ES2669223T3 - Heat pump device - Google Patents

Abstract

Heat pump device, comprising a compressor (1), downstream of which is arranged a condenser (2), downstream of which is arranged a refrigerant accumulator (3), which for the intermediate injection of refrigerant into the compressor (1) is connected to it by means of a refrigerant medium duct (4), being arranged for adjusting the level of refrigerant medium in the refrigerant accumulator (3) between the condenser (2) and the medium accumulator refrigerant (3) an adjustable expansion valve (5), the refrigerant medium accumulator (3) having a refrigerant discharge connection (11) connected to a second adjustable expansion valve (10), which during operation of the device The heat pump outlet empties below the level of the cooling medium, characterized in that the cooling medium duct (4), depending on the setting of the expansion valve (5), has a medium supply opening r coolant (6) which, during operation of the heat pump device, empties optionally above and / or below the coolant level, a segment (7) of the coolant conduit (4) being arranged in the coolant accumulator (3) and segment (7) presenting a direction of vertical extension.

Description

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DESCRIPTION

Heat pump device

The invention relates to a heat pump device according to the preamble of claim 1.

A heat pump device of the type mentioned at the beginning is known from WO 2010/039682 A2.

A heat pump device of this type is also similarly known from JP 2001 153482 A. It is composed inter alia of a compressor (in particular a helical compressor), downstream of which a condenser is arranged, water below which, in turn, a refrigerant medium accumulator (also called a refrigerant reservoir) is arranged. In this regard, for an intermediate injection of refrigerant medium in the compressor the accumulator of refrigerant medium is connected to it through a conduit of refrigerant medium.

In addition, in the case of this heat pump device, as in the case of the device according to the invention that will still be explained, an adjustable expansion valve is arranged downstream of the cooling medium, downstream of which at its Once an evaporator is arranged, downstream of which the aforementioned compressor is arranged. Therefore, the refrigerant medium circuit of JP 2001 153482 A corresponds to a very classic refrigerant medium circuit, to which however the refrigerant medium accumulator has been added for the intermediate injection of refrigerant medium into the compressor.

In the solution according to JP 2001 153482 A cooling medium feed opening of the cooling medium conduit leading to the compressor flows during the correct operation of the heat pump device always below the level of cooling medium in the medium accumulator coolant, that is to say, in this solution liquid coolant medium is always discharged from the coolant accumulator, which allows the possibility of cooling the compressor, lowering the temperature of the hot gas and thus extending the limitations of use of the heat pump device in comparison with a classic coolant circuit without a coolant accumulator.

The invention is based on the objective of further improving a heat pump device of the type mentioned at the beginning. In particular, the limitations of use will be further extended or the efficiency of such a heat pump device will be further increased.

This objective is achieved by the characteristics indicated in the characterizing part of claim 1.

Therefore, according to the invention, it is provided that the cooling medium conduit, depending on the setting of the expansion valve, has a cooling medium feed opening which, during operation of the heat pump device, optionally flows above and / or below. of the refrigerant medium level, a segment of the refrigerant medium conduit being arranged in the refrigerant medium accumulator and the segment presenting a vertical extension direction.

In other words, the heat pump device according to the invention is characterized in particular by the fact that through the expansion valve the level of cooling medium in the cooling medium accumulator can be adjusted, the cooling medium feeding opening being configured in such a way that depending on the adjustment of the expansion valve it is configured so that it optionally flows above and / or below the level of the cooling medium. In this regard, the expression "and / or" means that the cooling medium conduit with its cooling medium feeding opening is configured such that the cooling medium feeding opening flows above or below the cooling medium level. , or that the coolant feed opening is configured in such a way that it flows both above and below the coolant level, which can optionally be implemented by a correspondingly large coolant feed opening or also by various air openings. supply of cooling medium in the cooling medium conduit leading to the cooling medium accumulator.

Therefore, unlike the heat pump device mentioned at the beginning, in the case of the heat pump device according to the invention it is possible to optionally provide the compressor with steam of pure cooling medium, liquid cooling medium or also wet steam of cooling medium. In this regard, the state of aggregation in which the cooling medium is injected into the compressor can be determined by the adjustable expansion valve and thereby by the level of cooling medium in the cooling medium accumulator.

The injection of a cooling medium in the form of steam improves the efficiency and performance of the heat pump device.

The injection of liquid cooling medium, as mentioned above, offers the possibility of cooling the compressor, lowering the temperature of the hot gas and thus extending the limitations of use.

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By means of wet steam injection of cooling medium, that is to say, the combination of the two possibilities mentioned above, determining the vapor liquid ratio, the advantages of both injection procedures can be specifically exploited in a manner oriented to the current use situation.

Other advantageous improvements to the heat pump device according to the invention are obtained from the dependent claims.

To complete, reference will still be made to the following documents:

From EP 1 965 154 B1 a heat pump device is known, in which a comparatively small part of the cooling medium from the condenser is branched off and is carried to an expansion through an adjustable expansion valve, downstream of which is arranged a heat exchanger (a so-called economizer), to transmit heat between the small, already expanded part of the cooling medium and the rest of the cooling medium from the condenser. After the economizer, it is possible to inject the expanded cooling medium into the compressor, being able to determine by means of the adjustment of the expansion valve the state of aggregation (liquid, in the form of wet steam or in the form of steam) that the injected cooling medium has. In comparison to the solution according to the invention explained, in the case of the solution according to EP 1 965 154 B1, a more expensive heat exchanger (economizer) is necessary compared to the refrigerant medium accumulator.

Reference is also made to document DE 33 29 661 A1, from which a solution corresponding to document EP 1 965 154 B1 is known, the economizer or heat exchanger being configured here as an accumulator of cooling medium. However, in both cases the cooling medium from the condenser is divided before the heat exchanger or before the cooling medium accumulator into two subflows, which only come back together in the compressor.

In addition, reference is still made to document DE 102010 024986 A1.

Next, by means of the graphic representation of different embodiments, the heat pump device according to the invention will be explained in more detail, including its advantageous improvements according to the dependent claims.

Show schematically

Fig. 1, a basic embodiment of the heat pump device according to the invention with a cooling medium accumulator;

Figure 2, an enlarged representation of the refrigerant medium accumulator according to Figure 1;

Figure 3, the exemplary embodiment according to Figure 1 with a 4/2 way reversing valve;

Figure 4, an exemplary embodiment with a suction gas heat exchanger in the coolant accumulator as well as a 4/2 way reversing valve;

Figure 5, an enlarged representation of the refrigerant medium accumulator according to Figure 4; Y

Figure 6, a heat pump device according to the prior art (JP 2001 153482 A).

The heat pump devices shown in Figures 1, 3, 4 and 6 are known in a known manner by a compressor 1, in particular a so-called helical or spiral compressor downstream of which a condenser 2 is arranged, which especially Preferred is configured as a plate capacitor. A refrigerant medium accumulator 3 (also called a high pressure accumulator) is arranged downstream of this condenser, which for the intermediate injection of refrigerant in the compressor 1 is connected to it by means of a conduit of refrigerant 4. This intermediate injection it serves, as already explained, to increase the efficiency of the heat pump device or to extend the limitations of use of the heat pump device.

Now, for the heat pump device according to the invention, shown in Figures 1, 3 and 4, it is essential that for the adjustment of the level of cooling medium in the cooling medium accumulator 3 between the condenser 2 and the medium accumulator coolant 3 an electronic regulating expansion valve 5 (and of reversible operation) is arranged and that the coolant medium conduit 4, depending on the adjustment of the expansion valve 5, has a coolant supply opening 6 which during operation of the Heat pump device empties above and / or below the coolant level.

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Figure 2 shows the accumulator of cooling medium 3 in an enlarged manner for a better understanding. As is evident, in this respect a segment 7 of the cooling medium conduit 4 is disposed in the cooling medium accumulator 3. The cooling medium feeding opening (s) 6 is arranged in the segment 7 of the cooling medium conduit 4. Segment 7 is tubularly shaped and in particular as a u-shaped tube section. The segment 7 also has a vertical extension direction and an open duct end 8. The open duct end 8 forms at least one of the coolant feed openings 6 and during operation of the heat pump device preferably it is always always arranged above the level of cooling medium. As is further evident from Figure 2, in segment 7 there are provided several coolant feed openings 6 arranged one above the other.

As is evident from FIGS. 1, 3 and 4, it is preferably provided that the refrigerant medium accumulator 3 has a refrigerant medium supply connection 9 connected with the expansion valve 5, which during the operation of the heat pump device flows below the level of cooling medium. Through this refrigerant medium supply connection 9, the refrigerant medium arrives at the refrigerant medium accumulator 3. It is also provided that the refrigerant medium accumulator 3 has a refrigerant medium discharge connection 11 connected with a second regulating expansion valve electronics 10 (and reversible operation), which during operation of the heat pump device flows below the level of cooling medium. Through this refrigerant medium discharge connection 11 the refrigerant medium is discharged to the second expansion valve 10.

In particular, from figure 2, it is understood how the refrigerant medium accumulator according to the invention works: through the refrigerant medium supply connection 9 refrigerant medium arrives at the refrigerant medium accumulator 3. Through the expansion valves of electronic regulation 5 and 10, which are obviously connected to a corresponding heat pump regulation module, not especially represented (also called a cooling circuit regulator), the height of the cooling medium level is adjusted. With the filling level according to figure 2, only refrigerant medium in the form of steam can be reached through the refrigerant medium feed openings 6 to the segment 7, thus to the refrigerant medium conduit 4 and from here to the compressor 1. When it is increased at the level of the cooling medium, liquid cooling medium can also arrive through one or several refrigerant medium feed openings 6 to segment 7 and thus to the compressor 1. In this respect, this liquid cooling medium is mixed with the medium vapor refrigerant that enters through the other refrigerant medium feed openings 6 to form a moist vapor of refrigerant medium. If the refrigerant medium accumulator 3 is finally fully charged, that is, if a refrigerant medium level is adjusted at which all the refrigerant medium feed openings 6 are placed in the liquid refrigerant medium, then a compressor would produce a Complete liquid intermediate injection which, as explained, is desirable in particular when a compressor cooling is sought.

Again, a further preferred feature of the solution according to the invention, with reference to Figures 2 and 5, is that the accumulator of cooling medium 3 is configured divided by a separation wall or separation element 13 having at least one through opening 12, in particular arranged vertically oriented (preferably a perforated sheet, metal fabric or the like) in a first and a second chamber 14, 15, the supply connection of cooling medium 9 flowing into the first chamber 14 and leaving the first chamber 14 the discharge connection of cooling medium 11.

Due to the expansion of the cooling medium in the expansion valve 5 the current in the first chamber 14 is very turbulent. The measurement of the separation element 13 leads to a stabilization of the cooling medium in the second chamber 15, in which the segment 7 of the cooling medium conduit 4 is arranged, which in turn is favorable for the exact desired adjustment of the ratio between liquid and vapor-like cooling medium.

As explained above, a second electronic regulating expansion valve 10 is arranged downstream of the cooling medium accumulator 3, downstream of which an evaporator 16 (in particular a reed evaporator) connected to the compressor is arranged 1. With reference to FIGS. 4 and 5, another particular feature of the solution according to the invention is that in the first chamber 14 of the refrigerant medium accumulator 3, a conduit 17 for conducting the refrigerant means is arranged and that performs a heat exchange with the cooling medium in the cooling medium accumulator 3, which on the one hand is connected with the evaporator 16 and on the other hand with the compressor 1. This conduit 17 forms together with the cooling medium accumulator 3 a so-called gas heat exchanger of suction to subcool the cooling medium, being able to influence by means of the heat pump regulation module already mentioned, not shown and sensed s corresponding to the measurement of the superheat of suction gas or the subcooling in the expansion valves 5 and 10 and with it at the level of the cooling medium.

Furthermore, with reference to Figures 3 and 4, it is provided that between the condenser 2 and the expansion valve 5 a filter 18 (preferably bidirectional operation) (also called a filter dryer) is arranged. In addition, a filter 19 (preferably bidirectional operation) (filter dryer) is also arranged between the second expansion valve 10 and the evaporator 16.

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In order to be able to use the heat pump device according to the invention for both heating and cooling purposes, with reference to Figures 3 and 4, an inversion valve is provided downstream of the compressor 1, in particular an inversion valve of 4 / 2 tracks 20: in this respect, in Figs. 3 and 4 the heating operation is shown, in which, through the evaporator 16, for example, heat can be collected and through the condenser 2 emitted to a space of a building to be heated . If the 4/2 way reversing valve according to Figures 3 and 4 90 ° (both clockwise and counterclockwise) was rotated, which is easily made possible by the symmetrical construction of the heat pump device according to the invention , then the evaporator 16 would become a condenser and the condenser 2 an evaporator. In this case heat would be evacuated through the evaporator for example from a space in a building and through the condenser for example it would be emitted to the building environment.

For a better understanding, the operation of the embodiments according to Figures 3 and 4 will be explained in more detail below:

In the solution according to figure 3, gaseous refrigerant medium is carried through the compressor 1 at a higher pressure level, through the 4/2 way reversing valve it is provided to the condenser 2 and here it is completely condensed and subcooled. The liquid cooling medium passes through the filter 18 and then reaches the expansion valve 5, where it is set at a lower pressure level. In this regard, a part of the cooling medium enters the gaseous state. The cooling medium is then provided to the cooling medium accumulator 3, which is subdivided into two zones. In the refrigerant medium supply connection 9 of the refrigerant medium accumulator 3 the refrigerant medium is very turbulent due to the high current velocity. The cooling medium then flows through the through opening 12 in the separation element 13 (see Figure 2) to the stabilized zone of the cooling medium accumulator 3 (chamber 15), in which the force of gravity causes the Liquid part is deposited below. Through the coolant feed opening 6, which ends in the upper zone of the coolant medium 3, only gaseous coolant is aspirated and is provided for intermediate injection of the compressor 1. The liquid coolant is provided to the expansion valve 10, through which the pressure is reduced to the evaporation pressure level. In this regard, a part of the cooling medium enters the gaseous state. Next, the cooling medium reaches the evaporator 16, in which it evaporates completely and overheats. Finally, through the 4/2 way reversing valve, the cooling medium is provided to the compressor 1. The circuit is closed.

Particularity: in the case of operating points with high pressure ratios, avoiding a temperature that is too high at the outlet of the refrigerant medium of the compressor 1, according to the invention there is the possibility of increasing the liquid part in the intermediate injection. In this respect, the liquid parts of the cooling medium evaporate in the compressor and thus capture heat. To implement this, the suction line (cooling medium duct 7) of the intermediate injection in the cooling medium accumulator 3 is carried out in such a way that it runs through the liquid part. By means of so-called air purge perforations (feed openings for cooling medium 6) in the conduit, liquid cooling medium can be aspirated. The liquid part, which is also aspirated, can be regulated by modifying the filling level in the coolant accumulator through the expansion valve 5 after the condenser 2 3. The temperature of the hot gas at the outlet serves as the control variable of the compressor 1.

Finally, the solution according to figure 4 differs from that according to figure 3 in that here through a coil (conduit 17) a heat transfer from the hottest coolant medium in the coolant accumulator 3 to the coolant medium takes place cold in the coil (keyword: superheat of suction gas). In this way the gaseous part of the cooling medium in the cooling medium accumulator partially or completely condenses, thereby increasing the ratio of liquid to gas. The conduit 17 runs from the evaporator 16 through the 4/2 way valve to the first chamber 14 and from here directly to the compressor 1.

List of reference numbers

1 compressor

2 capacitor

3 coolant accumulator

4 cooling medium duct

5 expansion valve

6 coolant feed opening

7 segment

8 duct end

9

10

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12

13

14

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16

17

18

19

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refrigerant medium supply connection expansion valve

discharge connection of cooling medium

through opening

separation element

first camera

second chamber

evaporator

conduit

filter

filter

4/2 way reversing valve

Claims (7)

5 10 fifteen twenty 25 30 35 40 1. Heat pump device, comprising a compressor (1), downstream of which a condenser (2) is arranged, downstream of which a refrigerant medium accumulator (3) is arranged, which for intermediate injection of medium refrigerant in the compressor (1) is connected to it by means of a refrigerant medium conduit (4), being arranged for the adjustment of the refrigerant medium level in the refrigerant medium accumulator (3) between the condenser (2) and the accumulator of refrigerant medium (3) an adjustable expansion valve (5), the refrigerant medium accumulator (3) presenting a refrigerant medium discharge connection (11) connected with a second adjustable expansion valve (10), which during operation of the heat pump device flows below the level of cooling medium, characterized in that the cooling medium conduit (4) depending on the setting of the expansion valve (5) has a feed opening tion of cooling medium (6) which, during operation of the heat pump device, optionally flows above and / or below the level of cooling medium, a segment (7) of the cooling medium conduit (4) being arranged in the accumulator of cooling medium (3) and the segment (7) presenting a vertical extension direction. 2. Heat pump device according to claim 1, characterized in that the segment (7) has an open duct end (8). 3. Heat pump device according to claim 1 or 2, characterized in that in the segment (7) several coolant feed openings (6) arranged one above the other are provided. 4. Heat pump device according to one of claims 1 to 3, characterized in that the cooling medium accumulator (3) has a cooling medium supply connection (9) connected to the expansion valve (5), which during The operation of the heat pump device flows below the coolant level. 5. Heat pump device according to claim 4, characterized in that the cooling medium accumulator (3) is configured divided by a separation element (13) having at least one through opening (12) in a first and a second chamber (14, 15), the cooling medium supply connection (9) flowing into the first chamber (14) and the refrigerant medium discharge connection (11) leaving the first chamber (14). 6. Heat pump device according to claim 5, the second adjustable expansion valve (10), downstream of which an evaporator (16) arranged with the compressor is disposed downstream of the cooling medium (3). (1), characterized in that in the first chamber (14) a conduit (17) is arranged that conducts cooling medium and that exchanges heat with the cooling medium in the cooling medium accumulator (3), which on the one hand is connected with the evaporator (16) and on the other side with the compressor (1). 7. Heat pump device according to claim 5 or 6, characterized in that the segment (7) of the cooling medium conduit (4) is arranged in the second chamber (15).