DK417885A - Fremgangsmaade til forkromning og derved fremstillet genstand - Google Patents

Fremgangsmaade til forkromning og derved fremstillet genstand Download PDF

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Publication number
DK417885A
DK417885A DK417885A DK417885A DK417885A DK 417885 A DK417885 A DK 417885A DK 417885 A DK417885 A DK 417885A DK 417885 A DK417885 A DK 417885A DK 417885 A DK417885 A DK 417885A
Authority
DK
Denmark
Prior art keywords
chrome
procedure
prepared articles
articles
prepared
Prior art date
Application number
DK417885A
Other languages
English (en)
Other versions
DK417885D0 (da
Inventor
Jr Leslie Swift Wright
Original Assignee
Ladney Michael
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ladney Michael filed Critical Ladney Michael
Publication of DK417885D0 publication Critical patent/DK417885D0/da
Publication of DK417885A publication Critical patent/DK417885A/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/12847—Cr-base component
    • Y10T428/12854—Next to Co-, Fe-, or Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DK417885A 1984-09-14 1985-09-13 Fremgangsmaade til forkromning og derved fremstillet genstand DK417885A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/650,857 US4563399A (en) 1984-09-14 1984-09-14 Chromium plating process and article produced

Publications (2)

Publication Number Publication Date
DK417885D0 DK417885D0 (da) 1985-09-13
DK417885A true DK417885A (da) 1986-03-15

Family

ID=24610599

Family Applications (1)

Application Number Title Priority Date Filing Date
DK417885A DK417885A (da) 1984-09-14 1985-09-13 Fremgangsmaade til forkromning og derved fremstillet genstand

Country Status (8)

Country Link
US (1) US4563399A (da)
EP (1) EP0178772B1 (da)
JP (1) JPS6179799A (da)
AU (1) AU577149B2 (da)
BR (1) BR8504422A (da)
DE (1) DE3570460D1 (da)
DK (1) DK417885A (da)
ES (1) ES8606915A1 (da)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5131702A (en) * 1988-07-25 1992-07-21 Ardyne, Inc. Automotive bumper and its manufacturing process
JP2587951Y2 (ja) * 1990-09-20 1998-12-24 旭光学工業株式会社 防滴防水カメラ
US5266522A (en) * 1991-04-10 1993-11-30 International Business Machines Corporation Structure and method for corrosion and stress-resistant interconnecting metallurgy
US5175609A (en) * 1991-04-10 1992-12-29 International Business Machines Corporation Structure and method for corrosion and stress-resistant interconnecting metallurgy
US6090260A (en) * 1997-03-31 2000-07-18 Tdk Corporation Electroplating method
US6793796B2 (en) * 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
US6946065B1 (en) * 1998-10-26 2005-09-20 Novellus Systems, Inc. Process for electroplating metal into microscopic recessed features
US6238778B1 (en) 1998-11-04 2001-05-29 Ga-Tek Inc. Component of printed circuit boards
RU2158840C2 (ru) * 1999-01-21 2000-11-10 Открытое акционерное общество "НПО Энергомаш им. акад. В.П. Глушко" Корпус камеры жидкостного ракетного двигателя
US6491806B1 (en) * 2000-04-27 2002-12-10 Intel Corporation Electroplating bath composition
US20020112964A1 (en) * 2000-07-12 2002-08-22 Applied Materials, Inc. Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
CA2453299A1 (en) * 2001-07-17 2003-01-30 Hartchrom Ag Hard-chromed sieve basket
US20060086620A1 (en) * 2004-10-21 2006-04-27 Chase Lee A Textured decorative plating on plastic components
US20070158199A1 (en) * 2005-12-30 2007-07-12 Haight Scott M Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
US11225727B2 (en) 2008-11-07 2022-01-18 Lam Research Corporation Control of current density in an electroplating apparatus
US10011917B2 (en) 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
US9765437B2 (en) * 2009-03-24 2017-09-19 Roderick D. Herdman Chromium alloy coating with enhanced resistance to corrosion in calcium chloride environments
US9385035B2 (en) 2010-05-24 2016-07-05 Novellus Systems, Inc. Current ramping and current pulsing entry of substrates for electroplating
US9028666B2 (en) 2011-05-17 2015-05-12 Novellus Systems, Inc. Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2886499A (en) * 1957-01-07 1959-05-12 Glenn R Schaer Protective metal coatings for molybdenum
US2859158A (en) * 1957-01-31 1958-11-04 Glenn R Schaer Method of making a nickel-chromium diffusion alloy
NL233860A (da) * 1957-12-03 1900-01-01
NL248698A (da) * 1958-01-10
US2871550A (en) * 1958-01-10 1959-02-03 Udylite Res Corp Composite chromium electroplate and method of making same
US3478684A (en) * 1965-11-22 1969-11-18 Schafler Armando B Planographic printing plates
US3868229A (en) * 1974-06-10 1975-02-25 Int Nickel Co Decorative electroplates for plastics
JPS61130500A (ja) * 1984-11-29 1986-06-18 Kawasaki Steel Corp Ｓｎ／Ｃｒ２層めつき鋼板の製造方法

Also Published As

Publication number Publication date
AU4713285A (en) 1986-03-20
AU577149B2 (en) 1988-09-15
EP0178772A3 (en) 1986-06-18
JPH0154436B2 (da) 1989-11-17
EP0178772A2 (en) 1986-04-23
ES8606915A1 (es) 1986-05-01
BR8504422A (pt) 1986-07-15
ES546966A0 (es) 1986-05-01
DK417885D0 (da) 1985-09-13
JPS6179799A (ja) 1986-04-23
DE3570460D1 (en) 1989-06-29
US4563399A (en) 1986-01-07
EP0178772B1 (en) 1989-05-24

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AHB Application shelved due to non-payment