DK2091308T3 - Kredsløb med integreret afskærmning og høreapparat - Google Patents
Kredsløb med integreret afskærmning og høreapparatInfo
- Publication number
- DK2091308T3 DK2091308T3 DK08172494.0T DK08172494T DK2091308T3 DK 2091308 T3 DK2091308 T3 DK 2091308T3 DK 08172494 T DK08172494 T DK 08172494T DK 2091308 T3 DK2091308 T3 DK 2091308T3
- Authority
- DK
- Denmark
- Prior art keywords
- integrated cutting
- hearing equipment
- credit
- run
- credit run
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008008897A DE102008008897B3 (de) | 2008-02-13 | 2008-02-13 | Schaltung mit integrierter Abschirmung und Hörhilfe |
Publications (1)
Publication Number | Publication Date |
---|---|
DK2091308T3 true DK2091308T3 (da) | 2019-06-11 |
Family
ID=40551067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK08172494.0T DK2091308T3 (da) | 2008-02-13 | 2008-12-22 | Kredsløb med integreret afskærmning og høreapparat |
Country Status (4)
Country | Link |
---|---|
US (1) | US8305772B2 (da) |
EP (1) | EP2091308B1 (da) |
DE (1) | DE102008008897B3 (da) |
DK (1) | DK2091308T3 (da) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008008897B3 (de) * | 2008-02-13 | 2009-07-30 | Siemens Medical Instruments Pte. Ltd. | Schaltung mit integrierter Abschirmung und Hörhilfe |
US8218801B2 (en) * | 2008-05-30 | 2012-07-10 | Symbol Technologies, Inc. | Method and system for a headset H-field/E-field canceller |
JP5353614B2 (ja) * | 2008-10-06 | 2013-11-27 | 日立化成株式会社 | 基板挿入用コネクタ及びその製造方法 |
US8670588B2 (en) * | 2009-09-08 | 2014-03-11 | Apple Inc. | Handheld device assembly |
DE102009054906A1 (de) * | 2009-12-17 | 2011-06-22 | Continental Automotive GmbH, 30165 | Elektrisches Gerät oder Platine |
US9602914B2 (en) | 2010-08-27 | 2017-03-21 | Apple Inc. | Porting audio using a connector in a small form factor electronic device |
US8391010B2 (en) | 2010-08-19 | 2013-03-05 | Apple Inc. | Internal frame optimized for stiffness and heat transfer |
US8634204B2 (en) | 2010-08-19 | 2014-01-21 | Apple Inc. | Compact folded configuration for integrated circuit packaging |
WO2012024578A2 (en) * | 2010-08-19 | 2012-02-23 | Apple Inc. | Portable electronic device |
US8427379B2 (en) | 2010-08-19 | 2013-04-23 | Apple Inc. | Modular material antenna assembly |
US8515113B2 (en) | 2010-08-19 | 2013-08-20 | Apple Inc. | Composite microphone boot to optimize sealing and mechanical properties |
US8477492B2 (en) | 2010-08-19 | 2013-07-02 | Apple Inc. | Formed PCB |
DE102010041831B4 (de) * | 2010-09-30 | 2021-04-08 | Automotive Lighting Reutlingen Gmbh | Elektronische Steuereinrichtung für eine Beleuchtungseinrichtung eines Kraftfahrzeugs |
US9287627B2 (en) | 2011-08-31 | 2016-03-15 | Apple Inc. | Customizable antenna feed structure |
US9406999B2 (en) | 2011-09-23 | 2016-08-02 | Apple Inc. | Methods for manufacturing customized antenna structures |
WO2015081958A1 (en) * | 2013-12-03 | 2015-06-11 | Miitors Aps | Consumption meter comprising a foldable printed circuit board assembly |
CN103777395A (zh) * | 2014-01-27 | 2014-05-07 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
CN103987188A (zh) * | 2014-05-28 | 2014-08-13 | 友达光电(厦门)有限公司 | 软性电路板 |
US11206499B2 (en) | 2016-08-18 | 2021-12-21 | Qualcomm Incorporated | Hearable device comprising integrated device and wireless functionality |
DE102017000889A1 (de) * | 2017-01-27 | 2018-08-02 | Christian Overmann | Modulares optisches Aufnahmesystem |
JP6994341B2 (ja) * | 2017-10-03 | 2022-01-14 | 日本電産コパル株式会社 | 電子機器 |
DE102017221332B4 (de) * | 2017-11-28 | 2021-08-26 | Sivantos Pte. Ltd. | Verfahren zur Herstellung eines Hörgerätes |
US10714429B1 (en) * | 2018-01-15 | 2020-07-14 | Snap Inc. | Circuit systems |
US10701796B2 (en) | 2018-06-25 | 2020-06-30 | Intel Corporation | Electromagnetic interference (EMI) shield |
EP3661231B1 (en) | 2018-11-30 | 2023-06-28 | GN Hearing A/S | Hearing device with an antenna |
CN109600914A (zh) * | 2019-01-14 | 2019-04-09 | 维沃移动通信有限公司 | 一种电路板、器件模组及移动终端 |
JP2022169817A (ja) * | 2019-09-30 | 2022-11-10 | Agc株式会社 | 高周波シールド構造 |
US20220324126A1 (en) * | 2021-04-07 | 2022-10-13 | The Gillette Company Llc | Personal care appliance |
US12005596B2 (en) * | 2021-04-07 | 2024-06-11 | The Gillette Company Llc | Personal care appliance and a method of assembling |
DK202170254A1 (en) * | 2021-05-20 | 2022-11-29 | Gn Hearing 2 As | A hearing device comprising a shielding component |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3414480C2 (de) * | 1984-04-17 | 1993-02-25 | Ifm Electronic Gmbh, 4300 Essen | Elektrisches, insbesondere elektronisches, berührungslos arbeitendes Schaltgerät |
US4675625A (en) * | 1985-03-26 | 1987-06-23 | Rogers Corporation | Rolled delay line of the coplanar line type |
GB2173048B (en) * | 1985-03-26 | 1989-06-21 | Rogers Corp | Electronic signal time delay device |
AT391047B (de) * | 1987-06-26 | 1990-08-10 | Siemens Ag | Hoergeraet mit einer leiterplatte und einer hoerspule |
US4922059A (en) * | 1988-12-29 | 1990-05-01 | Motorola, Inc. | Origami composite EMI/TEMPEST proof electronics module |
US4979787A (en) * | 1990-01-12 | 1990-12-25 | Pco, Inc. | Optical-electronic interface module |
US5265322A (en) * | 1990-02-05 | 1993-11-30 | Motorola, Inc. | Electronic module assembly and method of forming same |
US5031027A (en) * | 1990-07-13 | 1991-07-09 | Motorola, Inc. | Shielded electrical circuit |
JP3203279B2 (ja) | 1993-01-27 | 2001-08-27 | 日本メクトロン株式会社 | シ−ルド層を有する可撓性回路基板 |
DE4303908A1 (de) * | 1993-02-10 | 1994-08-11 | Siemens Ag | Steuergerät |
US5434362A (en) * | 1994-09-06 | 1995-07-18 | Motorola, Inc. | Flexible circuit board assembly and method |
US6674869B2 (en) * | 2000-02-23 | 2004-01-06 | Hei, Inc. | Hearing-aid assembly using folded flex circuits |
JP2003142875A (ja) | 2001-11-07 | 2003-05-16 | Matsushita Electric Ind Co Ltd | シールド付きのフレキシブル基板及びこれを用いた表示装置 |
JP2004128418A (ja) | 2002-10-07 | 2004-04-22 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2006073683A (ja) * | 2004-08-31 | 2006-03-16 | Sony Corp | 回路デバイス及び回路デバイスの製造方法 |
JP2006100302A (ja) * | 2004-09-28 | 2006-04-13 | Sharp Corp | 高周波モジュールおよびその製造方法 |
DE102008008897B3 (de) * | 2008-02-13 | 2009-07-30 | Siemens Medical Instruments Pte. Ltd. | Schaltung mit integrierter Abschirmung und Hörhilfe |
-
2008
- 2008-02-13 DE DE102008008897A patent/DE102008008897B3/de not_active Expired - Fee Related
- 2008-12-22 EP EP08172494.0A patent/EP2091308B1/de active Active
- 2008-12-22 DK DK08172494.0T patent/DK2091308T3/da active
-
2009
- 2009-02-13 US US12/371,142 patent/US8305772B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2091308A3 (de) | 2010-04-14 |
EP2091308A2 (de) | 2009-08-19 |
EP2091308B1 (de) | 2019-03-13 |
DE102008008897B3 (de) | 2009-07-30 |
US8305772B2 (en) | 2012-11-06 |
US20090201652A1 (en) | 2009-08-13 |
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