, in terms of the installation of combining elements of multi-chip modules for capillary assembly, is a semi-automatic installation of mounting crystals T-3002-EC3, manufactured by the Swiss company Όγ. Tgekku AC (Fig. 4).

The basic equipment of the installation includes: a modern automated control system based on a personal computer, automated drives for precise movement in the horizontal plane and ergonomic controls. Equipping this system with options for mounting 8MT components, enhanced optics, a visual alignment system, eutectic mounting modules, and ίΐίρ SYR installations, the user gets a complete technical solution for assembling microelectronic modules of various configurations. The installation has the following specifications:

work area: 220x220 mm; axis movement: 95 mm; maximum angle of rotation of the installation head: 360 °; installation speed of one component: 3 ... 8 s;

positioning accuracy: ± 0.005 mm;

mounting accuracy: ± 0.005 mm; measurement error: ± 0.001 mm;

minimum size of the installed component: 0.2x0.2 mm (when using a standard tool);

maximum substrate size: 400x280 mm;

clamping force: 20 ... 400 g (other force ranges available);

overall dimensions: 1060x750x800 mm;

control unit: 250x750x450 mm;

weight: 105 kg.

In more detail: the installation includes a base, on the upper surface of which there is an optical-mechanical system for combining oncoming contacts of chips and a switching substrate, containing a two-coordinate table with manipulators for controlling movements in the horizontal plane, along the X and Y axes, a switching substrate fixed to the table, a node with a manipulator of vertical movements and rotations of the chips along the оси axis through a vertically located rod with vacuum tweezers at its lower end connected to a vacuum a smart pump that serves to capture and hold chips during the alignment process, while the said unit is equipped with a horizontal displacement drive, which serves to reach the area of the technological tray with the chips placed on it, to carry out their alternate capture, delivery to the registration area and installation on the switching substrate, mounted on the aforementioned two-coordinate table, a dual prism, a color video camera and a color monitor to display the said counter contacts in the process of combining them Then, control the movement of the switching substrate along the coordinates Χ, Υ and the rotation of the chip around the Ζ axis.

It should be noted that all the above-mentioned installations representing the prior art are intended for operations related to the installation of chips on the switching substrate, either face up (for subsequent unpacking of contacts) or face down (for a flip chip assembly).

- 7 014277

In their composition, for a flip-chip assembly, there is a system of accurate (~ 1 μm) matching of oncoming contacts placed on two types of carriers: the first type of carriers are chips, the second type of carrier is a switching substrate.

However, for capillary assembly according to C2 / C3 technology, it is necessary to combine three contact systems located on three types of media: chips + switching substrate + capillary carrier located between the chips and the substrate.

Thus, the existing alignment installations are not able to implement the C2 / C3 technology of capillary assembly without appropriate refinement, which is the subject of the claimed invention.

The task to which the claimed group of inventions is directed is to create technology and instrumentation for combining and fixing parts for capillary assembly of multi-chip modules (MKM), which allows combining and fixing three contact systems placed on three carriers in the technological package, which are : chips, a switching substrate and a flat carrier of capillary holes made of dielectric material, placed between the chip and the substrate - to perform, after combining them and in clamping in the technological package, capillary assembly, including vacuum soldering with adjustable force of pressing the chips to the switching substrate according to a certain sequence diagram.

More precisely, the task is posed as follows: based on the method of combining MKM parts in the form of two types of oncoming contact carriers (chips and switching substrate), implemented in installations of the Tg-3002-EC3 type from BG. Tgekku AC (Fig. 4) for a flip chip mounting crystals, to propose a method for combining and fixing in the technological package three types of oncoming contact carriers (chips, a switching substrate and a flat carrier of capillary holes made of dielectric material between them) and implement this method on the said installation T-3002-EC3, complementing this installation with specially developed nodes for vacuum fixing of chips and switching substrate, combined in a common coordinate grid of oncoming contacts, for their installation, together with a flat carrier capillary openings of a dielectric material, a technological package for subsequent vacuum brazing the mating contacts MCM through said capillary opening.

The technical result due to the use of the proposed technology for combining three contact systems located on three carriers allows implementing the C2 / C3 technology of capillary assembly MKM of high integration with increased yield and assembly performance of multi-chip modules, while improving the quality of assembled nodes and their reliability.

The reason for the new opportunities that arise when assembling units of close-packed microelectronic equipment from unpacked components (chips) in the form of multi-chip modules (MKM) based on the aforementioned C2 / SZ-MKM capillary assembly technology is the use of the capillary effect to form capillary connecting elements between counter contacts chip and switching substrate as part of the MKM, protected by Eurasian patent No. 010269.

The task underlying the claimed group of inventions with the achievement, in the process of its implementation, of the indicated technical result, in terms of the method of combining the elements of multi-chip modules, is solved by the fact that in the method of combining the elements of multi-chip modules, including the preparation of contacts on chips and a switching substrate for soldering, placement and fixing of the switching substrate, contacts up, on the coordinate table of the alignment installation, with manipulators providing movement of the switching substrate and in the ΧΥ plane, grabbing the first chip, downward contacts, from the technological tray with the manipulator’s vacuum tweezers along the Ζ axis of the alignment installation and placing it above the switching substrate in the area of matching the oncoming contacts of the first chip and the switching substrate, entering the space between the chip and the switching substrate region with reciprocal contacts of the dual prism of the optomechanical system for combining images of oncoming contacts, combining on the color screen of the monitor the images of the contacts of the first chip with images of reciprocal counter contacts of the switching substrate removed by the camcorder via the aforementioned dual prism, controlling the movement of the switching substrate along the coordinates Χ, Υ fixed on the coordinate table of the unit, and rotating the first chip around the Ζ axis, removing, after alignment, the dual prism of the optical-mechanical systems for combining images of oncoming contacts from the space between the first chip and the switching substrate, precision, without loss of relative orientation along the Χ, Υ axes, lowering pressing the first chip along the Ζ axis until its contacts come into contact with the response contacts of the switching substrate and temporarily, until the soldering is completed, fixing the Ζ axis with the manipulator in this position, final fixing the counter contacts of the chip and the switching substrate together by soldering, removing the manipulator along the оси axis from the first the chip fixed by soldering on the switching substrate, and repeating the above operations with all the other chips of the multi-chip module, in accordance with the invention, the contacts are prepared on Type and switching substrate for soldering through capillary holes made in a flat carrier made of dielectric material, place and fix on the coordinate table of the alignment unit a unit for vacuum fixing chips on a flat rigid membrane installed in the upper part of the said alignment unit containing through holes - simulators capillary holes

- 8 014277 the shapes formed in the said membrane according to the templates of the said capillary hole carrier are placed, using the manipulator along the оси axis, the first chip, with its contacts down, over the area of alignment with the corresponding through holes in the said membrane, introduced into the space between the first chip and the region membranes with reciprocal through holes, a dual prism of the optomechanical system for combining images of oncoming contacts of the said installation, combine on the color screen of the monitor images of the contacts of the first chip with images of reciprocal through holes in the said membrane, captured by a video camera through a dual prism, controlling the movement of the membrane of the vacuum fixation unit along the coordinates Χ, Υ fixed on the coordinate table of the unit, and rotating the first chip around the axis Ζ, output, upon completion of alignment, the dual prism of the optics -mechanical system for combining images of oncoming contacts from the space between the first chip and the aforementioned membrane, produce a precision, without loss of relative orientation along the Χ, уск axes, lowering positioning the first chip along the оси axis until its contacts come into contact with the through holes made in the aforementioned membrane and fixing the first chip in this position with the Ζ axis manipulator, then pumping air out of the volume under the membrane, fix the first chip on the membrane of the vacuum unit fixing the chips and moving the manipulator along the оси axis of the installation from the first chip fixed on the membrane of the vacuum fixing unit, after which the above operations are performed with all other chips of the multi-chip module, fixing all the types on the membrane of the vacuum chip fixing unit, after which the sealing gasket-frame is fit onto the base pins of the vacuum chip fixing unit, and then the hard flat technological carrier of the chips is glued on the same pins with a film glued from below, covered with a layer of glue in the areas of contact with with chips, adhere the chips with the back to the mentioned technological carrier, then turn off the vacuum fixation of the chips on a flat, rigid membrane of the vacuum fixation unit of the chips, remove the technological carrier with glued chips from the base pins of the vacuum fixation unit, after which the assembly for vacuum fixation of the switching substrate on a flat, rigid membrane installed in the upper part of the said assembly containing through holes - capillary hole simulators formed and placed on the coordinate table Χ, Υ is placed in the said membrane according to the templates of the aforementioned carrier of capillary holes, the switching substrate is captured, with the contacts down, from the technological tray to the said vacuum tweezers the volume of the manipulator along the оси axis of the said alignment unit, place, with the help of the manipulator along the та axis, the said switching substrate, contacts downward, over the region of alignment with the counter-through holes in the said membrane, are introduced into the space between the switching substrate and the membrane region with the counter-through holes, the dual prism of the optical-mechanical system for combining images of oncoming contacts of the said installation, combine on the color screen of the monitor images of contacts of the switching base ki with images of reciprocal through holes in the said membrane, shot by a video camera through a dual prism, controlling the movement of the membrane of the vacuum fixation unit of the switching substrate along the coordinates Χ, Υ, fixed on the coordinate table of the installation, and rotating the switching substrate around the axis ят, output, upon completion of alignment , dual prism of an optical-mechanical system for combining images of oncoming contacts from the space between the switching substrate and the flat, rigid membrane of the vacuum assembly To fix the switching substrate, they perform the precise, without losing mutual orientation along the Χ, ос axes, lowering the switching substrate along the оси axis until its contacts come into contact with the through holes in the said membrane and fix the switching substrate in this position with the тором axis manipulator, after which by pumping air out of the volume under a flat, rigid membrane, the switching substrate is fixed on the flat, rigid membrane of the vacuum fixing unit of the switching substrate, then the axis is retracted Ζ installation from the switching substrate fixed on a flat, rigid membrane of the vacuum fixing unit of the switching substrate, then, sequentially landing on the base pins of the vacuum fixing unit of the switching substrate of the sealing gasket-frame and a rigid, flat technological carrier of the switching substrate with a film glued from the bottom coated with a layer of glue in the area of contact with the switching substrate, the switching substrate is glued with the back to the aforementioned rigid, flat to the carrier of the switching substrate, turn off the vacuum fixation of the switching substrate on a flat, rigid membrane of the vacuum fixing unit of the switching substrate and removing the technological carrier with the adhesive switching substrate attached to the base pins of the vacuum fixing node of the switching substrate, and then landing on the base pins compatible with the base pins the mentioned nodes of the vacuum fixation of the chips and the switching substrate, the technological carrier with glued switching with the substrate, with the contacts facing up, landing on the same base pins of the aforementioned carrier of capillary holes with the side corresponding to the switching substrate facing down, and then landing, on the same basic pins, of the technological carrier with glued chips, the contacts down, which completes the combination of contacts chips with counter contacts of the switching substrate through capillary holes made in said dielectric flat carrier

- 9 014277 material, and receive a package of parts of a multi-chip module prepared for capillary assembly in a vacuum brazing unit.

The task underlying the claimed group of inventions with the achievement, in the process of its implementation, of the specified technical result, in terms of installation for implementing the method of combining elements of multi-chip modules, is solved by the fact that in the installation, including the base, on the upper surface of which an optical-mechanical system is placed combining counter contacts of the chips and the switching substrate, containing a two-coordinate table with manipulators for controlling movements in the horizontal plane, along the X and Υ axes, comm with a substation mounted on a table, a unit with a manipulator of vertical movements and chip rotation along the оси axis through a vertically located rod with vacuum tweezers at its lower end connected to a vacuum pump, which serves to capture and hold the chips during the alignment process, while the said unit equipped with a horizontal displacement drive, which serves to reach the area of the technological pallet with the chips placed on it, to carry out their alternate capture, delivery to the joint zone mounting and mounting on a switching substrate mounted on the aforementioned two-coordinate table, the aforementioned dual prism of the optical-mechanical system, a color video camera and a color monitor for displaying the aforementioned counter contacts in the process of combining them by controlling the movement of the switching substrate along the coordinates Χ, Υ and the chip rotation around the axis Ζ, in accordance with the invention, said installation is further provided with a unit for vacuum fixing the chips and a unit for vacuum fixing the switching substrate, when ohm mentioned vacuum fixation components, during their use, mounted on said XY table and connected to a vacuum pump for autonomous channels;

as well as the fact that the vacuum fixation unit of the chips, mounted on a two-coordinate table of the installation, contains a predominantly rectangular case with a bottom, in which a channel is made for pumping air from the cavity formed by the bottom, the side walls of the said case and a rigid, flat membrane on the upper surface of which the chips are fixed, with the base mounting holes at its corners, located on the upper end of the case, at the corners of which there are base pins of the chip vacuum fixing unit, a sealing gasket-frame with holes in the corners, by means of which, like a membrane, it is put on the aforementioned base pins on top of the membrane, in which, in addition to the mounting holes, there are holes made in a single coordinate grid of counter contacts of the chips, the switching substrate and the said capillary hole carrier, a rigid, flat technological chip carrier made of heat-conducting material with holes in the corners, similar to a sealing gasket-frame, on the lower side of which a heat-resistant film is fixed, on the lower to which surface of which, in places of its contact with chips, a thin layer of glue is applied;

and also the fact that the vacuum fixation unit of the switching substrate, mounted on a two-coordinate table of the installation, contains mainly a rectangular case with a bottom, in which a channel is made for pumping air from the cavity formed by the bottom, the side walls of the said case and a rigid, flat membrane on the upper surface which fixes the switching substrate, with mounting holes at its corners, located on the upper end of the housing, at the corners of which there are base pins of the vacuum fixing commutation unit of the substrate, a sealing gasket-frame with holes in the corners, by means of which it is mounted, like a membrane, on the aforementioned base pins on top of the membrane, in which, in addition to the mounting holes, there are holes made in a single coordinate grid of counter contacts of the chips, the switching substrate and the carrier of capillary holes , a rigid, flat technological carrier of a switching substrate made of heat-conducting material with holes in the corners, similar to a sealing gasket-frame, on the bottom Rhone heat resistant film which is fixed on the lower surface of which, in places its contact with the circuit substrate, a thin adhesive layer suffered;

as well as the fact that the holes in said rigid, flat membrane are formed according to the patterns of the carrier of capillary holes;

and also the fact that the said sealing gasket-frame is made with dimensions equal to the outer contour of the end face of the housing, while the thickness of the sealing gasket-frame is made equal to the thickness of the chip and the thickness of the switching substrate;

as well as the fact that a flat, rigid technological carrier of chips and a flat, rigid technological carrier of a switching substrate are made of heat-conducting material;

as well as the fact that the evacuated area under the membrane of the vacuum chip fixing unit is divided by airtight partitions into zones under the chips, each zone being evacuated through its own channel, made in the bottom of the case, independently of other zones;

as well as the fact that the aforementioned technological carrier of chips contains a frame that coincides in size and base holes with the aforementioned sealing gasket-frame, and fragments made in the dimensions of the chips, and these fragments are connected with the said frame and with each other by strong jumpers, and the said film, attached from below, made continuous;

- 10 014277 and the fact that the vacuum fixation unit of the switching substrate includes a flat, rigid membrane for the switching substrate, consisting of individual fragments with gaps between them in the ΧΥ plane, while at least some of the mentioned fragments are chips.

Brief Description of the Drawings

The claimed group of inventions is illustrated by graphic materials on which are presented:

in FIG. 1 - semi-automatic installation of selective soldering / desoldering of surface-mounted components of the company ΖΕνΛί. '. an analogue;

in FIG. 2 - automatic installation installation of semiconductor components 8AM42 company компании, analogue;

in FIG. 3 - installation of vacuum soldering νΕΘ 20 of the company Sey! Go! Yegt, analogue;

in FIG. 4 - semi-automatic installation of crystals mounting T-3002-EC3 of the company Ig.Tgekku AC, the closest analogue;

in FIG. 5 is a block diagram of an alignment unit with a vacuum fixing unit for chips;

in FIG. 6 is a block diagram of an alignment unit with a vacuum fixing assembly of a switching substrate;

in FIG. 7 is a block diagram of the alignment installation in the phase of placing the chip in the alignment zone with the switching substrate;

in FIG. 7a is a block diagram of the alignment installation in the phase of aligning the oncoming contacts of the chip and the switching substrate with visualization of the alignment process through a prism, video camera, and monitor;

in FIG. 7b is a block diagram of the alignment installation in the lowering phase of the chip until its contacts come into contact with the opposing contacts of the switching substrate;

in FIG. 8 is a block diagram of the alignment installation in the phase of placing the chip in the alignment zone with a flat, rigid membrane (hereinafter referred to as the membrane);

in FIG. 8a is a block diagram of the alignment installation in the phase of alignment of the chip contacts and the counter holes in the mentioned membrane of the vacuum fixing unit of the chips with visualization of the alignment process through a prism, video camera, and monitor;

in FIG. 8b is a block diagram of the alignment installation in the lowering phase of the chip until its contacts come into contact with the counter holes in the mentioned membrane of the chip vacuum fixing unit;

in FIG. 9 - components of a multi-chip module (MKM) for a flip-chip assembly before combining oncoming chip contacts (one of the chip contacts is enlarged in the callout from above - the technological protrusion of the ball shape from the solder - bump is visible) and the switching substrate (one of the contacts is increased in the callout from the bottom - it is simply tin-coated with solder);

in FIG. 9a - components of a multi-chip module (MCM) for capillary assembly — before combining oncoming chip contacts (one of the chip contacts is enlarged in the top callout - there is no bump, the contact is simply tinned by solder) and the switching substrate (one of the contacts is enlarged in the callout from the bottom - it is just tin-coated solder) through capillary holes in a flat carrier of dielectric material (hereinafter - a flat carrier) (one of the capillaries is enlarged in the leader on the right);

in FIG. 10 is a top view of an MCM based on a flip chip of contact nodes, consisting of four chips on a common switching substrate, assembled (one of the flip chip of the contact nodes is enlarged in the callout from above);

in FIG. 10a is a section along AAA of the MKM shown in FIG. 10;

in FIG. 11 is a top view of MKM based on contact nodes with capillary connecting elements (KSE), consisting of four chips and a common switching substrate, interconnected via a flat carrier KSE, assembled (one of the contact nodes with KSE is enlarged in the callout from above);

in FIG. 11a is a section along AA of the MKM shown in FIG. eleven;

in FIG. 12 is a top view of a vacuum fixing assembly with a membrane for fixing chips and a switching substrate;

in FIG. 12a is a BB-sectional view of the chip-vacuum assembly of the chips and the switching substrate shown in FIG. 12;

in FIG. 13 - a chip held by vacuum tweezers is placed above the membrane;

in FIG. 14 - a dual prism of the optical-mechanical system is introduced into the region between the chip and the membrane, by which the chip contacts and the holes in the membrane are simultaneously displayed, through the camera’s lens, on the monitor in the form of an enlarged image of the chip contacts (square) offset from the membrane holes (round) ;

in FIG. 15 - the contacts of the chip and the counter holes of the membrane are combined by manipulating the position of the holes of the membrane in the plane ΧΥ and by manipulating (turning) the chip around the axis Ζ under the control of the alignment process on the monitor;

in FIG. 16 - after completion of the alignment procedure, a twin prism of the optomechanical system is removed from the region between the chip and the membrane, and the rod with the chip begins to lower down to the membrane;

in FIG. 17 - the contacts of the chip come into contact with the counter holes of the membrane, and the rod fixes the chip in this position;

in FIG. 18 - through the channel in the bottom of the housing, air starts to be pumped out of the cavity under the membrane, as a result of which the chip is attached to the membrane and the need for fixing the chip by pressing it against the membrane by the rod is eliminated;

in FIG. 19 - turning off the vacuum tweezers and pulling the rod upward from the chip to repeat the vacuum fixation cycle with subsequent chips;

in FIG. 20 - a chip fixed on the membrane by a vacuum method; in the leader - an enlarged image of the tin-plated contact on the chip, combined with the counter hole in the membrane;

in FIG. 21 is a plan view of a vacuum fixing assembly of chips with multi-chip module (MKM) chips on a membrane;

in FIG. 21a is a BB-sectional view of the chip vacuum attachment assembly shown in FIG. 21;

in FIG. 22 - sealing gasket-frame is lowered onto the base pins of the chip vacuum fixing unit;

in FIG. 23 is a plan view of a sealing gasket-frame located on the base pins of the chip vacuum holding assembly;

in FIG. 23a is a BB-sectional view of a gasket-frame with a chip vacuum locking assembly shown in FIG. 23;

in FIG. 24 - a rigid, flat technological carrier of chips (hereinafter referred to as technological carrier of chips) with a thin layer of glue on its lower surface, is lowered onto the base pins of the unit for vacuum fixing chips;

in FIG. 24a is a top view of a technological carrier of chips with jumpers;

in FIG. 25 - the technological carrier of the chips is placed on the base pins of the vacuum fixing unit of the chips and the chips fixed to the membrane are glued to it;

in FIG. 26 - vacuum fixation of chips on the membrane is terminated;

in FIG. 27 - the technological carrier of the chips, together with the sealing gasket-frame and with the glued chips, is removed from the base pins of the vacuum fixing unit of the chips;

in FIG. 28 - the switching substrate, held by vacuum tweezers, is placed above the membrane of the vacuum fixing unit of the switching substrate;

in FIG. 29 - a dual prism of the optical-mechanical system is introduced into the area between the switching substrate (CP) and the membrane of the vacuum fixing unit of the switching substrate, by which the contacts of the gearbox and the holes in the membrane are simultaneously displayed, through the camera lens, on the monitor as an enlarged image of the contacts of the gearbox (square ), offset from the holes of the membrane (round);

in FIG. 30 - KP contacts and membrane return holes are combined by manipulating the position of the membrane holes in the ΧΥ plane and by manipulating (turning) the KP around the оси axis under the control of the alignment process on the monitor;

in FIG. 31 - after completion of the alignment procedure, a dual prism of the optomechanical system is withdrawn from the area between the CP and the membrane, and the rod with the CP begins to fall down to the membrane;

in FIG. 32 - the contacts of the gearbox come into contact with the counter holes of the membrane, and the rod fixes the gearbox in this position;

in FIG. 33 - through the channel in the bottom of the housing, air starts to be pumped out of the cavity under the membrane, as a result of which the KP is attached to the membrane and the need for fixing the KP by pressing it against the membrane by the rod is eliminated;

in FIG. 34 - turning off the vacuum tweezers and pulling the rod up from the gearbox;

in FIG. 35 - switching substrate, fixed on the membrane by a vacuum method;

in FIG. 36 - the sealing gasket-frame is lowered onto the base pins of the KP vacuum fixing unit;

in FIG. 37 - a sealing gasket-frame is placed on the base pins of the KP vacuum fixation unit;

in FIG. 38 - technological carrier KP with a thin layer of glue on its lower surface, is lowered to the base pins of the vacuum fixing unit KP;

in FIG. 38a is a plan view of a flat technological carrier of a switching substrate with jumpers;

in FIG. 39 - the technological carrier of KP is placed on the base pins of the KP vacuum fixation unit and KP is fixed to it, fixed on the membrane; the vacuum fixation of the CP on the membrane is stopped;

in FIG. 40 - the technological carrier together with the sealing gasket-frame and with the glued gearbox is removed from the base pins of the gearbox vacuum fixing unit;

in FIG. 41 - the technological carrier KP is ready for further assembly of the technological package;

- 12 014277 in FIG. 42 - the technological carrier of the switching substrate, turned upside down by the contacts of the KP, is aligned with its base holes with the base pins, the axes of which coincide with the axes of the base pins of the vacuum fixing unit of the switching substrate;

in FIG. 43 - the base pins are inserted into the base holes of the technological carrier of the switching substrate;

in FIG. 44 - a flat carrier of capillary holes is combined with its base holes with the base pins;

in FIG. 45 - a flat carrier of capillary holes is mounted on the base pins;

in FIG. 46 - the technological carrier of chips (contacts down) is combined with its base holes with the base pins;

in FIG. 47 - the technological carrier of the chips is seated on the base pins, the formation of the technological package of the combined parts of the multi-chip module for the subsequent capillary assembly of the MCM is completed (on the callout from above is an enlarged image of the combined on-board contacts of the chip, the switching substrate, and the capillary hole in a flat carrier).

The chip alignment and vacuum fixation unit (Fig. 5) includes a base 26 on which a coordinate table 12 is located with controls 31 (along the X coordinate) and 32 (along the Υ coordinate), on which the vacuum fixation unit 33 of the chips 1 and etc., in the upper part of which there is a rigid membrane 6 with holes 6 'made in the coordinates of the contacts 1' of chip 1 and, accordingly, of other chips located on a pallet 27, from which the chips are sequentially (one after another) transferred by node 28 rotations and movements of chips along the оси axis, under control We use the manipulator 30, using vacuum tweezers 13 at the lower end of the rod 29, into the zone of combining the contacts 1 'of the chip 1 with the counter holes 6' of the membrane 6 of the block 33 through a dual prism 16, a color video camera 18 and a color video monitor 20 of the optical-mechanical registration system moreover, the unit 33 and the vacuum tweezers 13 are connected to the vacuum pumping unit 34 along the lines 35 and 36, respectively.

The installation of combining and vacuum fixing the switching substrate (Fig. 6) includes a base 26 on which the coordinate table 12 is located with controls 31 (along the X coordinate) and 32 (along the coordinate Υ), on which the block 43 for the vacuum fixing of the switching substrate is fixed 4, in the upper part of which there is a rigid membrane 6 with holes 6 'made in the coordinates of the contacts 4' of the switching substrate 4, located on the pallet 27, from which the switching substrate 4 is carried by the rotational and displacements unit 28 along the оси axis, under control by manipulating the manipulator 30, using vacuum tweezers 13 at the lower end of the rod 29, into the zone of combining the contacts 4 'of the switching substrate 4 with the counter holes 6' of the membrane 6 of the block 43 through a dual prism 16, a color video camera 18 and a color video monitor 20 of the optical-mechanical system alignment, and the block 43 and the vacuum tweezers 13 are connected to the vacuum pumping unit 34 along the highways 35 and 36, respectively.

Preferred Embodiment

The proposed technology for capillary assembly of multi-chip modules, including the process of combining three contact systems located on three carriers, is implemented through the proposed installation of combining MKM parts in a technological package for capillary assembly on the basis of the aforementioned desktop installation for flip-chip assembly of the T-3002RS3 type manufactured by Ότ. Ttekku (Fig. 4), which contains (Fig. 5) a base 26, on the upper surface of which there is a two-coordinate table with manipulators 31 and 32 for manually controlling the movements of objects placed on the table in a horizontal plane along the X and ос axes, respectively.

Above the table, there is a drive 28 for vertical movements and rotations of the chip 1 along the Ζ axis through the rod 29, with a vacuum suction cup at the bottom to capture and hold the chips, and the manipulator 30. The mentioned drive has the ability to move along the X axis (bidirectional arrow from above), which allows you to go into the area above the technological pallet 27 with chips (contacts down) to capture the next chip.

In the area between the object mounted on the table (for example, the switching substrate 4fig. 6), and the chip 1, a dual prism 16 of the optical-mechanical system can be introduced, which directs the counter images of the contacts of the chip and the switching substrate 4 to a color video camera 18 to display compatible counter contacts on the color monitor 20 during the rotation of the chip 1 relative to the axis Ζ and the movements of the switching substrate 4 in the plane XX.

After combining the images, the dual prism 16 of the optical-mechanical system can be removed from the region between the chip 1 and the stage 12, so that the rod 29 can lower the chip 1 along the оси axis until the contacts of the chip 1 come in contact with the opposite contacts of the switching substrate 4 (or another object with a flat surface) placed on the coordinate table 12), without losing the achieved alignment accuracy.

On the coordinate table 12 (Fig. 5) there is fixed a node 33 for vacuum fixing chips on the surface of a flat, rigid membrane 6 (hereinafter referred to as the membrane) with holes located in the coordinate grid of the opposite contacts of the switching substrate 4 (Fig. 6). Moreover, the convex contacts of the chip 1 partially

- 13 014277 enter the aforementioned holes in the membrane 6. Through the aforementioned holes, the chip is fixed during the evacuation of the cavity 10 under the membrane 6 inside the node 33 through the channel in the bottom of the node

33, connected by a hose 35 to a micro-vacuum pump 34.

The process of combining the three contact systems is as follows.

In FIG. 9a shows the details of the MCM to be combined into a technological package, including: IC crystals (chips) 1 and 2 with contacts 1 'and 2', respectively, with the chips oriented with the contacts down;

flat carrier of dielectric material (hereinafter referred to as the carrier) 3 capillary holes 3 'with holes 5 for the base pins with axes 5 (position 11 in Fig. 12), with carrier 3 facing side A to chips 1 and 2, and side B to patch substrate 4;

switching substrate 4 with contacts 4 is oriented contacts up.

The final result of combining the above details of the MCM is shown in FIG. 11a. The technological package of combined parts that implements the desired result of the combination is shown in FIG. 47.

The following describes the operations of combining and forming the technological package of FIG. 47 using an installation for a flip-chip assembly equipped with a vacuum fixation unit for chips 33 (Fig. 5) or a vacuum fixation unit of a switching substrate 43 '(Fig. 6).

Combining and forming the technological package of FIG. 47 is produced in three phases:

1. Phase 1 - phase of alignment (relative to the base axes 5 ') of the contacts 1' and 2 'of the chips 1 and 2 (Fig. 9a) with imitators of capillary holes 3', made in the form of through holes 6 'in a flat, rigid membrane 6 across templates of the carrier 3 of the capillary holes 3 ', the facing side A to the contacts 1 and 2' of the chips 1 and 2 and which is the upper part of the evacuated area 10 of the chip vacuum fixing unit (Fig. 12a) having a housing 7 with base pins 11 and a bottom 8 with a channel 9 for vacuum pumping.

Phase 1 is completed by transferring chips 1 and 2 to a rigid, flat technological carrier 22 of chips 1 and 2 (hereinafter referred to as the technological carrier of chips) (Fig. 27), which is part of the technological package (Fig. 47), while maintaining alignment relative to the base axes 5 '.

2. Phase 2 - phase of alignment (relative to the base axes 5) of the contacts 4 of the switching substrate 4 (Fig. 9a) with imitators of capillary holes 3 ', made in the form of through holes 6 in a flat, rigid membrane 6 according to the templates of the carrier 3 capillary holes 3, the facing side B to the contacts 4 'of the switching substrate 4 and which is the upper part of the evacuated region 10 of the chip vacuum holding assembly (Fig. 12a) having a housing 7 with base pins 11 and a bottom 8 with a channel 9 for vacuum pumping.

Phase 2 is completed by transferring the switching substrate 4 (Fig. 9a) onto a rigid, flat technological carrier 25 of the switching substrate 4 (hereinafter, the technological carrier of the switching substrate), which is part of the technological package (Fig. 47), while maintaining alignment relative to the base axes 5.

3. Phase 3 - the final assembly of the technological package (Fig. 47), consisting of the technological carrier 25 of the switching substrate 4, oriented upwards by the contacts 4 ', into the base holes of which, with the axes 5', compatible with the axes of the base pins 11 (Fig. 42 , 43), inserted pins 11 'located on the said pins 11', above the technological carrier 25 of the switching substrate 4, the carrier 3 of the capillary holes 3 ', oriented B side down, to the contacts 4' of the technological carrier 25 of the switching substrate (Fig. 44, 45 ); placed on the mentioned pins 11, above the carrier 3 of the capillary holes 3, the technological carrier 22 of the chips 1 and 2, oriented contacts 1 'and 2' downward, towards side A of the said carrier 3 (Fig. 46, 47).

The process of combining chips on the proposed installation in phase 1 'is as follows. On the coordinate table 12 of the installation (Fig. 5), which has manipulators 32 and 31 for manually controlling the movement of MKM parts along the X and Υ coordinates, place and fasten the chip holding unit 33 with a flat, rigid membrane 6, whose A side is facing up (on Fig. 12a). The evacuated volume 10 of the node 33, through the channel 9 (Fig. 12a), is connected by a hose 35 to the vacuum pump 34 (Fig. 5).

A chip 1 is placed above the alignment area with the membrane 6, with contacts 1 pointing downward (Fig. 5), which is captured from the process tray 27 and held by vacuum tweezers 13 located on the lower end of the rod 29 of the control unit 28, by means of the manipulator 30, by vertical movements and the rotation of the chip relative to the axis Ζ, with the possibility of horizontal movements in the area of the pallet 27. The node 28 is connected by a hose 36 to the vacuum pump 34.

A dual prism 16 (Fig. 8a) is introduced into the space between the chip 1 and the membrane 6 of the optical-mechanical alignment system of the installation, including the optical path dual prism 16 color video camera 18 - color video monitor 20, designed to simultaneously display on the video monitor 20 images of objects located on two opposite surfaces, and two paths for controlling mechanical movements:

the path of movements of the coordinate table 12 in the plane ΧΥ;

the path of rotation of the chip 1 around the axis Ζ.

- 14 014277

In this case, the feedback in the operator-manipulator system - manipulators 31, 32, 30 (X, Υ, Ζ) - alignment objects is carried out by the installation operator by means of visual control of the alignment process on the screen of video monitor 20.

In the process of controlled movements in the ΧΥ plane of the membrane 6 of the node 33 of the vacuum fixation of chips mounted on the coordinate table 12 (Fig. 8a), and the rotation of the chip 1 around the оси axis (Fig. 14, 15), while visually checking the alignment of images on the screen of a color video monitor 20, the symmetry axes (parallel to the оси axis) of the contacts of the chip 1 and the counter holes in the membrane 6 are aligned.

After completion of the alignment process, the dual prism 16 of the optical-mechanical system is removed from the space between the chip 1 and the membrane 6 (Fig. 16) and the rod 29 of the chip positioning unit 28 along the оси axis lowers the chip 1 until its contacts come into contact with the counter holes of the membrane 6, without loss precision alignment (Fig. 17, 18) and mechanically locks the chip 1 in this position.

Then, air is pumped out from region 10 of node 33 (Fig. 19) with a vacuum pump 34 through a hose 35 (Fig. 5), when the vacuum tweezers 13 that hold the chip 1 are turned off, which ensures the vacuum fixation of the chip 1 on the membrane 6 and that allows to raise the rod 14 with vacuum tweezers 13 (Fig. 20) for performing the above combination operations, sequentially, with all the remaining chips that are part of the multi-chip module.

After combining and vacuum fixing on the membrane 6 of the node 33 of all chips (Fig. 21), sequentially, landing on the base pins 11 of the node for vacuum fixing of the chips is performed:

the sealing gasket-frame 21 (Fig. 22), and the sealing gasket frame can be made in the form of cross-shaped jumpers (Fig. 23);

a rigid, flat technological carrier of chips 22, with a film fixed 23 from below, on the lower surface of which, in contact with the chips, a thin layer of glue 24 is applied (Figs. 24, 25), while the technological carrier of chips can be made with cross-shaped jumpers 44 ', which are intended for rigid fixation of the zones 44 of the carrier 22, having the dimensions of the chips, relative to the base holes located at the corners of the carrier 22 and compatible with the base pins 11 and 11' (Fig. 24).

After gluing the chips to the technological carrier of the chips 22 and turning off the vacuum in the volume 10 of the unit for vacuum fixing the chips, the mentioned technological carrier 22 with the glued chips is removed from the base pins 11 (Fig. 26, 27) and phase 1 of alignment and formation of the technological package is completed (Fig. 47).

The process of combining the switching substrate in the installation of FIG. 6 in phase 2 is as follows.

On the coordinate table 12 of the installation (Fig. 6), having manipulators 32 and 31 for manually controlling the movement of the table along the coordinates Χ and Υ, place and fix the unit 43 for vacuum fixing the switching substrate with the membrane 6 (Fig. 12a), side B of which is facing up (in Fig. 12, in a plan view, the membrane 6 is not shown). The evacuated volume 10 of the node 43, through the channel 9 (Fig. 12a), is connected by a hose 35 to the vacuum pump 34 (Fig. 6).

Above the alignment area with the membrane 6, a switching substrate 4 is placed, with the contacts 4 ′ directed downward (FIG. 6), which is captured from the process tray 27 and held by the vacuum tweezers 13 located on the lower end of the rod 29 of the control unit 28 (FIG. 6), by means of the manipulator 30, vertical movements and rotations of the switching substrate relative to the axis Ζ, with the possibility of horizontal movements in the area of the pallet 27. The node 28 is connected by a hose 36 to the vacuum pump 34 (Fig. 6).

A dual prism 16 (Fig. 29) is introduced into the space between the switching substrate 4 and the membrane 6 (Fig. 29) of the optical-mechanical alignment system of the installation (Fig. 6), which includes the optical path, the dual prism 16 - a color video camera 18 - a color video monitor 20, intended for simultaneous display on video monitor 20 images of objects located on two opposing surfaces, and two paths for controlling mechanical movements:

the path of movements of the coordinate table 12 in the plane ΧΥ;

the rotation path of the switching substrate 4 around the axis Ζ.

In this case, feedback in the operator-manipulator system 31, 32, 30 (X, Υ, Ζ) - alignment objects is carried out by the installation operator through visual control of the alignment process on the screen of video monitor 20.

In the process of controlled movements in the ΧΥ plane of the membrane 6 of the node 43 of the vacuum fixation of the switching substrate mounted on the coordinate table 12 (Fig. 6), and the rotation of the switching substrate 4 around the Ζ axis (Fig. 29, 30), with visual control of the combination of images on the screen color video monitor 20, the symmetry axes (parallel to the оси axis) of the contacts of the switching substrate 4 and the counter holes in the membrane 6 are aligned.

After completion of the alignment process, the dual prism 16 of the optical system is removed from the space between the switching substrate 4 and the membrane 6 (Fig. 31) and the rod 29 of the node 28 for positioning the switching substrate along the оси axis lowers the switching substrate 4 until its contacts 4 are in contact the holes of the membrane 6, without loss of alignment accuracy (Fig. 32) and mechanically fixes the switching substrate 4 in this position.

Then, air is pumped out from region 10 of node 43 (Fig. 33) with a vacuum pump 34 through a hose 35 (Fig. 6), when the vacuum tweezers 13 that hold the switching substrate 4 are turned off, which ensures vacuum fixing of the switching substrate 4 on the membrane 6 and that allows raise the stem 29 with vacuum tweezers 13 (Fig. 34, 35).

After combining and vacuum fixing on the membrane 6 of the node 43 of the switching substrate 4 (Fig. 33), the base pins 11 of the vacuum fixing node of the switching substrate (Fig. 36) are sequentially planted:

sealing gasket-frame 21 (Fig. 36, 37);

a rigid, flat technological carrier 25 of the switching substrate 4 (hereinafter referred to as the technological carrier of the switching substrate), with a film 23 fixed at the bottom, on the lower surface of which, in contact with the switching substrate 4, a thin layer of adhesive 24 is applied (Fig. 38, 39), while the rigid, flat technological carrier 25 of the switching substrate is made with jumpers 45 (Fig. 38a).

After gluing the switching substrate 4 to the technological carrier 25 and turning off the vacuum in the volume 10 of the vacuum fixing unit of the switching substrate, the mentioned technological carrier 25 with the glued switching substrate is removed from the base pins 11 (Fig. 40, 41) and phase 2 of combination and formation of the technological package is completed (Fig. 47).

The process of finishing assembly of the technological package (Fig. 47) - phase 3, is completed as follows. In the base holes of the technological carrier 25 of the switching substrate 4 (FIG. 42), with the axes 5 ′ compatible with the axes of the base pins 11 of said nodes 33 and 43, pins 11 ′ are inserted (FIG. 42, 43), wherein the technological carrier 25 oriented in such a way that the contacts 4 'of the switching substrate 4 are directed upward.

Then, on the mentioned pins 11 ', through the base holes 5 in the carrier 3 of the capillary holes 3' (Fig. 9a), the above-mentioned carrier 3 is oriented, oriented B side down, to the contacts 4 'of the technological carrier 4 (Fig. 44, 45) . Then, on the mentioned pins 11, through the base holes in the technological carrier 22 of the chips, with axes 5 compatible with the axes of the base pins 11 of the said nodes 33 and 43, the mentioned technological carrier 22 of the chips 1 and 2, oriented by the contacts 1 'and 2', is put on said chips down toward side A of said carrier 3 (FIGS. 46, 47).

Thus, the process package of FIG. 47 implements the combination of MKM parts necessary to achieve the result depicted in FIG. 11a.

Industrial applicability

Based on the proposed group of inventions, it is possible to form an assembly site for R&D prototyping and small-scale production of MKM using capillary assembly technology.

The minimum composition of the main equipment of the site: two units for combining and planting crystals and one unit for vacuum soldering, moreover, the unit will be implemented on the basis of solutions in accordance with the proposed group of inventions. Estimation of the productivity of such a minimum area of 100 thousand MKM per year.

Multiple scaling of the site increases its productivity in the corresponding multiplicity. In addition, according to the results of the operation of the MKM assembly section using capillary assembly technology, based on advanced standard equipment, it seems possible and appropriate to create our own desktop type assembly machine that optimally combines the two main operations of capillary assembly: combining 3 contact carriers and vacuum soldering .

This will harmonize the process of capillary assembly, improve the quality and productivity of the assembly and at the same time reduce the cost of assembly equipment several times, which, ultimately, will contribute to the spread of capillary assembly.

Analysis of the market volume of equipment for small-scale assembly of MKM showed the following. Company BT. Ttekku AS supplies about 50 T-300x-RS3 units per year, for approximately € 5 million. In Moscow, the installation of the T-3002-PC3, in a contractual configuration, costs the customer 135,000 € (on the conditions of delivery of the WAREHOUSE MOSCOW, including packaging, transportation to Moscow with insurance, customs clearance, installation supervision, commissioning, training, 1 year Warranties, VAT 18%).

We can assume that there are approximately 10 suppliers of desktop assembly equipment for small-scale flip chip assemblies in the world, with a total annual output of ~ 500 units of ~ 100 thousand € / pcs for a total amount of ~ 50 million €.

Market volume alone is negligible. But this equipment, despite the low productivity (up to 100 thousand units / year), plays a huge role in the prototyping and testing of new MKM products in the R&D process. Moreover, the actual cost (price) of prototypes of the final product (MKM) may differ 100-1000 times from the price of this product in serial production - and this is normal for R&D. Those. the business is not in the supply of equipment (the market is divided here), but in the production of high-value final R&D products with the help of this equipment adapted to

- 16 014277 capillary assembly based on the invention.

Economic evaluation of the claimed group of inventions was carried out as follows. It is known that at the stage of development and testing of the design of a custom-made product, it is necessary to assemble and test about two thousand pieces of experimental and prototypes of products (approximately two thousand products are required for the volume of tests according to the US standard for assembling microelectronics products 1EOEES). Then follows an order for the manufacture of batches of products ~ 10 thousand pieces. So, it takes ~ 12 thousand products for R&D + production of a custom batch.

Serving ten R&D per year is an assembly of 20 thousand (R&D) +100 thousand (pilot production) = 120 thousand MKM per year. This is an annual load for two T-300x-PC3 units from Όγ. Tzezku AO (Switzerland) worth about ~ 2 x 100 = 200 thousand € (it is advisable to have 2 units as part of the minimum assembly area: one for R&D service, the other for pilot production).

Let us estimate the cost of assembling MKM in R&D prototyping and pilot production using the example of MKM with a silicon switching substrate 100x100 mm for 16 chips with dimensions 10x10 mm and a matrix of 20x20 = 400 contacts.

Chip cost: 16 chip x 20 € / chip = 320 €. The cost of assembling such an MKM in R&D is approximately 100% of the cost of the chips, i.e. about 300 € / pcs. The assembly cost in pilot production is approximately 30% of the cost of the chips, i.e. about 100 € / pcs.

T.O. the aforementioned minimum assembly site can produce 1i-1es11 levels per year of 300 € / unit x 20 thousand units (R&D) + 100 € / unit x 100 thousand units (pilot production) = 6 million € (R&D) + 10 million € ( pilot production) = 16 million / € per year (this does not take into account the cost of component chips, i.e., in fact, this is the surplus value from assembly). An example of the demand for the described works is the ROSKOSMOS order (the results of the 2006 competition are posted on the official ROSKOSMOS website: yyr: //tetete.go8CO8to8.gi/6o8Ogbeg8L181.a8r? MOKOEK = 21.

Below is the contents of the RKA Order (ROSKOSMOS) for the development of manufacturing technology and equipment for the assembly of MKM.

Order: development of design and technological solutions for the manufacture of a specialized multi-chip module (MKM) in volumetric planar design based on large open-circuit integrated circuits (LSI) for on-board information processing devices for RCT products.

Group: OCD.

Won: The amount of the state contract is 17,400 thousand rubles ($ 725 thousand, at the rate of $ 1 = 24 rubles).

Customer: ROSKOSMOS.

Assignment: Creation of technological processes for manufacturing a specialized multi-chip module in volumetric planar design based on open-frame LSIs for on-board information processing devices with the following parameters:

the number of crystals in MKM, pcs - 20-30;

density of conductors in MKM, cm / cm ² - 2000;

minimum width of conductors, microns - 10.

The data given (in terms of price and assignment) are typical of R&D for the design, manufacture and testing of pilot batches of custom-made MKM.

Reasonable scaling and optimization of the assembly site, taking into account the patented exclusivity of the main aspects of C2 / C3-MKM capillary assembly technology, creates the prerequisites for creating highly profitable assembly production of the required performance for the production of unique MKM products.

A similar assembly production of the global industry of microelectronic equipment is called azerbaijan Goipbgu. The applicants, the authors of this invention, in the 2000s interacted with the similar company Goiibgu - 1RAC company in the city of San Jose (USA), specializing in experimental and pilot assembly (welding method) during BOA packaging of new products (chips) of their customers ( ~ 70 companies, including: AME, ХШЕЫХ and other well-known companies).

For the successful implementation of the business project for the creation of assembly production (azzo Goipbgu) for R&D prototyping and pilot production of MKM based on C2 / C3-MKM capillary assembly technology, it is necessary to provide patent protection for structural and technological solutions and devices for this application.

The know-how accumulated in the process of building up the Goipbgu for MKM and debugging the MKM design-assembly route on it through it will not only reach the desired annual production volumes for assembling custom MKM (for example, ~ 200 million €), but it will also open the way for a new a round of business - the licensed replication of the AoGo Goibbg for TT customers who determine the necessary productivity of their own pilot production for the production of specific designs of MKM.

Claims (14)

CLAIM 1. A method of combining elements of multichip modules, including preparing contacts on chips and a switching substrate for soldering, placing and fixing the switching substrate with contacts up on the coordinate table of the alignment unit, having manipulators that move the switching substrate in the plane, grabbing the first chip with technological contacts down the pallet with vacuum tweezers of the manipulator along the Ζ alignment installation axis and its placement over the switching substrate in the meeting area contacts of the first chip and the switching substrate, entering into the space between the said chip and the area of the switching substrate with response contacts of the double prism of the optical-mechanical system of combining the images of counter contacts, combining on the color monitor of the image of the contacts of the first chip with images of counter-opposite contacts of the switching substrate taken camera through the said double prism, controlling the movement of the switching substrate, fixed on the coordinate install unit, by coordinates Χ, Υ, and rotating the first chip around the axis, removing, after completing the dual prism, optical-mechanical system for combining images of oncoming contacts from the space between the first chip and the switching substrate, precision, without loss of mutual orientation along the axes , Υ, lowering the first chip along the axis Ζ until its contacts come into contact with the contact contacts of the switching substrate and its temporary, until soldering is completed, fixing in this position with the manipulator along the axis, final fixation with embedded counter-contacts of the chip and the switching substrate by soldering, moving the manipulator along the Ζ axis from the first chip fixed by soldering on the switching substrate, and repeating the above operations with all other chips of the multi-chip module, characterized in that they prepare the contacts on the chips and the switching substrate for soldering through capillary openings made in a flat carrier of a dielectric material are placed and fixed on said coordinate unit of the combining unit a vacuum unit me fixing chips on a flat rigid membrane installed in the upper part of the body of the above-mentioned assembly unit and containing through holes - simulators of capillary holes formed in the said membrane according to the templates of the said carrier of capillary holes, place the first chip with the contacts downwards , above the alignment area with the reciprocal through holes in the said membrane, the dual prize is introduced into the space between the first chip and the membrane area with the reciprocal through holes The optomechanical system for combining images of counter-contacts of the above installation combines on the color monitor screen images of the contacts of the first chip with images of reciprocal through holes in the membrane, captured by a video camera through a double prism of the optical-mechanical system, controlling the movement of the membrane of the vacuum fixation unit attached to the axis of the installation, according to the coordinates Χ, Υ and rotating the first chip around the axis Ζ, output, at the completion of the combination, a dual optical lens o-mechanical system of combining images of opposing contacts from the space between the first chip and the said membrane, produces a precision, without loss of mutual orientation along the Χ, Υ axes, lowering the first chip along the axis until its contacts with the reciprocal through holes made in the said membrane, and fixing the first chip in this position with the manipulator along the Ζ axis, then, carrying out air pumping out of the volume under the membrane, fix the first chip on the membrane of the vacuum fixing unit of the chips and move the manipulator n about the axis Ζ of the installation from the first chip fixed on the membrane of the vacuum fixation unit, after which the above operations are carried out with all the other chips of the multi-chip module, fixing all the chips on the membrane of the vacuum fixing unit of the chips, and then fitting the sealing pads of the vacuum block fixing chips, and then landing on the same pins of a hard, flat technological carrier of chips with glued film on the bottom, covered with a layer of glue in the areas of contact with the chips, glue the chips The back side of the hard carrier is mentioned, after which the vacuum fixing of the chips on the flat, rigid membrane of the vacuum fixation unit of the chips is turned off, the rigid, flat carrier with glued chips is removed from the base pins of the vacuum fixation unit, and then placed and fixed on the coordinate table Υ, Υ of the installation node for vacuum fixation of the switching substrate on a flat, rigid membrane installed in the upper part of the body of the said node containing through holes - simulators of capillary holes, will form data in the above-mentioned membrane using templates of the aforementioned carrier of capillary holes, capture the switching substrate with the contacts down from the technological pallet by the above-mentioned vacuum manipulator tweezers along the axis Ζ of the above-mentioned alignment device in the said membrane, is introduced into the space between the switching substrate and the area of the membrane with the response through holes the dual prism of the optomechanical system for combining images of counter contacts of the above installation, combines on the color monitor of the monitor images of the contacts of the switching substrate with images of the response through holes in the membrane, shot by the video camera through the twin prism of the optical mechanical system, controlling the movement of the node's membrane vacuum fixation of the switching substrate, fixed on the coordinate table of the installation by coordinates Χ, Υ, and rotating the switching substrate around the Ζ axis, after the alignment is completed, the dual prism of the optical-mechanical system of combining the images of opposing contacts from the space between the switching substrate and the flat, rigid membrane of the vacuum fixation unit of the switching substrate, produces a precision without loss of mutual orientation along the axes Χ, Υ lowering the switching substrate along axis Ζ until the contact of its contacts with the response through holes in the membrane and fixing the switching substrate in this position with the manipulator along the axis, then, carrying out air pumping from the volume under a flat, rigid membrane, fix the switching substrate on a flat, rigid membrane of the vacuum fixation unit of the switching substrate, then remove the manipulator along the installation axis от from the switching substrate fixed to the flat, rigid membrane of the vacuum fixation node of the switching substrate , then the landing pins of the vacuum fixation unit of the switching substrate of the gasket-frame and rigid flat technological unit are sequentially seated. The switch core of the switching substrate with glued underneath film covered with a glue layer in the contact area with the switching substrate is glued with the back of the switching substrate to the rigid, flat technological carrier of the switching substrate, and the vacuum fixation of the switching substrate on the rigid, flat membrane of the vacuum fixation switch is disconnected from the vacuum fixation of the switching substrate on the rigid, flat membrane of the vacuum fixation block of the switching substrate of the switching substrate, on the rigid, flat, membrane of the vacuum fixation switch of the switching substrate of the switch from the base pins of the vacuum fixing unit of the switching substrate, the mentioned technological carrier with glued comm an installation substrate, after which the base pins compatible with the base pins of the above-mentioned vacuum fixing nodes of the chips and the switching substrate, the process carrier with glued switching substrate with the contacts facing up, are seated, the capillary holes with the side corresponding to the switching substrate directed down, and then landing on the same basic pins of the technological carrier with glued-on chips with the contacts down, which completes the combination of the contacts of the chip s with opposite contacts of the switching substrate through capillary holes made in the above-mentioned flat carrier of a dielectric material, and receive a package of parts multi-chip module, prepared for the capillary assembly in the installation of vacuum soldering. 2. Installation for implementing the method according to claim 1, comprising a base, on the upper surface of which an optical-mechanical system combining the counter contacts of the chips and the switching substrate is placed, containing a two-coordinate table with manipulators for controlling movements in the horizontal plane along the axes Χ and Υ switching substrate, fixed on the table, a node with a manipulator of vertical displacements and rotations of the chips along the axis through a vertically located rod with vacuum tweezers at its lower end, along connected to the vacuum pump, which serves to capture and hold the chips in the process of combining, with the said unit being equipped with a horizontal displacement drive, serving to reach the area of the technological pallet with the chips placed on it, delivering them in turn, and placing them on the switchboard a substrate fixed on the two-coordinate table, a dual prism of the said opto-mechanical system, a color video camera and a color monitor for displaying recalled opposite contacts in the process of combining them by controlling the movement of the switching substrate by coordinates Χ, Υ and chip turns around the axis Ζ, characterized in that the said installation is additionally equipped with a vacuum fixing unit for the chips and a vacuum fixing unit for the switching substrate, and the said vacuum fixing units are made with the possibility of fixing on the two-coordinate table and connecting to a vacuum pump through independent channels. 3. Installation according to claim 2, characterized in that the vacuum fixing unit of the chips, mounted on the two-coordinate installation table, contains a predominantly rectangular case with a bottom, in which a channel is made for pumping air from the cavity formed by the bottom, side walls of the said case and rigid, with a flat membrane, on the upper surface of which chips are fixed, with base fitting holes at its corners, placed on the upper end of the case, at the corners of which there are base pins of the chip vacuum fixing unit, seal A liner frame with holes in the corners, by means of which it is mounted, like a membrane, on the said base pins on top of the membrane, in which, besides the landing holes, there are holes made in a single coordinate grid of counter-contacts of the chips, the switching substrate and the carrier of the capillary holes, hard, flat technological carrier of chips, made of heat-conducting material with holes in the corners, made similar to the holes in the gasket-frame, on the bottom side otorrhea heat-resistant film is fixed on the lower surface of which places it in contact with the chips suffered a thin layer of adhesive. 4. Installation according to claim 2, characterized in that the vacuum fixation unit of the switching substrate, mounted on the two-coordinate installation table, contains a predominantly rectangular case with a bottom, in which a channel is made for evacuating air from the cavity formed by the bottom, - 19 014277 side walls of the above-mentioned case and a rigid, flat membrane, on the upper surface of which a switching substrate is fixed with mounting holes at its corners, placed on the upper end of the case, at the corners of which are the basic pins of the vacuum fixation node of the switching substrate, a sealing gasket-frame holes in the corners, by means of which it is worn, like a membrane, on the said base pins on top of the membrane, in which, besides the landing holes, there are holes made in one ordinate grid of counter-contacts of the chips, switching substrate and carrier of capillary holes, rigid, flat technological carrier of the switching substrate, made of heat-conducting material with holes in the corners, made similar to the holes in the sealing gasket frame, on the lower side of which a heat-resistant film is fixed, on the bottom surface which in the places of its contact with the switching substrate a thin layer of glue is applied. 5. Installation according to any one of paragraphs.3 or 4, characterized in that the holes in said flat, rigid membrane are formed according to templates of the carrier of capillary holes. 6. Installation according to any one of paragraphs.3 or 4, characterized in that the sealing gasket-frame is made with dimensions equal to the outer contour of the end of the case. 7. Installation according to claim 3, characterized in that the thickness of the sealing gasket-frame is made equal to the thickness of the chip. 8. Installation according to claim 4, characterized in that the thickness of the sealing gasket-frame is made equal to the thickness of the switching substrate. 9. Installation according to claim 3, characterized in that the rigid, flat technological carrier of the chips is made of heat-conducting material. 10. Installation according to claim 4, characterized in that the rigid, flat technological carrier of the switching substrate is made of heat-conducting material. 11. Installation according to claim 3, characterized in that the evacuated area under the membrane of the vacuum fixing unit of the chips is divided by airtight partitions into zones under the chips, each zone being evacuated through its channel in the bottom of the housing independently of other zones. 12. Installation according to claim 3, characterized in that said technological carrier of chips is a frame that coincides in size and base holes with the above-mentioned sealing gasket-frame, and fragments made in the dimensions of the chips, and these fragments are associated with the frame and between themselves strong jumpers, and the aforementioned film, attached at the bottom, is made solid. 13. Installation according to claim 4, characterized in that the site of vacuum fixation of the switching substrate is made with a membrane for the switching substrate, consisting of individual fragments, with gaps between them in the плоскости plane. 14. Installation according to item 13, characterized in that at least some of these fragments are chips.