BR8504422A - Processo para eletrodepositar um acabamento de cromo sobre um substrato e artigo tendo um acabamento de cromo eletrodepositado - Google Patents

Processo para eletrodepositar um acabamento de cromo sobre um substrato e artigo tendo um acabamento de cromo eletrodepositado

Info

Publication number
BR8504422A
BR8504422A BR8504422A BR8504422A BR8504422A BR 8504422 A BR8504422 A BR 8504422A BR 8504422 A BR8504422 A BR 8504422A BR 8504422 A BR8504422 A BR 8504422A BR 8504422 A BR8504422 A BR 8504422A
Authority
BR
Brazil
Prior art keywords
chrome finish
electrodepositated
electrodepositing
item
substrate
Prior art date
Application number
BR8504422A
Other languages
English (en)
Inventor
Leslie Swift Wright Jr
Original Assignee
Ladney M Jr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ladney M Jr filed Critical Ladney M Jr
Publication of BR8504422A publication Critical patent/BR8504422A/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611Smooth layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556Organic component
    • Y10T428/12569Synthetic resin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12806Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826Group VIB metal-base component
    • Y10T428/12847Cr-base component
    • Y10T428/12854Next to Co-, Fe-, or Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
BR8504422A 1984-09-14 1985-09-13 Processo para eletrodepositar um acabamento de cromo sobre um substrato e artigo tendo um acabamento de cromo eletrodepositado BR8504422A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/650,857 US4563399A (en) 1984-09-14 1984-09-14 Chromium plating process and article produced

Publications (1)

Publication Number Publication Date
BR8504422A true BR8504422A (pt) 1986-07-15

Family

ID=24610599

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8504422A BR8504422A (pt) 1984-09-14 1985-09-13 Processo para eletrodepositar um acabamento de cromo sobre um substrato e artigo tendo um acabamento de cromo eletrodepositado

Country Status (8)

Country Link
US (1) US4563399A (pt)
EP (1) EP0178772B1 (pt)
JP (1) JPS6179799A (pt)
AU (1) AU577149B2 (pt)
BR (1) BR8504422A (pt)
DE (1) DE3570460D1 (pt)
DK (1) DK417885A (pt)
ES (1) ES8606915A1 (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5131702A (en) * 1988-07-25 1992-07-21 Ardyne, Inc. Automotive bumper and its manufacturing process
JP2587951Y2 (ja) * 1990-09-20 1998-12-24 旭光学工業株式会社 防滴防水カメラ
US5266522A (en) * 1991-04-10 1993-11-30 International Business Machines Corporation Structure and method for corrosion and stress-resistant interconnecting metallurgy
US5175609A (en) * 1991-04-10 1992-12-29 International Business Machines Corporation Structure and method for corrosion and stress-resistant interconnecting metallurgy
US6090260A (en) * 1997-03-31 2000-07-18 Tdk Corporation Electroplating method
US6793796B2 (en) * 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
US6946065B1 (en) * 1998-10-26 2005-09-20 Novellus Systems, Inc. Process for electroplating metal into microscopic recessed features
US6238778B1 (en) 1998-11-04 2001-05-29 Ga-Tek Inc. Component of printed circuit boards
RU2158840C2 (ru) * 1999-01-21 2000-11-10 Открытое акционерное общество "НПО Энергомаш им. акад. В.П. Глушко" Корпус камеры жидкостного ракетного двигателя
US6491806B1 (en) * 2000-04-27 2002-12-10 Intel Corporation Electroplating bath composition
US20020112964A1 (en) * 2000-07-12 2002-08-22 Applied Materials, Inc. Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
US20040195158A1 (en) * 2001-07-17 2004-10-07 Walter Gisin Hard-chromed sieve basket
US20060086620A1 (en) * 2004-10-21 2006-04-27 Chase Lee A Textured decorative plating on plastic components
US20070158199A1 (en) * 2005-12-30 2007-07-12 Haight Scott M Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
US10011917B2 (en) 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
US11225727B2 (en) 2008-11-07 2022-01-18 Lam Research Corporation Control of current density in an electroplating apparatus
US9765437B2 (en) * 2009-03-24 2017-09-19 Roderick D. Herdman Chromium alloy coating with enhanced resistance to corrosion in calcium chloride environments
US9385035B2 (en) 2010-05-24 2016-07-05 Novellus Systems, Inc. Current ramping and current pulsing entry of substrates for electroplating
US9028666B2 (en) 2011-05-17 2015-05-12 Novellus Systems, Inc. Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2886499A (en) * 1957-01-07 1959-05-12 Glenn R Schaer Protective metal coatings for molybdenum
US2859158A (en) * 1957-01-31 1958-11-04 Glenn R Schaer Method of making a nickel-chromium diffusion alloy
NL233860A (pt) * 1957-12-03 1900-01-01
NL248698A (pt) * 1958-01-10
US2871550A (en) * 1958-01-10 1959-02-03 Udylite Res Corp Composite chromium electroplate and method of making same
US3478684A (en) * 1965-11-22 1969-11-18 Schafler Armando B Planographic printing plates
US3868229A (en) * 1974-06-10 1975-02-25 Int Nickel Co Decorative electroplates for plastics
JPS61130500A (ja) * 1984-11-29 1986-06-18 Kawasaki Steel Corp Sn/Cr2層めつき鋼板の製造方法

Also Published As

Publication number Publication date
DK417885A (da) 1986-03-15
JPS6179799A (ja) 1986-04-23
AU4713285A (en) 1986-03-20
DK417885D0 (da) 1985-09-13
AU577149B2 (en) 1988-09-15
US4563399A (en) 1986-01-07
EP0178772A3 (en) 1986-06-18
DE3570460D1 (en) 1989-06-29
ES8606915A1 (es) 1986-05-01
EP0178772A2 (en) 1986-04-23
JPH0154436B2 (pt) 1989-11-17
ES546966A0 (es) 1986-05-01
EP0178772B1 (en) 1989-05-24

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