DK165272C - Fremgangsmaade til fremstilling af koelelegemer - Google Patents

Fremgangsmaade til fremstilling af koelelegemer

Info

Publication number
DK165272C
DK165272C DK235786A DK235786A DK165272C DK 165272 C DK165272 C DK 165272C DK 235786 A DK235786 A DK 235786A DK 235786 A DK235786 A DK 235786A DK 165272 C DK165272 C DK 165272C
Authority
DK
Denmark
Prior art keywords
ribs
main grooves
cooling ribs
base plate
grooves
Prior art date
Application number
DK235786A
Other languages
Danish (da)
English (en)
Other versions
DK165272B (da
DK235786D0 (da
DK235786A (da
Inventor
Uwe Bock
Original Assignee
Alusuisse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse filed Critical Alusuisse
Publication of DK235786D0 publication Critical patent/DK235786D0/da
Publication of DK235786A publication Critical patent/DK235786A/da
Publication of DK165272B publication Critical patent/DK165272B/da
Application granted granted Critical
Publication of DK165272C publication Critical patent/DK165272C/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
    • B21K25/00—Uniting components to form integral members, e.g. turbine wheels and shafts, caulks with inserts, with or without shaping of the components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P11/00—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
  • Separation By Low-Temperature Treatments (AREA)
  • Glass Compositions (AREA)
  • Bipolar Transistors (AREA)
  • Medicinal Preparation (AREA)
DK235786A 1985-05-22 1986-05-21 Fremgangsmaade til fremstilling af koelelegemer DK165272C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853518310 DE3518310A1 (de) 1985-05-22 1985-05-22 Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung
DE3518310 1985-05-22

Publications (4)

Publication Number Publication Date
DK235786D0 DK235786D0 (da) 1986-05-21
DK235786A DK235786A (da) 1986-11-23
DK165272B DK165272B (da) 1992-10-26
DK165272C true DK165272C (da) 1993-03-15

Family

ID=6271297

Family Applications (1)

Application Number Title Priority Date Filing Date
DK235786A DK165272C (da) 1985-05-22 1986-05-21 Fremgangsmaade til fremstilling af koelelegemer

Country Status (5)

Country Link
EP (1) EP0206980B1 (enExample)
AT (1) ATE53708T1 (enExample)
DE (2) DE3518310A1 (enExample)
DK (1) DK165272C (enExample)
NO (1) NO170958C (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
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GB2204181B (en) * 1987-04-27 1990-03-21 Thermalloy Inc Heat sink apparatus and method of manufacture
GB2229571B (en) * 1988-11-14 1992-12-23 Johnson Electric Ind Mfg Varistor for an electric motor
DE59106364D1 (de) 1990-10-24 1995-10-05 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente.
DE4314663A1 (de) * 1993-05-04 1994-11-10 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente
CA2107869C (en) * 1993-10-06 1998-05-05 Joseph Lipinski Method and apparatus for fabricating high fin density heatsinks
DE9319259U1 (de) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Kühlkörper
DE9412460U1 (de) * 1994-08-02 1995-12-14 Hoogovens Aluminium Profiltechnik Gmbh, 88267 Vogt Kühlvorrichtung für elektrische bzw. elektronische Bauelemente mit einer Grundplatte und mit Kühlelementen
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
DE29602367U1 (de) * 1995-03-24 1996-05-15 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Kühlkörper für Halbleiterbauelemente o.dgl.
US5819407A (en) * 1995-04-19 1998-10-13 Tousui, Ltd. Method of joining together a pair of members each having a high thermal conductivity
DE29507286U1 (de) * 1995-05-04 1995-07-20 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente o.dgl. Geräte
EP0744241B1 (en) * 1995-05-16 2001-11-14 TOUSUI, Ltd. Method of joining together a pair of members each having a high thermal conductivity
AU720868B2 (en) * 1995-12-14 2000-06-15 Attlington Investments Limited Method of producing a metal section
AU1175297A (en) * 1995-12-14 1997-07-03 Ralf Niemeier Metal section
DE29712058U1 (de) 1996-01-27 1998-04-02 Bayer, Joachim, 51503 Rösrath Kühlkörper zum Anbau an Halbleiterbauelemente sowie Teilprofile zur Herstellung solcher Kühlkörper
EP0789396B1 (de) 1996-01-31 2006-06-14 Alcan Technology & Management AG Kühlkörper für Halbleiterbauelemente od. dgl.
DE29602212U1 (de) * 1996-02-09 1996-05-02 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Kühlkörper für Halbleiterbauelemente o.dgl. Einrichtungen
WO2000003574A2 (de) * 1998-07-09 2000-01-20 Glueck Joachim Kühlkörper mit querrippen
DE19836314A1 (de) * 1998-08-11 2000-02-24 Joachim Bayer Verfahren zur Herstellung von Kühlkörpern zum Anbau an Halbleiterbauelemente
JP3431004B2 (ja) * 2000-01-14 2003-07-28 松下電器産業株式会社 ヒートシンクおよびそれを用いた冷却装置
JP4355412B2 (ja) * 1999-11-26 2009-11-04 昭和電工株式会社 ヒートシンクおよびその製造方法
DE10053240A1 (de) * 2000-08-28 2002-04-04 Alusuisse Tech & Man Ag Kühlkörper für Halbleiterelemente, Verfahren zu seiner Herstellung sowie Formwerkzeug dafür
DE20016316U1 (de) * 2000-09-19 2001-04-05 Boston Cooltec Corp., Wilmington Kühlkörper zur Kühlung insbesondere elektronischer Bauelemente
DE10056387B4 (de) * 2000-11-14 2008-11-13 Corus Aluminium Profiltechnik Gmbh Kühlvorrichtung und Verfahren zu deren Herstellung sowie Vorrichtung zur Durchführung des Verfahrens
JP3529358B2 (ja) * 2001-02-07 2004-05-24 古河電気工業株式会社 フィン付ヒートシンク
DE10141988C1 (de) * 2001-08-28 2003-01-09 Manfred Diels Verfahren zur Herstellung von Kühlkörpern
DE10200019B4 (de) * 2002-01-02 2006-07-06 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente, Verfahren zu dessen Herstellung und Werkzeug zur Durchführung des Verfahrens
DE10229532B4 (de) * 2002-07-01 2008-06-19 Alcan Technology & Management Ag Kühlvorrichtung für Halbleiterbauelemente
DE102005007041A1 (de) * 2005-02-15 2006-08-17 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente oder dgl. Einrichtungen sowie Verfahren zu dessen Herstellung
CN100456914C (zh) * 2005-09-22 2009-01-28 黄崇贤 散热器模组
DE102006038980B4 (de) * 2006-08-21 2009-02-19 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente sowie Verfahren zu seiner Herstellung
EP1926143B1 (de) 2006-11-22 2009-07-15 Alcan Technology & Management AG Kühlkörper für Halbleiterbauelemente oder dergleichen Wärmequellen sowie Verfahren zu dessen Herstellung
EP2027948A1 (de) 2007-08-20 2009-02-25 Alcan Technology & Management AG Verfahren zum Herstellen eines Flachprofils, insbesondere eines Kühlkörpers für Halbleiterelemente od.dgl. Bauteile, sowie Profil dazu
DE102007046684B3 (de) * 2007-08-20 2009-02-26 Alcan Technology & Management Ag Verfahren und Vorrichtung zum Herstellen eines Flachprofils, insbesondere eines Kühlkörpers für Halbleiterelemente od. dgl. Bauteile, sowie Profil dazu
DE102008030110A1 (de) 2008-04-22 2009-10-29 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente aus einer stranggepressten Aluminiumlegierung
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs
TWI348017B (en) * 2009-02-10 2011-09-01 Giga Byte Tech Co Ltd Method of making a heat sink
TWM360549U (en) * 2009-02-10 2009-07-01 Giga Byte Tech Co Ltd Heat-dissipating device
DE102009037259B4 (de) * 2009-08-12 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul
DE102011108221A1 (de) * 2011-07-21 2013-01-24 Hyco-Vakuumtechnik Gmbh Elektromotor mit Kühlrippen
CN103493196B (zh) * 2012-02-06 2016-07-06 华为技术有限公司 具有层叠鳍片的散热片和此散热片的生产方法
DE202013104990U1 (de) * 2013-11-06 2015-02-09 Akg Thermotechnik International Gmbh & Co. Kg Kühlkörper
WO2016096042A1 (en) * 2014-12-19 2016-06-23 Arcelik Anonim Sirketi Individual cooling fin and an electric motor having the same
FR3036918B1 (fr) * 2015-05-29 2018-08-10 Thales Carte electronique et procede de fabrication associe
EP3624184A1 (de) * 2018-09-12 2020-03-18 Siemens Aktiengesellschaft Verfahren zur herstellung einer leistungsmoduleinheit, leistungsmoduleinheit, netzteil und frequenzumrichter
EP3872845A1 (de) * 2020-02-28 2021-09-01 Siemens Aktiengesellschaft Verfahren zur herstellung einer leistungsmoduleinheit
US20220352051A1 (en) * 2021-04-28 2022-11-03 Nidec Corporation Heat dissipation member and cooling device
CN114378543B (zh) * 2022-02-15 2022-10-18 苏州市华盛源机电有限公司 一种插接型散热片的生产方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
DE2502472C2 (de) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Kühlkörper für Thyristoren
DE3024748C2 (de) * 1980-06-30 1986-09-04 Aluminium Walzwerke Singen Gmbh, 7700 Singen Kühlkörper für Halbleiterbauelemente
DE8429523U1 (de) * 1984-10-08 1984-11-29 Nixdorf Computer Ag, 4790 Paderborn Kühlkörper für elektronische Bauelemente und/oder Geräte

Also Published As

Publication number Publication date
EP0206980A3 (en) 1988-08-10
DK165272B (da) 1992-10-26
NO170958C (no) 1992-12-30
NO861948L (no) 1986-11-24
NO170958B (no) 1992-09-21
EP0206980A2 (de) 1986-12-30
DE3672028D1 (de) 1990-07-19
DK235786D0 (da) 1986-05-21
DE3518310C2 (enExample) 1989-05-11
DE3518310A1 (de) 1986-11-27
EP0206980B1 (de) 1990-06-13
DK235786A (da) 1986-11-23
ATE53708T1 (de) 1990-06-15

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Legal Events

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PUP Patent expired