DK200801351A - Pump housing for electromagnetic pump and method for assembling a cooling circuit comprising the pump housing - Google Patents

Pump housing for electromagnetic pump and method for assembling a cooling circuit comprising the pump housing Download PDF

Info

Publication number
DK200801351A
DK200801351A DKPA200801351A DKPA200801351A DK200801351A DK 200801351 A DK200801351 A DK 200801351A DK PA200801351 A DKPA200801351 A DK PA200801351A DK PA200801351 A DKPA200801351 A DK PA200801351A DK 200801351 A DK200801351 A DK 200801351A
Authority
DK
Denmark
Prior art keywords
pipe
pump housing
openings
bottom portion
pump
Prior art date
Application number
DKPA200801351A
Other languages
Danish (da)
Inventor
Kloster Martin
Original Assignee
Danamics Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danamics Aps filed Critical Danamics Aps
Priority to DKPA200801351A priority Critical patent/DK200801351A/en
Priority to PCT/DK2009/000210 priority patent/WO2010034312A1/en
Publication of DK200801351A publication Critical patent/DK200801351A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
    • F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/006—Micropumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/20—Other positive-displacement pumps
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K44/00—Machines in which the dynamo-electric interaction between a plasma or flow of conductive liquid or of fluid-borne conductive or magnetic particles and a coil system or magnetic field converts energy of mass flow into electrical energy or vice versa
    • H02K44/02—Electrodynamic pumps
    • H02K44/04—Conduction pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Claims (4)

1. Pumpehus (1) til en elektromagnetisk pumpe (2) til fremdrift af en ledende væske i rør (3), især til køling af elektriske komponenter, hvilket pumpehus sammen med rørene danner et lukket kredsløb, hvortil der er tilkoblet en varmeveksler (4) og en køleplade (5), og hvor pumpehuset omfatter en bunddel (6) og en lågdel (7), og bunddelen yderligere omfatter mindst to rørtilgangsåbninger (8) og mindst to rørafgangsåbninger (9) anordnet i modstående ender af bunddelen, og hvor bunddelens indre er opdelt i et antal kanaler (10) af indragende barrierer (11), og hver kanal forløber mellem en rørtilgangsåbning og en rørafgangsåbning, og barriererne udstrækker sig mellem kanalerne fra de to ender af bunddelen, hvor røråbningerne (8,9) er anbragt, og ind imod midten af bunddelen, hvor to elektroder (12,13) er anordnet på modstående sider af bunddelen vinkelret på kanalerne, kendetegnet ved, at husets (1) rørtilgangsåbninger (8) og rørafgangsåbninger (9) er udformet på undersiden (14) af bunddelen (6) og viser i en i det væsentlige ret vinkel ind til kanalerne (10) i bunddelens indre, og at afstanden mellem sammenhørende røråbninger (8,9) svarer til afstanden mellem rørenderne (16) på rørene (3).Pump housing (1) for an electromagnetic pump (2) for propelling a conductive liquid in pipes (3), in particular for cooling electrical components, which together with the pipes form a closed circuit to which a heat exchanger (4) is connected. ) and a heat sink (5), the pump housing comprising a bottom portion (6) and a lid portion (7), and the bottom portion further comprising at least two pipe access openings (8) and at least two pipe outlet openings (9) disposed at opposite ends of the bottom portion, and the bottom of the bottom portion is divided into a plurality of channels (10) by protruding barriers (11), and each channel extends between a pipe inlet opening and a pipe outlet opening, and the barriers extend between the channels from the two ends of the bottom portion, wherein the tube openings (8,9) are disposed towards the center of the bottom part, where two electrodes (12,13) are arranged on opposite sides of the bottom part perpendicular to the ducts, characterized in that the pipe access openings (8) and pipe outlet openings (9) of the housing (1) are formed. on the underside (14) of the bottom part (6) and shows at a substantially right angle to the channels (10) in the interior of the bottom part, and that the distance between associated pipe openings (8,9) corresponds to the distance between the pipe ends (16) on the pipes (3). 2. Pumpehus ifølge krav 1, kendetegnet ved, at vinklen mellem røråbningeme (8,9) og kanalerne (10) er fra halvfems til et hundrede og tyve grader.Pump housing according to claim 1, characterized in that the angle between the pipe openings (8,9) and the ducts (10) is from ninety to one hundred and twenty degrees. 3. Pumpehus ifølge krav 1, kendetegnet ved, at lågdelen (7) er udstyret med afbøjningsanordninger (15) umiddelbart overfor hver røråbning (8,9).Pump housing according to claim 1, characterized in that the lid part (7) is provided with deflection devices (15) immediately opposite each pipe opening (8,9). 4. Pumpehus ifølge krav 1, kendetegnet ved, at elektroderne (12,13) er udført som udadragende tappe, og at elektroden (13) er udført som et rør til påfyldning af kølevæske.Pump housing according to claim 1, characterized in that the electrodes (12, 13) are designed as outwardly extending pins and that the electrode (13) is designed as a pipe for filling coolant.
DKPA200801351A 2008-09-29 2008-09-29 Pump housing for electromagnetic pump and method for assembling a cooling circuit comprising the pump housing DK200801351A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DKPA200801351A DK200801351A (en) 2008-09-29 2008-09-29 Pump housing for electromagnetic pump and method for assembling a cooling circuit comprising the pump housing
PCT/DK2009/000210 WO2010034312A1 (en) 2008-09-29 2009-09-18 A pump housing for an electromagnetic pump and a method of assembling a cooling circuit comprising the pump housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DKPA200801351A DK200801351A (en) 2008-09-29 2008-09-29 Pump housing for electromagnetic pump and method for assembling a cooling circuit comprising the pump housing

Publications (1)

Publication Number Publication Date
DK200801351A true DK200801351A (en) 2010-03-30

Family

ID=41504466

Family Applications (1)

Application Number Title Priority Date Filing Date
DKPA200801351A DK200801351A (en) 2008-09-29 2008-09-29 Pump housing for electromagnetic pump and method for assembling a cooling circuit comprising the pump housing

Country Status (2)

Country Link
DK (1) DK200801351A (en)
WO (1) WO2010034312A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103796492B (en) * 2014-01-25 2017-01-18 清华大学 Heat collecting end using lotus root-shaped cellular material microchannel module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6447265A (en) * 1987-08-12 1989-02-21 Toshiba Corp Farady type electromagnetic pump
DE19643717A1 (en) * 1996-10-23 1998-04-30 Asea Brown Boveri Liquid cooling device for a high-performance semiconductor module
US20040234392A1 (en) * 2003-05-22 2004-11-25 Nanocoolers Inc. Magnetohydrodynamic pumps for non-conductive fluids
US7417858B2 (en) * 2005-12-21 2008-08-26 Sun Microsystems, Inc. Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits
US7562533B2 (en) * 2006-07-17 2009-07-21 Sun Microsystems, Inc. Thermal-electric-MHD cooling
WO2008128539A2 (en) * 2007-04-20 2008-10-30 Danamics Aps An electromagnetic pump

Also Published As

Publication number Publication date
WO2010034312A1 (en) 2010-04-01

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Legal Events

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AHS Application shelved for other reasons than non-payment