DK2812638T3 - heat pump Interior - Google Patents

heat pump Interior Download PDF

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Publication number
DK2812638T3
DK2812638T3 DK13707538.8T DK13707538T DK2812638T3 DK 2812638 T3 DK2812638 T3 DK 2812638T3 DK 13707538 T DK13707538 T DK 13707538T DK 2812638 T3 DK2812638 T3 DK 2812638T3
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DK
Denmark
Prior art keywords
refrigerant
heat pump
collector
pump device
compressor
Prior art date
Application number
DK13707538.8T
Other languages
Danish (da)
Inventor
Markus Immel
Ulrich Hafner
Original Assignee
Viessmann Werke Kg
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Publication date
Application filed by Viessmann Werke Kg filed Critical Viessmann Werke Kg
Application granted granted Critical
Publication of DK2812638T3 publication Critical patent/DK2812638T3/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B43/00—Arrangements for separating or purifying gases or liquids; Arrangements for vaporising the residuum of liquid refrigerant, e.g. by heat
    • F25B43/006—Accumulators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/39—Dispositions with two or more expansion means arranged in series, i.e. multi-stage expansion, on a refrigerant line leading to the same evaporator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F25B1/10—Compression machines, plants or systems with non-reversible cycle with multi-stage compression
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B13/00—Compression machines, plants or systems, with reversible cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2313/00—Compression machines, plants or systems with reversible cycle not otherwise provided for
    • F25B2313/027—Compression machines, plants or systems with reversible cycle not otherwise provided for characterised by the reversing means
    • F25B2313/02741—Compression machines, plants or systems with reversible cycle not otherwise provided for characterised by the reversing means using one four-way valve
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/13—Economisers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/23—Separators

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Compression-Type Refrigeration Machines With Reversible Cycles (AREA)

Description

HEAT PUMP DEVICE
The invention relates to a heat pump device according to the preamble of patent claim 1. A heat pump device of the type mentioned initially is known from the patent document WO 2010/039682 A2. A heat pump device of this type is also known similarly according to JP 2001 153482 A. This consists inter alia of a compressor (in particular screw compressor) downstream of which a liquefier (also called condenser) is connected, downstream of which in turn a refrigerant collector (also called refrigerant tank) is connected. For intermediate injection of refrigerant into the compressor, the refrigerant collector is in this case connected to this via a refrigerant line .
Furthermore, in this heat pump device precisely as in the device according to the invention which is still to be explained, a controllable expansion valve is connected downstream of the refrigerant collector, downstream of which in turn an evaporator is connected, downstream of which in turn the already mentioned compressor is connected. The refrigerant circuit of JP 2001 153482 A thus corresponds to a very classical refrigerant circuit, but supplemented by a refrigerant collector for the intermediate injection of refrigerant into the compressor.
In the solution according to JP 2001 153482 A, a refrigerant inlet opening of the refrigerant line leading to the compressor always opens below the refrigerant level in the refrigerant collector during correct operation of the heat pump device, i.e., in this solution liquid refrigerant is always removed from the refrigerant collector which opens up the possibility of cooling the compressor, reducing the hot gas temperature and therefore expanding the limits of usage of the heat pump device compared with a classical refrigerant circuit without refrigerant collector.
It is the object of the invention to further improve a heat pump device of the type mentioned initially. In particular, the limits of use or the efficiency of such a heat pump device should be expanded or increased even further.
This object is solved by the features specified in the characterizing part of patent claim 1.
According to the invention, it is therefore provided that depending on the setting of the expansion valve the refrigerant line has a refrigerant feed opening which opens above and/or below the refrigerant level as desired during operation of the heat pump device, wherein a section of the refrigerant line is arranged in the refrigerant collector and wherein the section has a vertical extension direction.
In other words, the heat pump device according to the invention is in particular characterized in that the refrigerant level in the refrigerant collector can be set via the expansion valve, wherein the refrigerant feed opening is configured so that depending on the setting of the expansion valve it is configured to open as desired above and/or below the refrigerant level. The stipulation "and/or" here means that the refrigerant line with its refrigerant feed opening is either configured so that the refrigerant feed opening opens either above or below the refrigerant level or that the refrigerant feed opening is configured so that it opens both above and also below the refrigerant level, which can be achieved as desired by a suitably large refrigerant feed opening or by a plurality of refrigerant feed openings on the refrigerant line guided into the refrigerant collector.
Unlike the initially mentioned heat pump device, in the heat pump device according to the invention it is therefore possible to supply as desired pure refrigerant vapour, liquid refrigerant or also refrigerant wet vapour to the compressor. The state of aggregation in which the refrigerant is injected into the compressor here can be specified via the controllable expansion valve and therefore via the refrigerant level in the refrigerant collector.
The injection of vaporous refrigerant improves the efficiency and performance of the heat pump device.
The injection of liquid refrigerant affords the possibility, as mentioned previously, of cooling the compressor to reduce the hot gas temperature and therefore extend the limits of use .
As a result of the injection of refrigerant wet vapour, i.e. the combination of the two aforesaid possibilities, the advantages of the two injection methods can be utilized specifically oriented to the current usage situation by means of specifying the vapour-liquid ratio.
Other advantageous further developments of the heat pump device according to the invention are obtained from the dependent patent claims.
For the sake of completeness, reference is made to the following documents:
Known from EP 1 965 154 B1 is a heat pump device in which a comparatively small part of the refrigerant coming from the liquefier is branched off and guided to release the pressure via a controllable expansion valve, downstream of which a heat exchanger (so-called economiser) is connected, in order to transfer heat between the small already expanded part of the refrigerant and the remainder of the refrigerant coming from the liquefier. After the economiser, the expanded refrigerant can be injected into the compressor wherein it can be specified via the setting of the expansion valve which state of aggregation (liquid, wet-vapour or vapour) the injected refrigerant has. Compared to the solution according to the invention which has been explained, in the solution according to EP 1 965 154 B1 a more expensive heat exchanger (the economiser) is required compared to the refrigerant collector.
Furthermore reference is made to DE 33 29 661 A1 from which a solution corresponding to EP 1 965 154 B1 is known, wherein there the economiser or the heat exchanger is configured as a refrigerant collector. In both cases however, the refrigerant coming from the liquefier is divided into two partial streams upstream of the heat exchanger or upstream of the refrigerant collector which are only combined again at the compressor.
In addition, reference is made to DE 102010 024986 A1.
The heat pump device according to the invention including its advantageous further developments according to the dependent patent claims will be explained in detail hereinafter with reference to the drawings showing various exemplary embodiments .
In the figures, schematically
Figure 1 shows a basic embodiment of the heat pump device according to the invention with a refrigerant collector;
Figure 2 shows an enlarged view of the refrigerant collector according to Figure 1;
Figure 3 shows the exemplary embodiment according to Figure 1 with a 4/2-way changeover valve;
Figure 4 shows an exemplary embodiment with a suction gas heat exchanger in the refrigerant collector as well as a 4/2-way changeover valve;
Figure 5 shows an enlarged view of the refrigerant collector according to Figure 4; and
Figure 6 shows a heat pump device according to the prior art (JP 2001 153482 A).
The heat pump devices shown in Figures 1, 3, 4 and 6 consist in a known manner of a compressor 1, in particular a so-called screw or scroll compressor, downstream of which a liquefier 2 is connected, which particularly preferably is configured as a plate condenser. A refrigerant collector 3 (also called high-pressure collector) is connected downstream of this condenser, which for intermediate injection of refrigerant into the compressor 1 is connected to this via a refrigerant line 4. This intermediate injection is used, as already explained, to increase the efficiency of the heat pump device or expand the limits of use of the heat pump device .
It is now essential for the heat pump device according to the invention shown in Figures 1, 3 and 4 that an electronically controllable (and reversibly operating) expansion valve 5 is arranged between the liquefier 2 and the refrigerant collector 3 for setting the refrigerant level in the refrigerant collector 3 and that depending on the setting of the expansion valve 5 the refrigerant line 4 has a refrigerant feed opening 6 which opens above and/or below the refrigerant level during operation of the heat pump device.
For better understanding Figure 2 shows an enlarged view of the refrigerant collector 3. As can be seen, a section 7 of the refrigerant line 4 is arranged in the refrigerant collector 3. The refrigerant feed opening(s) 6 is(are) arranged on the section 7 of the refrigerant line 4. The section 7 is tubular and in particular is configured as a u-shaped pipe piece. The section 7 further has a vertical extension direction and an open line end 8. The open line end 8 forms at least one of the refrigerant feed openings 6 and is preferably always arranged above the refrigerant level during operation of the heat pump device. As is further apparent from Figure 2, a plurality of refrigerant feed openings 6 arranged one above the other are provided on the section 7.
As can be seen from Figures 1, 3 and 4, it is preferably provided that the refrigerant collector 3 has a refrigerant feed connection 9 which is connected to the expansion valve 5 and which opens below the refrigerant level during operation of the heat pump device. The refrigerant enters into the refrigerant collector 3 via this refrigerant feed connection 9. It is further provided that the refrigerant collector 3 has a refrigerant discharge connection 11 opening below the refrigerant level during operation of the heat pump device, which is connected to a second electronically controllable (and reversibly operating) expansion valve. The refrigerant is discharged to the second expansion valve 10 via this refrigerant discharge connection 11.
It can be understood in particular from Figure 2 how the refrigerant collector according to the invention functions: refrigerant enters into the refrigerant collector 3 via the refrigerant feed connection 9. The height of the refrigerant level is set by means of the electronically controllable expansion valves 5 and 10 which are naturally connected to a corresponding heat pump regulating device not shown additionally (also called refrigerating circuit controller). With the fill level according to Figure 2, only vaporous refrigerant can enter via the refrigerant feed openings 6 into the section 7, thus into the refrigerant line 4 and from there reach the compressor 1. If the refrigerant level is increased, liquid refrigerant can enter via one or more refrigerant feed openings 6 into the section 7 and thus reach the compressor 1. This liquid refrigerant thereby mixes with the refrigerant vapour flowing in via the other refrigerant feed opening 6 to form a refrigerant wet vapour. If the refrigerant collector 3 were ultimately completely flooded, i.e. such a refrigerant level is set at which all refrigerant feed openings 6 are positioned in the liquid refrigerant, this would result in a completely liquid intermediate injection at the compressor which, as explained, is in particular desirable when the compressor is to be cooled. A further preferred particular feature of the solution according to the invention in turn consists in that, with reference to Figures 2 and 5, the refrigerant collector 3 is configured to be divided into a first and a second chamber 14, 15 by a separating element 13 or separating wall (preferably a perforated sheet, metal fabric or the like), in particular arranged in a vertically oriented manner, having at least one through opening 12, wherein the refrigerant feed connection 9 opens into the first chamber 14 and wherein the refrigerant discharge connection 11 leads away from the first chamber.
As a result of the expansion of the refrigerant in the expansion valve 5, the flow in the first chamber 14 is highly turbulent. The specification of the separating element 13 results in a calming of the refrigerant in the second chamber 15 in which the section 7 of the refrigerant line 4 is arranged, which in turn is favourable for the desired precise setting of the ratio between liquid and vaporous refrigerant.
As already explained, a second electronically controllable expansion valve 10 is connected downstream of the refrigerant collector 3, downstream of which for its part a vaporizer 16 (in particular lamella vaporizer) is connected to the compressor 1. With reference to Figures 4 and 5, a further particular features of the solution according to the invention consists in that a refrigerant-carrying line 17 which exchanges heat with the refrigerant in the refrigerant collector 3 is arranged in the first chamber 14 of the refrigerant collector 3, which on the one hand is connected to the vaporizer 16 and on the other hand is connected to the compressor 1. This line 17 together with the refrigerant collector 3 forms a so-called suction gas heat exchanger for undercooling of the refrigerant, wherein the expansion valves 5 and 10 and therefore the refrigerant level can be influenced via the already-mentioned heat pump regulating device not shown and corresponding sensors for measurement of the suction gas overheating or the undercooling.
Furthermore, it is provided with reference to Figure 3 and 4 that a (preferably bidirectionally operating) filter 18 (also called filter drier) is arranged between the liquefier 2 and the expansion valve 5. In addition, a (preferably bidirectionally operating) filter 19 (filter drier) is arranged between the second expansion valve 10 and the vaporizer 16.
In order to be able to use the heat pump device according to the invention both for heating and also for cooling purposes, a changeover valve, in particular a 4/2-way changeover valve 20 is provided downstream of the compressor 1 with reference to Figure 3 and 4: the heating mode is shown in Figures 3 and 4 in which geothermal energy is taken up via the vaporizer 16, for example, and delivered to a room of a building to be heated via the liquefier 2. If the 4/2-way changeover valve according to Figures 3 and 4 were turned through 90° (both clockwise and anticlockwise) , which is readily possible as a result of the symmetrical structure of the heat pump device, the vaporizer 16 would become the liquefier and the liquefier 2 would become the vaporizer. In this case, heat would be removed via the vaporizer for example from a room of a building and delivered for example via the liquefier to the surroundings of the building.
For a better understanding, the operating mode of the exemplary embodiments according to Figures 3 and 4 will be explained in detail hereinafter:
In the solution according to Figure 3, gaseous refrigerant is brought to a higher pressure level via the compressor 1, supplied to the liquefier 2 via the 4/2-way changeover valve and completely condensed and undercooled there. The liquid refrigerant runs through the filter 18 and then reaches the expansion valve 5 in which it is brought to a lower pressure level. In so doing, a part of the refrigerant goes over into the gaseous state. The refrigerant is then supplied to the refrigerant collector 3 which is divided into two regions. At the refrigerant feed connection 9 of the refrigerant collector 3, the refrigerant is highly turbulent as a result of the high flow rate. The refrigerant then flows via passage opening 12 on the separating element 13 (see Figure 2) into the calmed region of the refrigerant collector 3 (chamber 15), where the liquid component is deposited at the bottom as a result of gravity. Exclusively gaseous refrigerant is sucked in via the refrigerant feed opening 6 which ends in the upper region of the refrigerant collector 3, and is supplied to intermediate injection of the compressor 1. The liquid refrigerant is supplied to the expansion valve 10 by means of which the pressure is reduced to vaporization pressure level. A part of the refrigerant is thereby transferred into the gaseous state. The refrigerant then enters into the vaporizer 16 where it vaporizes completely and is overheated. Via the 4/2-way changeover valve the refrigerant is finally supplied to the compressor 1. The circuit is closed.
Particular feature: in order to prevent the temperature being too high at the refrigerant outlet of the compressor 1 at operating points with large pressure ratios, it is possible according to the invention to increase the liquid component during the intermediate injection. The liquid components of the refrigerant thereby vaporize in the compressor and thereby absorb heat. In order to achieve this, the suction line (refrigerant line 7) of the intermediate injection in the refrigerant collector 3 is designed so that it runs through the liquid component. Liquid refrigerant can be sucked in via so-called breather holes (refrigerant feed openings 6) in the pipeline. The fraction of liquid which is sucked in can be regulated by varying the fill level in the refrigerant collector 3 via the expansion valve 5 downstream of the liquefier 2. The hot gas temperature at the outlet of the compressor 1 serves as control variable.
The solution according to Figure 4 finally differs from that according to Figure 3 in that heat transfer from the warmer refrigerant in the refrigerant collector 3 to the cooler refrigerant in the pipe coil takes place there via a pipe coil (line 17) (key word: suction gas overheating). As a result, the gaseous component of the refrigerant in the refrigerant collector is partially or completely condensed, whereby the liquid-to-gaseous ratio increases. The line 17 runs from the vaporizer 16 via the 4/2-way valve to the first chamber 14 and from there directly to the compressor 1.
REFERENCE LIST 1 Compressor 2 Liquefier 3 Refrigerant collector 4 Refrigerant line 5 Expansion valve 6 Refrigerant feed opening 7 Section 8 Line end 9 Refrigerant feed connection 10 Expansion valve 11 Refrigerant discharge connection 12 Passage opening 13 Separating element 14 First chamber 15 Second chamber 16 Vaporizer 17 Line 18 Filter 19 Filter 20 4/2-way changeover valve

Claims (7)

1. Varmepumpeindretning, omfattende en kompressor (1), der er indkoblet efter en kondensator (2), som er indkoblet efter en kølemiddelopsamler (3), der til mellemliggende indsprøjtning af kølemiddel i kompressoren (1) er forbundet med denne via en kølemiddelledning (4) , hvor der til indstilling af kølemiddelspejlet i kølemiddelopsamleren (3) er anbragt en regulerbar ekspansionsventil (5) mellem kondensatoren (2) og kølemiddelopsamleren (3), hvor kølemiddelopsamleren (3) udviser en kølemiddelbortledningsforbindelse (11) , der er forbundet med en anden regulerbar ekspansionsventil (10) og under driften af varmepumpeindretningen udmunder under køle-middelspejlet, kendetegnet ved, at kølemiddelledningen (4) afhængigt af indstillingen af ekspansionsventilen (5) udviser en kølemiddeltilløbsåbning (6), der under driften af varmepumpeindretningen valgfrit udmunder over og/eller under kølemiddelspejlet, hvor et afsnit (7) af kølemiddelledningen (4) er anbragt i kølemiddelopsamleren (3), og hvor afsnittet (7) har en vertikal udstrækningsretning.A heat pump device comprising a compressor (1) coupled to a capacitor (2) connected to a refrigerant collector (3) connected to it for intermediate injection of refrigerant into the compressor (1) via a refrigerant line ( 4) wherein an adjustable expansion valve (5) is arranged between the capacitor (2) and the refrigerant collector (3) for adjusting the refrigerant mirror in the refrigerant collector (3), the refrigerant collector (3) exhibiting a refrigerant conduit connection (11). a second adjustable expansion valve (10) and during operation of the heat pump device opens below the refrigerant mirror, characterized in that, depending on the setting of the expansion valve (5), a refrigerant inlet (6) which exhibits during the operation of the heat pump / or below the refrigerant mirror, where a portion (7) of the refrigerant line (4) is disposed in refrigerant casing the mixer (3), and wherein the section (7) has a vertical extension direction. 2. Varmepumpeindretning ifølge krav 1, kendetegnet ved, at afsnittet (7) udviser en åben ledningsende (8).Heat pump device according to claim 1, characterized in that the section (7) has an open conduit end (8). 3. Varmepumpeindretning ifølge krav 1 eller 2, kendetegnet ved, at der på afsnittet (7) er tilvejebragt flere over hinanden anbragte kølemiddeltilløbsåbninger (6).Heat pump device according to claim 1 or 2, characterized in that several refrigerant inlet openings (6) are provided on the section (7). 4. Varmepumpeindretning ifølge et af kravene 1 til 3, kendetegnet ved, at kølemiddelopsamleren (3) udviser en kølemiddeltilløbsforbindelse (9), der er forbundet med ekspansionsventilen (5) , og under driften af varmepumpeindretningen udmunder under kølemiddelspejlet.Heat pump device according to one of claims 1 to 3, characterized in that the refrigerant collector (3) exhibits a refrigerant inlet connection (9) connected to the expansion valve (5) and during the operation of the heat pump device opens below the refrigerant level. 5. Varmepumpeindretning ifølge krav 4, kendetegnet ved, at kølemiddelopsamleren (3) ved hjælp af et deleelement (13), der udviser en gennemgangsåbning (12), er udformet opdelt i et første og et andet kammer (14, 15) , hvor kølemiddeltilløbsforbindelsen (9) udmunder i det første kammer (14), og hvor kølemiddelbortledningsforbindelsen (11) udgår fra det første kammer (14) .Heat pump device according to claim 4, characterized in that the refrigerant collector (3) is formed by a dividing element (13) which has a passage opening (12) divided into a first and a second chamber (14, 15), wherein the refrigerant inlet connection (9) opens into the first chamber (14) and the refrigerant wiring connection (11) proceeds from the first chamber (14). 6. Varmepumpeindretning ifølge krav 5, hvor der efter kølemiddelopsamleren (3) er indkoblet den anden regulerbare ekspansionsventil (10), efter hvilken er indkoblet en fordamper (16), der er forbundet med kompressoren (1), kendetegnet ved, at der i det første kammer (14) er anbragt en kølemiddelledende ledning (17), der udveksler varme med kølemidlet i kølemiddelopsamleren (3) , og som på den ene side er forbundet med fordamperen (16) og på den anden side med kompressoren (1) .A heat pump device according to claim 5, wherein after the refrigerant collector (3) the second adjustable expansion valve (10) is connected, after which an evaporator (16) is connected to the compressor (1), characterized in that first chamber (14) is provided with a refrigerant conducting conduit (17) which exchanges heat with the refrigerant in the refrigerant collector (3) and which is connected on one side to the evaporator (16) and on the other to the compressor (1). 7. Varmepumpeindretning ifølge krav 5 eller 6, kendetegnet ved, at afsnittet (7) i kølemiddelledningen (4) er anbragt i det andet kammer (15) .Heat pump device according to claim 5 or 6, characterized in that the section (7) of the refrigerant line (4) is arranged in the second chamber (15).
DK13707538.8T 2012-02-09 2013-01-30 heat pump Interior DK2812638T3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012101041A DE102012101041A1 (en) 2012-02-09 2012-02-09 heat pump device
PCT/DE2013/100033 WO2013117187A2 (en) 2012-02-09 2013-01-30 Heat pump apparatus

Publications (1)

Publication Number Publication Date
DK2812638T3 true DK2812638T3 (en) 2018-06-25

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ID=47826781

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Application Number Title Priority Date Filing Date
DK13707538.8T DK2812638T3 (en) 2012-02-09 2013-01-30 heat pump Interior

Country Status (6)

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EP (1) EP2812638B1 (en)
DE (1) DE102012101041A1 (en)
DK (1) DK2812638T3 (en)
ES (1) ES2669223T3 (en)
PL (1) PL2812638T3 (en)
WO (1) WO2013117187A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017107051A1 (en) 2017-04-01 2018-10-04 Viessmann Werke Gmbh & Co Kg heat pump
CN112146314B (en) * 2020-09-22 2022-03-11 华商国际工程有限公司 Ammonia pump liquid supply refrigeration system and control method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3329661A1 (en) 1982-12-14 1984-06-14 VEB Kombinat Luft- und Kältetechnik, DDR 8080 Dresden Regulation of temperatures, temperature differences or levels in refrigerant circuits
JPH04371759A (en) * 1991-06-21 1992-12-24 Hitachi Ltd Freezing cycle of two-stage compression and two-stage expansion
JP2001056157A (en) * 1999-08-16 2001-02-27 Daikin Ind Ltd Refrigerating device
JP2001153482A (en) 1999-11-26 2001-06-08 Mitsubishi Electric Corp Screw refrigerating device
JP2007303709A (en) * 2006-05-10 2007-11-22 Sanden Corp Refrigerating cycle
DE102007010646B4 (en) 2007-03-02 2022-01-05 Stiebel Eltron Gmbh & Co. Kg Heat pump device
DK2340406T3 (en) * 2008-10-01 2018-12-17 Carrier Corp Liquid Vapor Separation in Transcritical Refrigerant Cycle
DE102010024986A1 (en) * 2010-06-24 2011-12-29 Stiebel Eltron Gmbh & Co. Kg Method for controlling a heat pump unit and heat pump unit

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Publication number Publication date
ES2669223T3 (en) 2018-05-24
PL2812638T3 (en) 2018-09-28
EP2812638B1 (en) 2018-04-11
DE102012101041A1 (en) 2013-08-14
WO2013117187A2 (en) 2013-08-15
WO2013117187A3 (en) 2013-11-21
EP2812638A2 (en) 2014-12-17

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