DK0927510T3 - Varmebortledende hus til optagelse af elektriske eller elektroniske konstruktionselementer - Google Patents

Varmebortledende hus til optagelse af elektriske eller elektroniske konstruktionselementer

Info

Publication number
DK0927510T3
DK0927510T3 DK98925638T DK98925638T DK0927510T3 DK 0927510 T3 DK0927510 T3 DK 0927510T3 DK 98925638 T DK98925638 T DK 98925638T DK 98925638 T DK98925638 T DK 98925638T DK 0927510 T3 DK0927510 T3 DK 0927510T3
Authority
DK
Denmark
Prior art keywords
heat conduction
structural elements
recording electrical
electronic structural
conduction housing
Prior art date
Application number
DK98925638T
Other languages
Danish (da)
English (en)
Inventor
Karsten Huebner
Martin Diehl
Original Assignee
Lenze Gmbh & Co Kg Aerzen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lenze Gmbh & Co Kg Aerzen filed Critical Lenze Gmbh & Co Kg Aerzen
Application granted granted Critical
Publication of DK0927510T3 publication Critical patent/DK0927510T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DK98925638T 1997-05-30 1998-05-27 Varmebortledende hus til optagelse af elektriske eller elektroniske konstruktionselementer DK0927510T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19722602A DE19722602C2 (de) 1997-05-30 1997-05-30 Wärmeableitendes Gehäuse zur Aufnahme von elektrischen oder elektronischen Bauteilen
PCT/EP1998/003112 WO1998054940A1 (fr) 1997-05-30 1998-05-27 Boitier calorifuge servant a loger des composants electriques ou electroniques

Publications (1)

Publication Number Publication Date
DK0927510T3 true DK0927510T3 (da) 2002-03-25

Family

ID=7830896

Family Applications (1)

Application Number Title Priority Date Filing Date
DK98925638T DK0927510T3 (da) 1997-05-30 1998-05-27 Varmebortledende hus til optagelse af elektriske eller elektroniske konstruktionselementer

Country Status (6)

Country Link
US (1) US6225559B1 (fr)
EP (1) EP0927510B1 (fr)
DE (2) DE19722602C2 (fr)
DK (1) DK0927510T3 (fr)
ES (1) ES2168763T3 (fr)
WO (1) WO1998054940A1 (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4415503B2 (ja) * 2000-05-12 2010-02-17 株式会社デンソー 半導体装置
DE20101106U1 (de) * 2001-01-22 2001-04-05 David & Baader Dbk Gmbh Schutzelement in einem elektrischen Schaltkreis
DE20115659U1 (de) 2001-09-24 2002-02-14 Trw Automotive Electron & Comp Gehäuse für ein elektronisches Steuergerät in Fahrzeugen
US6583988B1 (en) * 2002-02-05 2003-06-24 Whelen Engineering Company, Inc. Encapsulated power supply
US6864573B2 (en) * 2003-05-06 2005-03-08 Daimlerchrysler Corporation Two piece heat sink and device package
DE10326458B4 (de) * 2003-06-12 2006-05-04 Phoenix Contact Gmbh & Co. Kg Kühlanordnung für elektronische Bauelemente
DE10334060B3 (de) * 2003-07-25 2005-04-07 Siemens Ag Schaltungsmodul und Verfahren zu dessen Herstellung
DE10334629B3 (de) * 2003-07-29 2005-04-07 Siemens Ag Schaltungsmodul und Verfahren zu dessen Herstellung
EP1511368B1 (fr) * 2003-08-29 2015-05-20 Hirschmann Car Communication GmbH Boîtier-sandwich pour un amplificateur d' antenne
WO2006018882A1 (fr) * 2004-08-19 2006-02-23 Fujitsu Limited Structure de boîtier et équipement électronique comprenant ladite structure
US20060101536A1 (en) * 2004-11-05 2006-05-11 Arborgen, Llc Eucalyptus urophylla transformation and regeneration
TWI247574B (en) * 2004-11-30 2006-01-11 Silicon Integrated Sys Corp Heat dissipation mechanism for electronic device
DE102005015749A1 (de) * 2005-04-06 2006-10-12 Conti Temic Microelectronic Gmbh Kühlvorrichtung für Leiterplatten und Verfahren zur Herstellung derselben
DE102005035378B3 (de) * 2005-06-25 2006-11-23 Lear Corporation Gmbh & Co. Kg Anordung zum Kühlen von auf einer Leiterplatte angeordneten Bauelementen
US7336491B2 (en) 2005-09-06 2008-02-26 Lear Corporation Heat sink
GB2430310A (en) * 2005-09-15 2007-03-21 Tyco Electronics A heat dissipation device
DE102006062711B4 (de) * 2006-06-09 2008-10-09 Fpe Fischer Gmbh Verfahren zur Überwachung und zum Schutz von einzelnen Solar-Panels vor Überhitzung
DE102006039506B3 (de) * 2006-08-23 2008-01-03 Siemens Ag Österreich Kühlanordnung
JP5044476B2 (ja) 2008-04-11 2012-10-10 ホシデン株式会社 シールドケース及び基板アッセンブリ
JP4548517B2 (ja) * 2008-05-26 2010-09-22 株式会社豊田自動織機 発熱部品の実装構造及び実装方法
US8773864B2 (en) * 2008-06-18 2014-07-08 Lockheed Martin Corporation Enclosure assembly housing at least one electronic board assembly and systems using same
US8189345B2 (en) * 2008-06-18 2012-05-29 Lockheed Martin Corporation Electronics module, enclosure assembly housing same, and related systems and methods
DE202008013766U1 (de) 2008-11-10 2009-01-08 Lear Corporation Gmbh Gehäuse zur Aufnahme mindestens einer mit Bauelementen bestückten Leiterplatte
US8072761B2 (en) 2009-05-14 2011-12-06 American Power Conversion Corporation Power semiconductor heatsinking
US8169781B2 (en) * 2010-04-06 2012-05-01 Fsp Technology Inc. Power supply and heat dissipation module thereof
DE102010030460A1 (de) * 2010-06-24 2011-12-29 Robert Bosch Gmbh Elektronisches Gerät mit Gehäuse aus Profilmaterial
DE102011005890A1 (de) * 2011-03-22 2012-09-27 Robert Bosch Gmbh Elektronikgerät mit Schaltungsträger in einem Einschubgehäuse
JP5883420B2 (ja) * 2013-08-26 2016-03-15 原田工業株式会社 車載用回路基板保持構造
DE102015202142A1 (de) * 2015-02-06 2016-08-11 Mahle International Gmbh Elektrische Einrichtung
FR3035266B1 (fr) * 2015-04-17 2017-03-31 Sagemcom Broadband Sas Equipement electronique
US11560101B2 (en) 2020-11-17 2023-01-24 Ford Global Technologies, Llc Headliner-mounted telematics control unit package
KR20220092263A (ko) * 2020-12-24 2022-07-01 현대모비스 주식회사 전력부품의 방열 조립 구조

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8528177U1 (de) * 1985-10-03 1985-11-21 Eberle GmbH, 8500 Nürnberg Kühlkörper in Gehäuseform für einen Regler mit einschiebbarer Leiterplatte
US4809875A (en) * 1987-11-30 1989-03-07 Yazaki Corporation Electrical component container having improved hinge unit
DE8901279U1 (fr) * 1989-02-05 1989-03-23 Asea Brown Boveri Ag, 6800 Mannheim, De
DE3912730C2 (de) * 1989-04-19 1993-11-18 Stocko Metallwarenfab Henkels Gehäuse mit Deckel und Filmscharnier
DE9213671U1 (fr) * 1991-11-11 1992-12-03 Tridonic-Bauelemente Gmbh, Dornbirn, At
US5321582A (en) * 1993-04-26 1994-06-14 Cummins Engine Company, Inc. Electronic component heat sink attachment using a low force spring
US5402313A (en) * 1993-05-21 1995-03-28 Cummins Engine Company, Inc. Electronic component heat sink attachment using a canted coil spring
US5309979A (en) * 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
US5476699A (en) * 1993-11-02 1995-12-19 Hughes Aircraft Company Extrusion interlock assembly
US5461541A (en) * 1994-02-22 1995-10-24 Dana Corporation Enclosure for an electronic circuit module
DE19543260C2 (de) * 1995-11-20 2001-09-20 Robert Seuffer Gmbh & Co Elektrische Bauelementeanordnung mit mehreren in einem Gehäuse angeordneten elektrischen Bauelementen
US5959839A (en) * 1997-01-02 1999-09-28 At&T Corp Apparatus for heat removal using a flexible backplane

Also Published As

Publication number Publication date
EP0927510A1 (fr) 1999-07-07
ES2168763T3 (es) 2002-06-16
DE59802426D1 (de) 2002-01-24
DE19722602A1 (de) 1998-12-03
DE19722602C2 (de) 2001-03-29
EP0927510B1 (fr) 2001-12-12
WO1998054940A1 (fr) 1998-12-03
US6225559B1 (en) 2001-05-01

Similar Documents

Publication Publication Date Title
DK0927510T3 (da) Varmebortledende hus til optagelse af elektriske eller elektroniske konstruktionselementer
FI964394A0 (fi) Elektronisten komponenttien kotelo
DE69808999T2 (de) Wärmeleitende Siliconzusammensetzung
DE59809591D1 (de) Wärmeisolierendes gehäuse
DE69819432D1 (de) Wärmefixiergerät
DK1023562T3 (da) Varmeisolerende hus
DE29812076U1 (de) Verbesserung der Positionierung von Einschubcomputer
DE29807806U1 (de) Motorgehäuse mit verbesserter Wärmeableitung
DE29716303U1 (de) Elektrisches Gerät mit Bauelementwärmeleitung
NO20002194L (no) Nulleffekt nullstillingskrets
DE59801493D1 (de) Baugruppenträger mit Abdeckblechen
DE69816691D1 (de) Wärmefixiergerät
BR9800600A (pt) Conjunto de involucro para alojamento de elemento dessecante
DE69803898D1 (de) Kassette aufnehmendes Gehäuse
DK0681420T3 (da) Hus, især til optagelse af elektriske eller elektroniske komponenter
DE69727292D1 (de) Serielles Thermisches Aufzeichnungsgerät
ATA3997A (de) Umlaufwasserheizer
DE59804347D1 (de) Übertemperatur-schutzschaltung
DE69801055T2 (de) Einschiebbare elektronische baugruppe mit verbessertem wärmeabfuhr
KR970014615U (ko) 전자식 냉각장치를 이용한 냉각용 하우징
DE29707378U1 (de) Thermisch isolierendes Bauelement
DK0907231T3 (da) Anordning til fastgørelse af elektriske eller elektroniske komponenter
DE59801492D1 (de) Baugruppenträger mit Abdeckblechen
DE29818813U1 (de) Schaltungsgehäuse
NO20001935D0 (no) Isolert varmesensitiv komponent