DE962279C - Process for the creation of areas of different conductivity on the surface of germanium - Google Patents

Process for the creation of areas of different conductivity on the surface of germanium

Info

Publication number
DE962279C
DE962279C DE1951L0011023 DEL0011023A DE962279C DE 962279 C DE962279 C DE 962279C DE 1951L0011023 DE1951L0011023 DE 1951L0011023 DE L0011023 A DEL0011023 A DE L0011023A DE 962279 C DE962279 C DE 962279C
Authority
DE
Germany
Prior art keywords
germanium
areas
creation
melting
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1951L0011023
Other languages
German (de)
Inventor
Dr Phil Werner Koch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE1951L0011023 priority Critical patent/DE962279C/en
Priority to FR1067565D priority patent/FR1067565A/en
Application granted granted Critical
Publication of DE962279C publication Critical patent/DE962279C/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Description

(WiGBl. S. 175)(WiGBl. P. 175)

AUSGEGEBEN AM 18. APRIL 1957ISSUED APRIL 18, 1957

L 11023 VIIIc/21gL 11023 VIIIc / 21g

ist als Erfinder genannt wordenhas been named as the inventor

In der Technik haben die Grenzflächen von defekt- und Überschuß leitenden Bereichen von Halbleitern (p-n- j unction) sowohl für Gleichrichter als auch für Steuerzwecke steigende Bedeutung gewonnen. Es war bisher bekannt, Gebiete unterschiedlicher S törleitfähigkeit an der Oberfläche von Germanium durch eine Wärmebehandlung in einem Temperaturbereich zwischen 400 und 9000 zu erzeugen. Dies hat jedoch zur Folge, daß sich keine scharfe Grenze zwischen den Gebieten unterschiedlicher Störleitfähigkeit ausbildet, weil sich eine stetige Verteilung der Leitfähigkeitseigenschaften ergibt.In technology, the interfaces between defective and excess conductive areas of semiconductors (pn junction) have become increasingly important both for rectifiers and for control purposes. It has hitherto been known, areas of different S törleitfähigkeit on the surface of germanium by a heat treatment in a temperature range between 400 and 900 0 to produce. However, this has the consequence that there is no sharp boundary between the areas of different interfering conductivity, because there is a steady distribution of the conductivity properties.

Die vorliegende Erfindung bezieht sich auf ein Verfahren zur Erzeugung von Gebieten unterschiedlicher Störleitfähigkeit an der Oberfläche von Germanium, das sich von den bisher bekannten dadurch unterscheidet, daß die Oberfläche von Überschuß leitendem Germanium ganz oder teilweise geschmolzen wird. Auf diese Weise entsteht auf der Oberfläche des in der Tiefe überschußleitenden Materials eine Schicht mit Defektleitungscharakter, die sich entweder über die ganze Oberfläche erstreckt oder über einen mehr oder weniger großen Teil derselben. Dies hat gegenüber dem vorbekannten Verfahren den Vorteil, daß der angeschmolzene Teil der Oberfläche seinen Leitfähigkeitscharakter ändert, während das verbleibende Halbleitermaterial seinen Leitfähigkeitscharakter beibehält. Es kommt somit zur Bildung einer schärferen Grenze zwischen den Gebieten unterschiedlichen Leitfähigkeitscharakters als bei den vorbekannten Verfahren und somit zur Ausbildung einer wirksamen Sperrschicht.The present invention relates to a method for creating areas of different Interference conductivity on the surface of germanium, which differs from the previously known differs in that the surface of excess conductive germanium wholly or partially is melted. In this way, excess-conductive material arises on the surface of the deeply conductive material Materials a layer with the character of a defect conduction, which either extends over the entire surface or over a more or less large part of them. This has compared to the previously known Method has the advantage that the fused part of the surface has its conductivity character changes while the remaining semiconductor material retains its conductivity character. This creates a sharper border between the different areas Conductivity character than in the previously known methods and thus for the formation of an effective Barrier.

Das oberflächliche Schmelzen kann z. B. mit einem oder mehreren Elektronenstrahlen vorgenommen werden. Bei der Anwendung dieses Verfahrens wird erreicht, daß nur eine Oberflächenschicht verhältnismäßig geringer Dicke von dem Schmelzvorgang erfaßt wird und sofort anschließend an den Schmelzvorgang' durch das darauf befindliche, kalt gebliebene Kristallmaterial schnell abgekühlt wird. Man erhält auf diese WeiseThe superficial melting can e.g. B. made with one or more electron beams will. When using this method it is achieved that only one surface layer relatively small thickness is detected by the melting process and immediately thereafter to the melting process' through the remaining cold crystal material on it is cooled quickly. One gets in this way

ίο eine ziemlich scharfe Grenze zwischen einem Überschuß- und einem defektleitenden Bereich. Selbstverständlich können an Stelle der Energiezufuhr mit Elektronenstrahlen alle übrigen Erhitzungsverfahren Anwendung finden, bei denen die Energiezufuhr ebenfalls auf eine Schicht geringer Dicke beschränkt bleibt.ίο a fairly sharp line between an excess and a defect-conducting area. Of course, instead of the energy supply with electron beams all other heating processes are used in which the supply of energy also remains limited to a layer of small thickness.

Als besonders zweckmäßig sind noch zu nennen das oberflächliche Schmelzen mittels Hochfrequenz in einer neutralen Atmosphäre und das Anschmel-Superficial melting by means of high frequency should also be mentioned as particularly expedient in a neutral atmosphere and the melting

ao zen der Oberfläche mit Hilfe eines Lichtbogens, der in Wasserstoff, insbesondere in atomarem Wasserstoff (z. B. Arcatombogen), brennt.ao zen the surface with the help of an electric arc generated in hydrogen, especially in atomic Hydrogen (e.g. Arcatombogen) burns.

Ein weiterer besonderer Vorteil dieses Verfahrens ist, daß mit seiner Hilfe die Fläche der Schmelzstelle sehr klein gehalten werden kann, und zwar in dem Sinne, daß sie gegenüber der gesamten Oberfläche klein ist. Auf diese Weise ist es z. B. möglich, Dioden herzustellen mit einer sehr definierten Kontaktfläche zwischen defekt- und überschußleitendem Bereich, die vor allem keinen zeitlichen Schwankungen unterworfen sind, wie sie z. B. bei der Verwendung von Spitzenelektroden (Whiskern) nur schwer zu vermeiden sind.Another particular advantage of this method is that with its help the area of the Melting point can be kept very small, in the sense that it is compared to the entire Surface is small. In this way it is e.g. B. possible to manufacture diodes with a very defined Contact area between the defective and excess conductive area, which above all does not have a temporal effect Are subject to fluctuations, as z. B. when using tip electrodes (Whiskers) are difficult to avoid.

Claims (5)

Patentansprüche:Patent claims: 1. Verfahren zur Erzeugung von Gebieten unterschiedlicher Störleitfähigkeit an der Oberfläche von Germanium, dadurch gekennzeichnet, daß die Oberfläche von überschußleitendem Germanium ganz oder teilweise geschmolzen wird.1. Process for the creation of areas of different interfering conductivity on the surface of germanium, characterized in that the surface of excess conductive Germanium is wholly or partially melted. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das oberflächliche Schmelzen mittels einem oder mehreren vorzugsweise elektronenoptisch gebündelten Elektronenstrahlen vorgenommen wird.2. The method according to claim 1, characterized in that that the superficial melting by means of one or more preferably electron-optical bundled electron beams is made. 3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das oberflächliche Schmelzen mittels Hochfrequenz vorgenommen wird.3. The method according to claim 1, characterized in that that the superficial melting is carried out by means of high frequency. 4. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das oberflächliche Schmelzen mittels eines in Wasserstoff, insbesondere mittels eines in atomarem Wasserstoff, brennenden Lichtbogens vorgenommen wird.4. The method according to claim 1, characterized in that that the superficial melting by means of one in hydrogen, in particular by means of an arc burning in atomic hydrogen is carried out. 5. Verfahren nach Anspruch 1 oder folgenden, dadurch gekennzeichnet, daß die Schmelzstelle klein ist gegenüber der Oberfläche des Kristalls.5. The method according to claim 1 or the following, characterized in that the melting point is small compared to the surface of the crystal. In Betracht gezogene Druckschriften:
Deutsche Patentanmeldung ρ 51789 VIIIc/21 gD.
Considered publications:
German patent application ρ 51789 VIIIc / 21 gD.
© 609 862 4.57© 609 862 4.57
DE1951L0011023 1951-12-10 1951-12-10 Process for the creation of areas of different conductivity on the surface of germanium Expired DE962279C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE1951L0011023 DE962279C (en) 1951-12-10 1951-12-10 Process for the creation of areas of different conductivity on the surface of germanium
FR1067565D FR1067565A (en) 1951-12-10 1952-12-10 Process for the creation of zones with different asymmetric conductivity characteristics on the surface of germanium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1951L0011023 DE962279C (en) 1951-12-10 1951-12-10 Process for the creation of areas of different conductivity on the surface of germanium

Publications (1)

Publication Number Publication Date
DE962279C true DE962279C (en) 1957-04-18

Family

ID=7258664

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1951L0011023 Expired DE962279C (en) 1951-12-10 1951-12-10 Process for the creation of areas of different conductivity on the surface of germanium

Country Status (2)

Country Link
DE (1) DE962279C (en)
FR (1) FR1067565A (en)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
FR1067565A (en) 1954-06-16

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