DK3501105T3 - Akustisk overfladebølge-rfid-sensor til materiale- og strukturregistrering - Google Patents
Akustisk overfladebølge-rfid-sensor til materiale- og strukturregistrering Download PDFInfo
- Publication number
- DK3501105T3 DK3501105T3 DK17745514.4T DK17745514T DK3501105T3 DK 3501105 T3 DK3501105 T3 DK 3501105T3 DK 17745514 T DK17745514 T DK 17745514T DK 3501105 T3 DK3501105 T3 DK 3501105T3
- Authority
- DK
- Denmark
- Prior art keywords
- surface wave
- acoustic surface
- rfid sensor
- structure registration
- wave rfid
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6406—Filters characterised by a particular frequency characteristic
- H03H9/6416—SAW matched filters, e.g. surface acoustic wave compressors, chirped or coded surface acoustic wave filters
- H03H9/642—SAW transducers details for remote interrogation systems, e.g. surface acoustic wave transducers details for ID-tags
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2462—Probes with waveguides, e.g. SAW devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2481—Wireless probes, e.g. with transponders or radio links
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/042—Wave modes
- G01N2291/0423—Surface waves, e.g. Rayleigh waves, Love waves
Landscapes
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Acoustics & Sound (AREA)
- Computer Networks & Wireless Communication (AREA)
- Engineering & Computer Science (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662377774P | 2016-08-22 | 2016-08-22 | |
| PCT/IB2017/054140 WO2018037296A1 (en) | 2016-08-22 | 2017-07-10 | Surface acoustic wave rfid sensor for material and structure sensing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3501105T3 true DK3501105T3 (da) | 2020-12-21 |
Family
ID=59416752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK17745514.4T DK3501105T3 (da) | 2016-08-22 | 2017-07-10 | Akustisk overfladebølge-rfid-sensor til materiale- og strukturregistrering |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10523181B2 (da) |
| EP (1) | EP3501105B1 (da) |
| CN (1) | CN109891748A (da) |
| DK (1) | DK3501105T3 (da) |
| ES (1) | ES2839550T3 (da) |
| WO (1) | WO2018037296A1 (da) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887818B (zh) * | 2019-03-13 | 2024-03-12 | 西安众力为半导体科技有限公司 | 一种电子束器件及其制作方法 |
| EP3722762B1 (en) * | 2019-04-12 | 2021-11-03 | General Electric Technology GmbH | Sensor device |
| WO2021181218A1 (en) * | 2020-03-13 | 2021-09-16 | Epitronic Holdings Pte. Ltd. | Microelectronic sensors for monitoring material strength and strain in segmented nuts |
| CN111669145B (zh) * | 2020-05-30 | 2023-09-15 | 华南理工大学 | 一种可开关式体声波滤波器 |
| CN113125363B (zh) * | 2021-04-08 | 2022-03-29 | 清华大学 | 二维异质结材料界面缺陷检测方法及装置 |
| CN113358945B (zh) * | 2021-07-01 | 2023-07-28 | 兰州空间技术物理研究所 | 一种多功能空间高速尘埃特性探测器 |
| CN113794460B (zh) * | 2021-09-17 | 2024-02-23 | 中国科学技术大学 | 纳米声子晶体及其制备方法 |
| CN114613802B (zh) * | 2022-01-27 | 2024-04-19 | 南京邮电大学 | 一种基于saw的紫外光电探测器 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100455127B1 (ko) * | 2003-01-24 | 2004-11-06 | 엘지전자 주식회사 | 박막 용적 탄성파 공진기를 이용한 물질 센서 모듈 |
| US7112860B2 (en) * | 2003-03-03 | 2006-09-26 | Cree, Inc. | Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices |
| JP4440197B2 (ja) * | 2005-10-04 | 2010-03-24 | 日本電信電話株式会社 | 弾性表面波デバイスおよび集積回路 |
| US20070139165A1 (en) | 2005-12-19 | 2007-06-21 | Honeywell International, Inc. | Acoustic wave device used as RFID and as sensor |
| US8313968B2 (en) | 2007-08-21 | 2012-11-20 | Amal Elgawadi | Fabrication of GaN and III-nitride alloys freestanding epilayers membranes using a nonbonding laser |
| CN101504446B (zh) * | 2009-03-06 | 2011-04-20 | 华南理工大学 | 薄膜式结构磁流体-声表面波集成磁传感器 |
| US8960004B2 (en) * | 2010-09-29 | 2015-02-24 | The George Washington University | Synchronous one-pole surface acoustic wave resonator |
| US9147740B2 (en) * | 2012-07-03 | 2015-09-29 | Infineon Technologies Austria Ag | Stress-controlled HEMT |
| JP2015060987A (ja) * | 2013-09-19 | 2015-03-30 | 富士通株式会社 | 半導体装置及び半導体装置の製造方法 |
| CN105118859A (zh) * | 2015-07-29 | 2015-12-02 | 电子科技大学 | 一种隧穿增强型hemt器件 |
| CN105424780B (zh) * | 2015-11-26 | 2018-06-22 | 深圳代尔夫特电子科技有限公司 | 一种氮化镓传感器、制备方法和多传感器系统 |
-
2017
- 2017-07-10 WO PCT/IB2017/054140 patent/WO2018037296A1/en active Search and Examination
- 2017-07-10 CN CN201780065170.XA patent/CN109891748A/zh active Pending
- 2017-07-10 EP EP17745514.4A patent/EP3501105B1/en active Active
- 2017-07-10 DK DK17745514.4T patent/DK3501105T3/da active
- 2017-07-10 ES ES17745514T patent/ES2839550T3/es active Active
- 2017-07-10 US US16/326,163 patent/US10523181B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP3501105B1 (en) | 2020-09-16 |
| US20190190492A1 (en) | 2019-06-20 |
| US10523181B2 (en) | 2019-12-31 |
| EP3501105A1 (en) | 2019-06-26 |
| WO2018037296A1 (en) | 2018-03-01 |
| CN109891748A (zh) | 2019-06-14 |
| ES2839550T3 (es) | 2021-07-05 |
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