DK3279953T3 - Vindueselement til en pakke til en optisk indretning, pakke til en optisk indretning, fremgangsmåder til fremstilling heraf - Google Patents
Vindueselement til en pakke til en optisk indretning, pakke til en optisk indretning, fremgangsmåder til fremstilling heraf Download PDFInfo
- Publication number
- DK3279953T3 DK3279953T3 DK17183746.1T DK17183746T DK3279953T3 DK 3279953 T3 DK3279953 T3 DK 3279953T3 DK 17183746 T DK17183746 T DK 17183746T DK 3279953 T3 DK3279953 T3 DK 3279953T3
- Authority
- DK
- Denmark
- Prior art keywords
- package
- optical device
- manufacturing
- methods
- same
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/0092—Compositions for glass with special properties for glass with improved high visible transmittance, e.g. extra-clear glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Optical Couplings Of Light Guides (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016152518A JP6623968B2 (ja) | 2016-08-03 | 2016-08-03 | 光学素子パッケージ用窓材、光学素子パッケージ、それらの製造方法、及び光学素子用パッケージ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3279953T3 true DK3279953T3 (da) | 2021-07-05 |
Family
ID=59676953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK17183746.1T DK3279953T3 (da) | 2016-08-03 | 2017-07-28 | Vindueselement til en pakke til en optisk indretning, pakke til en optisk indretning, fremgangsmåder til fremstilling heraf |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10680139B2 (da) |
| EP (1) | EP3279953B1 (da) |
| JP (1) | JP6623968B2 (da) |
| KR (1) | KR102472367B1 (da) |
| CN (1) | CN107689412B (da) |
| DK (1) | DK3279953T3 (da) |
| TW (1) | TWI752991B (da) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211367401U (zh) * | 2017-05-12 | 2020-08-28 | Ａｇｃ株式会社 | 弯曲基材及支承构件 |
| US20190025128A1 (en) * | 2017-07-10 | 2019-01-24 | Brown University | Non-contact infrared measurement of surface temperature |
| US10811581B2 (en) * | 2018-06-15 | 2020-10-20 | Nichia Corporation | Method of manufacturing semiconductor device |
| EP3599414A1 (en) * | 2018-07-23 | 2020-01-29 | Shin-Etsu Chemical Co., Ltd. | Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods |
| JP2023070892A (ja) * | 2021-11-10 | 2023-05-22 | 信越化学工業株式会社 | 光学素子用窓材、光学素子パッケージ用リッド、光学素子パッケージ及び光学装置 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4032462B2 (ja) * | 1996-09-30 | 2008-01-16 | 株式会社ニコン | 紫外用光学素子 |
| JP2001196644A (ja) | 2000-01-11 | 2001-07-19 | Nichia Chem Ind Ltd | 光半導体装置及びその製造方法 |
| US6661084B1 (en) * | 2000-05-16 | 2003-12-09 | Sandia Corporation | Single level microelectronic device package with an integral window |
| CN1985201A (zh) * | 2004-07-15 | 2007-06-20 | 旭硝子株式会社 | 玻璃光波导 |
| JP2006173271A (ja) * | 2004-12-14 | 2006-06-29 | Matsushita Electric Ind Co Ltd | 半導体発光装置、照明装置、携帯通信機器、及びカメラ |
| JP4890775B2 (ja) | 2005-03-23 | 2012-03-07 | パナソニック株式会社 | 発光モジュール |
| KR100810754B1 (ko) * | 2006-03-03 | 2008-03-07 | 럭스피아(주) | 발광 유니트 및 이를 채용한 면발광 조립체 |
| EP2535744A3 (en) * | 2006-04-03 | 2013-10-09 | Nikon Corporation | Incidence surfaces and optical windows that are solvophobic to immersion liquids used in an immersion microlithography system |
| WO2008023827A1 (fr) * | 2006-08-25 | 2008-02-28 | Sanyo Electric Co., Ltd. | Dispositif semi-conducteur |
| JP4714112B2 (ja) * | 2006-08-30 | 2011-06-29 | 株式会社東海理化電機製作所 | 照明装置 |
| EP2070883B2 (en) * | 2006-09-11 | 2017-04-19 | Tosoh Corporation | Fused quartz glass and process for producing the same |
| TWI459040B (zh) * | 2008-09-29 | 2014-11-01 | Sumitomo Chemical Co | 模具之製造方法及防炫膜之製造方法 |
| JP2011128290A (ja) * | 2009-12-16 | 2011-06-30 | Hitachi High-Technologies Corp | 光源装置、及びそれを用いたバックライト、露光装置及び露光方法 |
| KR100998473B1 (ko) * | 2010-05-20 | 2010-12-06 | 전자부품연구원 | 자외선 발광 다이오드를 이용한 살균 장치 |
| WO2013133594A1 (en) * | 2012-03-05 | 2013-09-12 | Seoul Opto Device Co., Ltd. | Light-emitting device and method of manufacturing the same |
| KR101516358B1 (ko) * | 2012-03-06 | 2015-05-04 | 삼성전자주식회사 | 발광 장치 |
| JP2013187245A (ja) * | 2012-03-06 | 2013-09-19 | Stanley Electric Co Ltd | 半導体発光装置 |
| WO2014189221A1 (ko) * | 2013-05-23 | 2014-11-27 | 엘지이노텍주식회사 | 발광 모듈 |
| EP3010051B1 (en) * | 2013-06-12 | 2020-01-08 | NGK Insulators, Ltd. | Window material for ultraviolet-ray-emitting element and method for producing same |
| MY180533A (en) * | 2014-03-17 | 2020-12-01 | Shinetsu Chemical Co | Methods for working synthetic quartz glass substrate having a mirror-like surface and method for sensing synthetic quartz glass substrate |
| EP3038173B1 (en) * | 2014-12-23 | 2019-05-22 | LG Innotek Co., Ltd. | Light emitting device |
-
2016
- 2016-08-03 JP JP2016152518A patent/JP6623968B2/ja active Active
-
2017
- 2017-07-27 CN CN201710622430.0A patent/CN107689412B/zh active Active
- 2017-07-28 DK DK17183746.1T patent/DK3279953T3/da active
- 2017-07-28 EP EP17183746.1A patent/EP3279953B1/en active Active
- 2017-07-31 KR KR1020170096644A patent/KR102472367B1/ko active IP Right Grant
- 2017-08-02 US US15/667,249 patent/US10680139B2/en active Active
- 2017-08-02 TW TW106125997A patent/TWI752991B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US20180040778A1 (en) | 2018-02-08 |
| JP2018022760A (ja) | 2018-02-08 |
| US10680139B2 (en) | 2020-06-09 |
| TWI752991B (zh) | 2022-01-21 |
| KR102472367B1 (ko) | 2022-11-30 |
| JP6623968B2 (ja) | 2019-12-25 |
| KR20180015581A (ko) | 2018-02-13 |
| CN107689412A (zh) | 2018-02-13 |
| EP3279953A1 (en) | 2018-02-07 |
| CN107689412B (zh) | 2022-05-17 |
| TW201818569A (zh) | 2018-05-16 |
| EP3279953B1 (en) | 2021-05-12 |
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