DK200801351A - Pumpehus til elektromagnetisk pumpe og fremgangsmåde til samling af et kølekredsløb omfattende pumpehuset - Google Patents

Pumpehus til elektromagnetisk pumpe og fremgangsmåde til samling af et kølekredsløb omfattende pumpehuset Download PDF

Info

Publication number
DK200801351A
DK200801351A DKPA200801351A DKPA200801351A DK200801351A DK 200801351 A DK200801351 A DK 200801351A DK PA200801351 A DKPA200801351 A DK PA200801351A DK PA200801351 A DKPA200801351 A DK PA200801351A DK 200801351 A DK200801351 A DK 200801351A
Authority
DK
Denmark
Prior art keywords
pipe
pump housing
openings
bottom portion
pump
Prior art date
Application number
DKPA200801351A
Other languages
English (en)
Inventor
Kloster Martin
Original Assignee
Danamics Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danamics Aps filed Critical Danamics Aps
Priority to DKPA200801351A priority Critical patent/DK200801351A/da
Priority to PCT/DK2009/000210 priority patent/WO2010034312A1/en
Publication of DK200801351A publication Critical patent/DK200801351A/da

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
    • F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/006—Micropumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/20—Other positive-displacement pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K44/00—Machines in which the dynamo-electric interaction between a plasma or flow of conductive liquid or of fluid-borne conductive or magnetic particles and a coil system or magnetic field converts energy of mass flow into electrical energy or vice versa
    • H02K44/02—Electrodynamic pumps
    • H02K44/04—Conduction pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Claims (4)

1. Pumpehus (1) til en elektromagnetisk pumpe (2) til fremdrift af en ledende væske i rør (3), især til køling af elektriske komponenter, hvilket pumpehus sammen med rørene danner et lukket kredsløb, hvortil der er tilkoblet en varmeveksler (4) og en køleplade (5), og hvor pumpehuset omfatter en bunddel (6) og en lågdel (7), og bunddelen yderligere omfatter mindst to rørtilgangsåbninger (8) og mindst to rørafgangsåbninger (9) anordnet i modstående ender af bunddelen, og hvor bunddelens indre er opdelt i et antal kanaler (10) af indragende barrierer (11), og hver kanal forløber mellem en rørtilgangsåbning og en rørafgangsåbning, og barriererne udstrækker sig mellem kanalerne fra de to ender af bunddelen, hvor røråbningerne (8,9) er anbragt, og ind imod midten af bunddelen, hvor to elektroder (12,13) er anordnet på modstående sider af bunddelen vinkelret på kanalerne, kendetegnet ved, at husets (1) rørtilgangsåbninger (8) og rørafgangsåbninger (9) er udformet på undersiden (14) af bunddelen (6) og viser i en i det væsentlige ret vinkel ind til kanalerne (10) i bunddelens indre, og at afstanden mellem sammenhørende røråbninger (8,9) svarer til afstanden mellem rørenderne (16) på rørene (3).
2. Pumpehus ifølge krav 1, kendetegnet ved, at vinklen mellem røråbningeme (8,9) og kanalerne (10) er fra halvfems til et hundrede og tyve grader.
3. Pumpehus ifølge krav 1, kendetegnet ved, at lågdelen (7) er udstyret med afbøjningsanordninger (15) umiddelbart overfor hver røråbning (8,9).
4. Pumpehus ifølge krav 1, kendetegnet ved, at elektroderne (12,13) er udført som udadragende tappe, og at elektroden (13) er udført som et rør til påfyldning af kølevæske.
DKPA200801351A 2008-09-29 2008-09-29 Pumpehus til elektromagnetisk pumpe og fremgangsmåde til samling af et kølekredsløb omfattende pumpehuset DK200801351A (da)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DKPA200801351A DK200801351A (da) 2008-09-29 2008-09-29 Pumpehus til elektromagnetisk pumpe og fremgangsmåde til samling af et kølekredsløb omfattende pumpehuset
PCT/DK2009/000210 WO2010034312A1 (en) 2008-09-29 2009-09-18 A pump housing for an electromagnetic pump and a method of assembling a cooling circuit comprising the pump housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DKPA200801351A DK200801351A (da) 2008-09-29 2008-09-29 Pumpehus til elektromagnetisk pumpe og fremgangsmåde til samling af et kølekredsløb omfattende pumpehuset

Publications (1)

Publication Number Publication Date
DK200801351A true DK200801351A (da) 2010-03-30

Family

ID=41504466

Family Applications (1)

Application Number Title Priority Date Filing Date
DKPA200801351A DK200801351A (da) 2008-09-29 2008-09-29 Pumpehus til elektromagnetisk pumpe og fremgangsmåde til samling af et kølekredsløb omfattende pumpehuset

Country Status (2)

Country Link
DK (1) DK200801351A (da)
WO (1) WO2010034312A1 (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103796492B (zh) * 2014-01-25 2017-01-18 清华大学 使用藕状多孔材料微通道模块的热收集端

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6447265A (en) * 1987-08-12 1989-02-21 Toshiba Corp Farady type electromagnetic pump
DE19643717A1 (de) * 1996-10-23 1998-04-30 Asea Brown Boveri Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
US20040234392A1 (en) * 2003-05-22 2004-11-25 Nanocoolers Inc. Magnetohydrodynamic pumps for non-conductive fluids
US7417858B2 (en) * 2005-12-21 2008-08-26 Sun Microsystems, Inc. Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits
US7562533B2 (en) * 2006-07-17 2009-07-21 Sun Microsystems, Inc. Thermal-electric-MHD cooling
WO2008128539A2 (en) * 2007-04-20 2008-10-30 Danamics Aps An electromagnetic pump

Also Published As

Publication number Publication date
WO2010034312A1 (en) 2010-04-01

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