DK3500851T3 - Akustisk overfladebølge-rfid-sensor til kemisk detektering og (bio)molekylær diagnose - Google Patents

Akustisk overfladebølge-rfid-sensor til kemisk detektering og (bio)molekylær diagnose Download PDF

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Publication number
DK3500851T3
DK3500851T3 DK17745209.1T DK17745209T DK3500851T3 DK 3500851 T3 DK3500851 T3 DK 3500851T3 DK 17745209 T DK17745209 T DK 17745209T DK 3500851 T3 DK3500851 T3 DK 3500851T3
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DK
Denmark
Prior art keywords
bio
surface wave
acoustic surface
rfid sensor
chemical detection
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Application number
DK17745209.1T
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English (en)
Inventor
Ayal Ram
Original Assignee
Epitronic Holdings Pte Ltd
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Publication of DK3500851T3 publication Critical patent/DK3500851T3/da

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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/64Filters using surface acoustic waves
    • H03H9/6406Filters characterised by a particular frequency characteristic
    • H03H9/6416SAW matched filters, e.g. surface acoustic wave compressors, chirped or coded surface acoustic wave filters
    • H03H9/642SAW transducers details for remote interrogation systems, e.g. surface acoustic wave transducers details for ID-tags
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G01H11/08Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02Analysing fluids
    • G01N29/022Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2462Probes with waveguides, e.g. SAW devices
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/36Devices for manipulating acoustic surface waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66446Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/778Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7781Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with inverted single heterostructure, i.e. with active layer formed on top of wide bandgap layer, e.g. IHEMT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/778Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302Sensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/025Change of phase or condition
    • G01N2291/0256Adsorption, desorption, surface mass change, e.g. on biosensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/042Wave modes
    • G01N2291/0423Surface waves, e.g. Rayleigh waves, Love waves

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Acoustics & Sound (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
DK17745209.1T 2016-08-16 2017-07-10 Akustisk overfladebølge-rfid-sensor til kemisk detektering og (bio)molekylær diagnose DK3500851T3 (da)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201662375683P 2016-08-16 2016-08-16
US201662375711P 2016-08-16 2016-08-16
US201662375656P 2016-08-16 2016-08-16
US201662375670P 2016-08-16 2016-08-16
US201662375697P 2016-08-16 2016-08-16
PCT/IB2017/054141 WO2018033809A1 (en) 2016-08-16 2017-07-10 Surface acoustic wave rfid sensor for chemical detection and (bio)molecular diagnostics

Publications (1)

Publication Number Publication Date
DK3500851T3 true DK3500851T3 (da) 2020-12-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DK17745209.1T DK3500851T3 (da) 2016-08-16 2017-07-10 Akustisk overfladebølge-rfid-sensor til kemisk detektering og (bio)molekylær diagnose

Country Status (6)

Country Link
US (1) US10720902B2 (da)
EP (1) EP3500851B1 (da)
CN (1) CN110023748B (da)
DK (1) DK3500851T3 (da)
ES (1) ES2847890T3 (da)
WO (1) WO2018033809A1 (da)

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CN110718589B (zh) * 2018-07-12 2024-04-16 纳姆实验有限责任公司 具有半导体器件的电子电路的异质结构
US11309450B2 (en) 2018-12-20 2022-04-19 Analog Devices, Inc. Hybrid semiconductor photodetector assembly
US11302835B2 (en) 2019-01-08 2022-04-12 Analog Devices, Inc. Semiconductor photodetector assembly
WO2021021719A1 (en) 2019-07-31 2021-02-04 QXONIX Inc. Bulk acoustic wave (baw) resonator structures, devices and systems
TWI749369B (zh) * 2019-09-12 2021-12-11 黃知澍 N-face III族/氮化物磊晶結構及其主動元件與其閘極保護元件
CN111323458A (zh) * 2020-04-02 2020-06-23 中国科学技术大学 一种基于hemt气体传感器的气体检测装置和方法
CN111570208B (zh) * 2020-05-11 2021-08-06 浙江大学 表面波时频调控的局域化异质形复合材料制备装置及方法
BR102020010345A2 (pt) * 2020-05-22 2021-12-07 Fundação Universidade Federal De São Carlos Leitor e sensor de microrganismos baseados em alterações de propriedades eletromagnéticas de etiqueta rfid
US11898987B2 (en) * 2020-09-10 2024-02-13 Raytheon Company SAW-based hydrogel testing for detecting viruses or other antigens
CN112366228B (zh) * 2020-10-26 2024-02-20 苏州科技大学 一种自激励电阻计时器及其制备方法
IT202100000293A1 (it) * 2021-01-08 2022-07-08 St Microelectronics Srl Dispositivo e metodo di rilevamento di una variazione di ambiente operativo per un apparecchio elettronico
CN112881485B (zh) * 2021-01-14 2021-12-17 西安电子科技大学 一种用于检测次氯酸根的GaN传感器及检测方法
CN112668209B (zh) * 2021-01-29 2024-02-02 沈阳理工大学 一种基于电荷传递模型的聚吡咯执行器力学仿真方法
WO2022196713A1 (ja) * 2021-03-19 2022-09-22 京セラ株式会社 測定システム、解析プログラムおよび測定方法
US11874189B2 (en) * 2021-07-02 2024-01-16 Applied Materials, Inc. MEMS resonator sensor substrate for plasma, temperature, stress, or deposition sensing
CN113663646A (zh) * 2021-07-19 2021-11-19 中国计量大学 一种宽谱特异性抗体修饰的磁性金属有机骨架材料的制备方法与应用
US20230044262A1 (en) * 2021-08-05 2023-02-09 Applied Materials, Inc. Microwave resonator array for plasma diagnostics
US12003045B2 (en) 2021-10-20 2024-06-04 Samsung Electronics Co., Ltd. Wireless interconnect for high rate data transfer

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JP2006295126A (ja) * 2005-03-15 2006-10-26 Sumitomo Electric Ind Ltd Iii族窒化物半導体素子およびエピタキシャル基板
US20070139165A1 (en) * 2005-12-19 2007-06-21 Honeywell International, Inc. Acoustic wave device used as RFID and as sensor
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Also Published As

Publication number Publication date
EP3500851A1 (en) 2019-06-26
US10720902B2 (en) 2020-07-21
CN110023748B (zh) 2022-02-08
CN110023748A (zh) 2019-07-16
ES2847890T3 (es) 2021-08-04
WO2018033809A1 (en) 2018-02-22
EP3500851B1 (en) 2020-09-16
US20190187105A1 (en) 2019-06-20

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