DK459786D0 - Fremgangsmaade til etablering af en klaebekontaktering - Google Patents

Fremgangsmaade til etablering af en klaebekontaktering

Info

Publication number
DK459786D0
DK459786D0 DK459786A DK459786A DK459786D0 DK 459786 D0 DK459786 D0 DK 459786D0 DK 459786 A DK459786 A DK 459786A DK 459786 A DK459786 A DK 459786A DK 459786 D0 DK459786 D0 DK 459786D0
Authority
DK
Denmark
Prior art keywords
establishing
procedure
complaint
contact
complaint contact
Prior art date
Application number
DK459786A
Other languages
English (en)
Other versions
DK163081C (da
DK163081B (da
DK459786A (da
Inventor
Kurt Fahrenschon
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of DK459786D0 publication Critical patent/DK459786D0/da
Publication of DK459786A publication Critical patent/DK459786A/da
Publication of DK163081B publication Critical patent/DK163081B/da
Application granted granted Critical
Publication of DK163081C publication Critical patent/DK163081C/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1028—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Liquid Crystal (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DK459786A 1985-09-27 1986-09-26 Fremgangsmaade til etablering af en klaebekontaktering DK163081C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853534502 DE3534502A1 (de) 1985-09-27 1985-09-27 Verfahren zum herstellen einer klebekontaktierung
DE3534502 1985-09-27

Publications (4)

Publication Number Publication Date
DK459786D0 true DK459786D0 (da) 1986-09-26
DK459786A DK459786A (da) 1987-03-28
DK163081B DK163081B (da) 1992-01-13
DK163081C DK163081C (da) 1992-06-15

Family

ID=6282128

Family Applications (1)

Application Number Title Priority Date Filing Date
DK459786A DK163081C (da) 1985-09-27 1986-09-26 Fremgangsmaade til etablering af en klaebekontaktering

Country Status (5)

Country Link
US (1) US4729165A (da)
EP (1) EP0219659B1 (da)
JP (1) JPH0779114B2 (da)
DE (2) DE3534502A1 (da)
DK (1) DK163081C (da)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2672460B1 (fr) * 1991-02-05 1993-04-16 Thomson Csf Procede de montage sur un substrat souple de composants electroniques miniatures a pattes de connexion a souder.
US5281684A (en) * 1992-04-30 1994-01-25 Motorola, Inc. Solder bumping of integrated circuit die
DE19710958C1 (de) * 1997-03-17 1998-08-20 Siemens Ag Strahlungsempfindlicher Wandler
US6405429B1 (en) * 1999-08-26 2002-06-18 Honeywell Inc. Microbeam assembly and associated method for integrated circuit interconnection to substrates
US7021124B2 (en) * 2004-08-27 2006-04-04 International Business Machines Corporation Method and apparatus for detecting leaks in a fluid cooling system
JP4544624B2 (ja) * 2004-09-28 2010-09-15 ローム株式会社 金属製端子板付きハイブリッド回路基板を製造するための素材基板及びハイブリッド回路基板を製造する方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
FR2311406A1 (fr) * 1975-05-13 1976-12-10 Honeywell Bull Soc Ind Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres
NL7704770A (nl) * 1977-05-02 1978-11-06 Philips Nv Werkwijze voor het aanbrengen van afstandstukjes op een isolerend substraat.
US4635354A (en) * 1982-07-22 1987-01-13 Texas Instruments Incorporated Low cost electronic apparatus construction method
DE3234744C2 (de) * 1982-09-20 1984-11-22 Siemens AG, 1000 Berlin und 8000 München Einrichten zum Halten mehrerer, jeweils mit integrierten Schaltkreisen versehenen Halbleiterplättchen beim Kontaktieren mit auf einem filmförmigen Substrat ausgebildeten Streifenleitern
FR2535110B1 (fr) * 1982-10-20 1986-07-25 Radiotechnique Compelec Procede d'encapsulation d'un composant semi-conducteur dans un circuit electronique realise sur substrat et application aux circuits integres rapides
DE3243227A1 (de) * 1982-11-23 1984-05-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum herstellen einer fluessigkristall-anzeigevorrichtung
JPS59124322A (ja) * 1982-12-29 1984-07-18 Matsushita Electric Ind Co Ltd 液晶パネルと回路基板との接続方法
US4631820A (en) * 1984-08-23 1986-12-30 Canon Kabushiki Kaisha Mounting assembly and mounting method for an electronic component

Also Published As

Publication number Publication date
DE3534502A1 (de) 1987-04-09
JPH0779114B2 (ja) 1995-08-23
EP0219659A1 (de) 1987-04-29
DE3666643D1 (en) 1989-11-30
JPS6279638A (ja) 1987-04-13
DK163081C (da) 1992-06-15
DK163081B (da) 1992-01-13
EP0219659B1 (de) 1989-10-25
DK459786A (da) 1987-03-28
US4729165A (en) 1988-03-08

Similar Documents

Publication Publication Date Title
DK108286D0 (da) Fremgangsmaade til fremstilling af en ketsjer
DK40087D0 (da) Fremgangsmaade til fremstilling af en termoklaeber
DK265085D0 (da) Fremgangsmaade til fremstilling af mikrokapsler
DK591286D0 (da) Fremgangsmaade til sikrede kommunikationer i et telekommunikationsanlaeg
DK160186D0 (da) Element til fastgoering af en ostomipose
DK165807C (da) Indretning til tilkobling af en hjaelpekontaktindretning
DK73186D0 (da) Fremgangsmaade til fremstilling af et varmeisoleret ledningsroer
DK155473C (da) Indretning til taending af et brandroer
DK222286D0 (da) Fremgangsmaade til haerdning af en coating
DK163081C (da) Fremgangsmaade til etablering af en klaebekontaktering
DK588886A (da) Fremgangsmaade til fremstilling af ammoniak
DK429686D0 (da) Fremgangsmaade til mikroindkapsling af pesticider
DK268186D0 (da) Fremgangsmaade til fremstilling af isatinforbindelser
DK158265C (da) Fremgangsmaade til fremstilling af en lacton
DK322885A (da) Kredsloeb til overvaagning af en tyristor
DK138485D0 (da) Fremgangsmaade til rensning af enzymholdig oploesning
DK159609C (da) Fremgangsmaade til understoetning af en isbrydning
DK526386D0 (da) Fremgangsmaade til fremstilling af baererkatalysator
DK159754C (da) Fremgangsmaade til fremstilling af et boersteelement
DK322585D0 (da) Kredsloeb til overvaagning af en tyristor
DK243385D0 (da) Fremgangsmaade til fremstilling af et kontaktfilter
DK193886A (da) Fremgangsmaade til fremstilling af carbapenemforbindelser
DK364986D0 (da) Fremgangsmaade til fremstilling af en let formdel
DK606085D0 (da) Fremgangsmaade til fremstilling af et bakterielt enzym
DK266186D0 (da) Fremgangsmaade til fremstilling af elektriske kredsloeb