DE9215889U1 - - Google Patents

Info

Publication number
DE9215889U1
DE9215889U1 DE9215889U DE9215889U DE9215889U1 DE 9215889 U1 DE9215889 U1 DE 9215889U1 DE 9215889 U DE9215889 U DE 9215889U DE 9215889 U DE9215889 U DE 9215889U DE 9215889 U1 DE9215889 U1 DE 9215889U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9215889U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of DE9215889U1 publication Critical patent/DE9215889U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
DE9215889U 1991-11-22 1992-11-23 Expired - Lifetime DE9215889U1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30785691A JPH05275487A (ja) 1991-11-22 1991-11-22 電子部品表面保護材、その表面保護材を備えた電子部品、およびその表面保護材を使用した電子部品の電気的接続方法

Publications (1)

Publication Number Publication Date
DE9215889U1 true DE9215889U1 (fr) 1993-04-01

Family

ID=17974001

Family Applications (2)

Application Number Title Priority Date Filing Date
DE9215889U Expired - Lifetime DE9215889U1 (fr) 1991-11-22 1992-11-23
DE19924239324 Withdrawn DE4239324A1 (en) 1991-11-22 1992-11-23 Protective coating for electronic device contg. fluorinated acrylate] - and/or fluorinated polyurethane and opt. acrylic] resin, applied as organic soln.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19924239324 Withdrawn DE4239324A1 (en) 1991-11-22 1992-11-23 Protective coating for electronic device contg. fluorinated acrylate] - and/or fluorinated polyurethane and opt. acrylic] resin, applied as organic soln.

Country Status (2)

Country Link
JP (1) JPH05275487A (fr)
DE (2) DE9215889U1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995015579A1 (fr) * 1993-11-30 1995-06-08 Giat Industries Procede d'encapsulation de composants ou de modules electroniques et dispositfs encapsules par ledit procede

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4432294A1 (de) * 1994-09-12 1996-03-14 Telefunken Microelectron Verfahren zur Reduzierung der Oberflächenrekombinationsgeschwindigkeit in Silizium
JP3962940B2 (ja) * 1998-10-15 2007-08-22 味の素株式会社 フレキシブル回路オーバーコート用樹脂組成物
US6423470B1 (en) 1999-08-20 2002-07-23 3M Innovative Properties Company Printed circuit substrate with controlled placement covercoat layer
AU6371200A (en) * 1999-08-20 2001-03-19 3M Innovative Properties Company Printed circuit substrate with photoimageable covercoat layer
JP2002151834A (ja) * 2000-11-10 2002-05-24 Fujitsu Ten Ltd 基板の防湿方法
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
GB2462824A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Printed circuit board encapsulation
MX2011001775A (es) 2008-08-18 2011-06-20 Semblant Global Ltd Revestimiento de polimero de halo-hidrocarburo.
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995015579A1 (fr) * 1993-11-30 1995-06-08 Giat Industries Procede d'encapsulation de composants ou de modules electroniques et dispositfs encapsules par ledit procede
FR2713396A1 (fr) * 1993-11-30 1995-06-09 Giat Ind Sa Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.

Also Published As

Publication number Publication date
DE4239324A1 (en) 1993-05-27
JPH05275487A (ja) 1993-10-22

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