DK0660861T3 - Vandige VOC-frie epoxygrundersammensætninger - Google Patents

Vandige VOC-frie epoxygrundersammensætninger

Info

Publication number
DK0660861T3
DK0660861T3 DK93921482.1T DK93921482T DK0660861T3 DK 0660861 T3 DK0660861 T3 DK 0660861T3 DK 93921482 T DK93921482 T DK 93921482T DK 0660861 T3 DK0660861 T3 DK 0660861T3
Authority
DK
Denmark
Prior art keywords
primer compositions
epoxy primer
free epoxy
aqueous
adherend
Prior art date
Application number
DK93921482.1T
Other languages
Danish (da)
English (en)
Inventor
David Eugene Sweet
Original Assignee
Cytec Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Tech Corp filed Critical Cytec Tech Corp
Application granted granted Critical
Publication of DK0660861T3 publication Critical patent/DK0660861T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/166—Metal in the pretreated surface to be joined

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DK93921482.1T 1992-09-14 1993-09-10 Vandige VOC-frie epoxygrundersammensætninger DK0660861T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94457092A 1992-09-14 1992-09-14

Publications (1)

Publication Number Publication Date
DK0660861T3 true DK0660861T3 (da) 1997-08-25

Family

ID=25481659

Family Applications (1)

Application Number Title Priority Date Filing Date
DK93921482.1T DK0660861T3 (da) 1992-09-14 1993-09-10 Vandige VOC-frie epoxygrundersammensætninger

Country Status (9)

Country Link
US (3) US5461090A (fr)
EP (1) EP0660861B1 (fr)
JP (1) JPH08501341A (fr)
AT (1) ATE153039T1 (fr)
CA (1) CA2144547C (fr)
DE (1) DE69310754T2 (fr)
DK (1) DK0660861T3 (fr)
ES (1) ES2102059T3 (fr)
WO (1) WO1994006876A1 (fr)

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WO1998015587A1 (fr) * 1996-10-08 1998-04-16 Cytec Technology Corp. Compositions de reticulation et revetements epoxydes peu lustres obtenus a partir de ces compositions
TW457284B (en) * 1997-09-12 2001-10-01 Cytec Tech Corp Water based primer compositions and their use for treating metal surfaces
MXPA01008706A (es) 2000-09-03 2004-08-12 Rohm & Haas Sistemas aditivos polimericos altos en solidos: composiciones, procesos y productos de los mismos.
MXPA01008532A (es) * 2000-09-03 2002-08-06 Rohm & Haas Sistema de acitivos funcionales de liquidos-solidos; sus composiciones, procesos y productos.
MXPA01008705A (es) * 2000-09-03 2004-08-12 Rohm & Haas Sistemas de aditivos polimericos multiples: composiciones, procesos y productos derivados.
DE10058870A1 (de) * 2000-11-27 2002-06-06 Basf Coatings Ag Wässriger Beschichtungsstoff, Verfahren zu seiner Herstellung und seine Verwendung
US6750274B2 (en) 2001-02-08 2004-06-15 Ppg Industries Ohio. Inc. Weldable coating of phosphated epoxy polymer, curing agent and electroconductive pigment
WO2002083328A1 (fr) * 2001-04-11 2002-10-24 World Properties Inc. Procede d'amelioration de l'agglomeration de compositions rigides et thermodurcissables sur du metal, et articles ainsi obtenus
EP1401526B1 (fr) * 2001-07-05 2006-12-06 Precision Vascular Systems, Inc. Dispositif medical a pointe souple pouvant etre soumis a un couple et son procede de faconnage
WO2003020000A1 (fr) * 2001-08-22 2003-03-06 World Properties Inc. Procede permettant l'amelioration du collage de substrats de circuits sur du metal et articles ainsi obtenus
US6916874B2 (en) * 2001-09-06 2005-07-12 Valspar Sourcing, Inc. Coating compositions having epoxy functional stabilizer
DE60203313T2 (de) * 2001-09-06 2006-04-06 Valspar Sourcing, Inc., Minneapolis Stabilisierte beschichtungszusammensetzungen
US6924328B2 (en) * 2001-09-06 2005-08-02 Valspar Sourcing, Inc. Stabilized coating compositions
JP4602080B2 (ja) * 2002-07-25 2010-12-22 ボストン サイエンティフィック リミテッド 人体構造内を進行する医療用具
US7914467B2 (en) * 2002-07-25 2011-03-29 Boston Scientific Scimed, Inc. Tubular member having tapered transition for use in a medical device
US7001369B2 (en) 2003-03-27 2006-02-21 Scimed Life Systems, Inc. Medical device
JP4433368B2 (ja) * 2003-04-08 2010-03-17 ジャパンエポキシレジン株式会社 エポキシ樹脂粒状化物及びその製造方法
JP4151573B2 (ja) * 2003-12-16 2008-09-17 東洋紡績株式会社 硬化型組成物
US7348370B2 (en) * 2005-04-27 2008-03-25 United Technologies Corporation Metal oxides and hydroxides as corrosion inhibitor pigments for a chromate-free corrosion resistant epoxy primer
ES2523645T3 (es) * 2005-07-08 2014-11-28 Henkel Corporation Composiciones de imprimación para sistemas de unión adhesiva
WO2009039249A1 (fr) * 2007-09-18 2009-03-26 Martinrea Industries, Inc. Revêtement à base aqueuse résistant à la corrosion
WO2009036790A1 (fr) * 2007-09-21 2009-03-26 Henkel Ag & Co. Kgaa Compositions de primaires pour systèmes et revêtements de fixation par collage
KR101785119B1 (ko) * 2009-03-31 2017-10-12 사이텍 테크놀러지 코포레이션 구조적 결합 용도를 위한 수계 비-크롬화된 프라이머
US7897703B2 (en) 2009-05-20 2011-03-01 Hexcel Corporation Epoxy resin and 4,4′-diaminobenzanilide powder
JP5444469B2 (ja) 2009-08-24 2014-03-19 ダウ グローバル テクノロジーズ エルエルシー 粒子状エポキシ樹脂を製造する方法
WO2011123689A1 (fr) 2010-03-31 2011-10-06 Boston Scientific Scimed, Inc. Fil guide ayant un profil de rigidité à la flexion
US9068040B2 (en) 2010-10-12 2015-06-30 Hexcel Corporation Solvent resistant thermoplastic toughened epoxy
KR101952461B1 (ko) 2010-12-14 2019-02-26 디에스엠 아이피 어셋츠 비.브이. 레이돔을 위한 물질 및 이의 제조 방법
EP2675621A1 (fr) 2011-02-17 2013-12-25 DSM IP Assets B.V. Matériau à énergie de transmission accrue et son procédé de fabrication
WO2014004358A2 (fr) 2012-06-29 2014-01-03 Dow Global Technologies Llc Dispersion de mélange de résine époxy et procédé de préparation de la dispersion
JP5786839B2 (ja) * 2012-12-05 2015-09-30 株式会社デンソー エポキシ樹脂組成物および接着構造体の製造方法
GB201421373D0 (en) 2014-12-02 2015-01-14 Cytec Ind Inc Modified amine curing agents, their preparation and use in curable compositions
EP3289033A1 (fr) 2015-05-01 2018-03-07 LORD Corporation Adhésif pour collage de caoutchouc
US11434380B2 (en) 2017-03-24 2022-09-06 3M Innovative Properties Company Aqueous primer composition and related methods
CN111164151A (zh) * 2017-10-10 2020-05-15 味之素株式会社 固化体及其制造方法、树脂片材及树脂组合物
CN114585696B (zh) 2019-10-21 2023-07-28 3M创新有限公司 含水底漆组合物及其方法
JP2023502377A (ja) 2019-11-15 2023-01-24 スリーエム イノベイティブ プロパティズ カンパニー プライマー組成物及び方法

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Also Published As

Publication number Publication date
DE69310754T2 (de) 1997-11-27
CA2144547A1 (fr) 1994-03-31
EP0660861A1 (fr) 1995-07-05
DE69310754D1 (de) 1997-06-19
CA2144547C (fr) 2003-09-09
ATE153039T1 (de) 1997-05-15
EP0660861B1 (fr) 1997-05-14
WO1994006876A1 (fr) 1994-03-31
ES2102059T3 (es) 1997-07-16
US5461090A (en) 1995-10-24
US5641818A (en) 1997-06-24
US5576061A (en) 1996-11-19
JPH08501341A (ja) 1996-02-13

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