DK143830C - Anvendelse af en alkalisk oploesning til aetsning af kobberledere ved fremstilling af trykte kredsloeb - Google Patents

Anvendelse af en alkalisk oploesning til aetsning af kobberledere ved fremstilling af trykte kredsloeb

Info

Publication number
DK143830C
DK143830C DK556470A DK556470A DK143830C DK 143830 C DK143830 C DK 143830C DK 556470 A DK556470 A DK 556470A DK 556470 A DK556470 A DK 556470A DK 143830 C DK143830 C DK 143830C
Authority
DK
Denmark
Prior art keywords
preparation
application
printed circuits
copper conductors
alkalic solution
Prior art date
Application number
DK556470A
Other languages
Danish (da)
English (en)
Other versions
DK143830B (da
Inventor
R J Zeblisky
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of DK143830B publication Critical patent/DK143830B/da
Application granted granted Critical
Publication of DK143830C publication Critical patent/DK143830C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DK556470A 1969-11-03 1970-11-02 Anvendelse af en alkalisk oploesning til aetsning af kobberledere ved fremstilling af trykte kredsloeb DK143830C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87363669A 1969-11-03 1969-11-03
US87363669 1969-11-03

Publications (2)

Publication Number Publication Date
DK143830B DK143830B (da) 1981-10-12
DK143830C true DK143830C (da) 1982-03-29

Family

ID=25362023

Family Applications (1)

Application Number Title Priority Date Filing Date
DK556470A DK143830C (da) 1969-11-03 1970-11-02 Anvendelse af en alkalisk oploesning til aetsning af kobberledere ved fremstilling af trykte kredsloeb

Country Status (8)

Country Link
JP (1) JPS5014225B1 (de)
AT (1) AT313014B (de)
CH (1) CH529831A (de)
DE (1) DE2055251C3 (de)
DK (1) DK143830C (de)
FR (1) FR2082950A5 (de)
GB (1) GB1295954A (de)
NL (1) NL7016104A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232619A (en) * 1990-10-19 1993-08-03 Praxair S.T. Technology, Inc. Stripping solution for stripping compounds of titanium from base metals
CN1865366B (zh) * 2005-05-16 2010-12-15 3M创新有限公司 提高有机聚合物涂层对铜表面附着力的方法和组合物
US20100256034A1 (en) * 2005-09-22 2010-10-07 Pantheon Chemical, Inc. Copper chelating agent, composition including the agent, and methods of forming and using the agent and composition
DE102006004826B4 (de) * 2006-01-31 2013-12-05 Qimonda Ag Metall- und Cyanid-Ionen-freie Ätzlösung zur nasschemischen Strukturierung von Metallschichten in der Halbleiterindustrie und deren Verwendung in einem Ätzverfahren

Also Published As

Publication number Publication date
AT313014B (de) 1974-01-25
DE2055251B2 (de) 1978-06-15
CH529831A (de) 1972-10-31
DE2055251C3 (de) 1980-09-04
GB1295954A (de) 1972-11-08
DK143830B (da) 1981-10-12
DE2055251A1 (de) 1971-06-16
FR2082950A5 (de) 1971-12-10
JPS5014225B1 (de) 1975-05-26
NL7016104A (de) 1971-05-05

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