AU6371200A - Printed circuit substrate with photoimageable covercoat layer - Google Patents

Printed circuit substrate with photoimageable covercoat layer

Info

Publication number
AU6371200A
AU6371200A AU63712/00A AU6371200A AU6371200A AU 6371200 A AU6371200 A AU 6371200A AU 63712/00 A AU63712/00 A AU 63712/00A AU 6371200 A AU6371200 A AU 6371200A AU 6371200 A AU6371200 A AU 6371200A
Authority
AU
Australia
Prior art keywords
printed circuit
circuit substrate
covercoat layer
photoimageable covercoat
photoimageable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU63712/00A
Inventor
Robert M. Anderton
David L. Buster
John B. Scheibner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US37867799A priority Critical
Priority to US09378677 priority
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to PCT/US2000/020176 priority patent/WO2001015501A1/en
Publication of AU6371200A publication Critical patent/AU6371200A/en
Application status is Abandoned legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0156Temporary polymeric carrier or foil, e.g. for processing or transferring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate
AU63712/00A 1999-08-20 2000-07-25 Printed circuit substrate with photoimageable covercoat layer Abandoned AU6371200A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US37867799A true 1999-08-20 1999-08-20
US09378677 1999-08-20
PCT/US2000/020176 WO2001015501A1 (en) 1999-08-20 2000-07-25 Printed circuit substrate with photoimageable covercoat layer

Publications (1)

Publication Number Publication Date
AU6371200A true AU6371200A (en) 2001-03-19

Family

ID=23494088

Family Applications (1)

Application Number Title Priority Date Filing Date
AU63712/00A Abandoned AU6371200A (en) 1999-08-20 2000-07-25 Printed circuit substrate with photoimageable covercoat layer

Country Status (2)

Country Link
AU (1) AU6371200A (en)
WO (1) WO2001015501A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5200362A (en) * 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
JPH06101494B2 (en) * 1991-02-14 1994-12-12 インターナショナル・ビジネス・マシーンズ・コーポレイション Protective bottom coating for tape automated bonding device
US5360946A (en) * 1991-09-17 1994-11-01 International Business Machines Corporation Flex tape protective coating
JPH05275487A (en) * 1991-11-22 1993-10-22 I N G:Kk Electronic parts surface protecting material, electronic parts equipped with the same, and electric connection method of electronic parts using said material
US5336564A (en) * 1993-12-06 1994-08-09 Grumman Aerospace Corporation Miniature keeper bar
JP3666955B2 (en) * 1995-10-03 2005-06-29 日本メクトロン株式会社 Preparation of flexible circuit board
JPH09298219A (en) * 1996-05-09 1997-11-18 Hitachi Cable Ltd Manufacture of tab tape carrier
EP0891127A3 (en) * 1997-07-11 2000-03-22 Lexmark International, Inc. TAB circuit protective coating

Also Published As

Publication number Publication date
WO2001015501A1 (en) 2001-03-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase