DE885746C - Method for gluing boards made of wood or other materials using high-frequency electrical fields - Google Patents

Method for gluing boards made of wood or other materials using high-frequency electrical fields

Info

Publication number
DE885746C
DE885746C DES5056D DES0005056D DE885746C DE 885746 C DE885746 C DE 885746C DE S5056 D DES5056 D DE S5056D DE S0005056 D DES0005056 D DE S0005056D DE 885746 C DE885746 C DE 885746C
Authority
DE
Germany
Prior art keywords
boards
wood
materials
gluing
glue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DES5056D
Other languages
German (de)
Inventor
Karl Dr Phil Krammer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DES5056D priority Critical patent/DE885746C/en
Priority to CH222067D priority patent/CH222067A/en
Priority to FR871825D priority patent/FR871825A/en
Application granted granted Critical
Publication of DE885746C publication Critical patent/DE885746C/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B41/00Circuit arrangements or apparatus for igniting or operating discharge lamps
    • H05B41/02Details
    • H05B41/04Starting switches
    • H05B41/06Starting switches thermal only
    • H05B41/08Starting switches thermal only heated by glow discharge
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27DWORKING VENEER OR PLYWOOD
    • B27D1/00Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B27D1/02Hot tables for warming veneers
    • B27D1/025Hot tables for warming veneers electrically
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/46Dielectric heating
    • H05B6/60Arrangements for continuous movement of material

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Circuit Arrangements For Discharge Lamps (AREA)

Description

Gegenstand der Erfindung ist ein einfaches Verfahren zum Verleimen von Brettern oder ähnlichen langen Gegenständen aus beliebigem Werkstoff, wobei von der bekannten Heißverleimung Gebrauch gemacht wird.The invention relates to a simple method of gluing of boards or similar long objects made of any material, whereby use is made of the known hot glueing.

Bei der Heißverleimung ist es erforderlich, daß die mit Leinm bestrichenen und aneinandergelegten zu verleimenden Gegenstände während der Abbindung des Leimes bzw. Kittes fest zusammengepreßt werden. Da die zum Zusammenpressen benutzten Druckvorrichtungen den Gegenstand auf der gesamten Ausdehnung der Leimfläche pressen müssen, so ist es bei Brettern und ähnlichen langen Gegenständen sehr nachteilig, daß auch die Druckvorrichtungen entsprechend der Länge der Bretter unbequem große Abmessungen haben müssen.When hot gluing, it is necessary that the coated with linen and juxtaposed objects to be glued during the setting of the glue or putties are firmly pressed together. Because the pressure devices used to compress have to press the object over the entire extent of the glue surface, so is it is very disadvantageous in the case of boards and similar long objects that the Printing devices according to the length of the boards inconveniently large dimensions need to have.

Will man ferner eine recht zuverlässige Heißverleimung erzielen, so erreicht man dies dadurch, daß zur Abbindung des Leimes bzw. Kittes, wie es bereits vorgeschlagen worden ist, die zu verleimenden Gegenstände und insbesondere die Leimfuge der Einwirkung elektrischer Hochfrequenzfelder von einer Wellenlänge unter roo m, insbesondere Ultrakurzwellenfelder, ausgesetzt werden.' Auch diese Art der Heißverleimung stößt jedoch bei Brettern und ähnlichen langen Gegenständen auf erhebliche Schwierigkeiten. Da die elektrischen Hochfrequenzfelder gewöhnlich zwischen zwei Kondensatorelektroden erzeugt werden, diese aber eine der Ausdehnung der Leimfuge entsprechende Größe haben müssen, so müssen bei der Verleimung von Brettern auch die Elektroden die gleiche Länge wie die Bretter haben. Dies ist nicht nur wegen der großen Abmessungen unerwünscht, sondern hat auch in elektrischer Hinsicht einen Nachteil. Durch die große Länge der Elektroden wird die Kapazität der Kondensatoranordnung zu groß, um die gewünschte Feldfrequenz zu erreichen. Man könnte zwar daran denken, die unerwünschte Größe der Kapazität dadurch herabzusetzen, daß man die Kondensatorplatten weiter voneinander rückt, doch würde dies wiederum zu einem ungünstigen Streufeld führen, welches eine gute Ausnutzung der Hochfrequenzenergie unmöglich machen würde.If you want to achieve a very reliable hot glue, so this is achieved by setting the glue or putty, as has already been done has been proposed, the objects to be glued and in particular the glue joint the effect of high-frequency electrical fields with a wavelength below roo m, especially ultra-short wave fields. ' Also this type of hot glue However, it encounters considerable difficulties with boards and similar long objects. Because the high frequency electric fields are usually between two capacitor electrodes are generated, but this size corresponds to the expansion of the glue joint must have, so when gluing boards, the electrodes must also have the the same length as the boards. This is not just because of the large size undesirable, but also has a disadvantage from an electrical point of view. Through the If the electrodes are long, the capacitance of the capacitor arrangement will be too great, to achieve the desired field frequency. You might think of it as the undesirable Reduce the size of the capacitance by moving the capacitor plates further move apart, but this would in turn lead to an unfavorable stray field, which would make good use of the high frequency energy impossible.

Erfindungsgemäß werden diese Nachteile dadurch vermieden, daß die mit Leim bestrichenen und aufeinandergelegten Bretter zwischen derart ausgebildeten, zur Ausbreitung des Hochfrequenzfeldes bestimmten Feldelektroden hindurchgeführt werden, daß die räumliche Ausdehnung der Elektroden in der Durchführungsrichtung wesentlich geringer als die der Bretter ist und daß ferner die Bretter im wesentlichen lediglich im Hochfrequenzfeld oder zum mindesten in dessen Nähe mittels einer geeigneten Druckvorrichtung zusammengepreßt werden.According to the invention these disadvantages are avoided in that the coated with glue and placed on top of each other between boards formed in this way, for the propagation of the high-frequency field certain field electrodes passed through that the spatial extent of the electrodes in the feedthrough direction is substantially less than that of the boards and that furthermore the boards are substantially only in the high-frequency field or at least in its vicinity by means of a suitable one Pressure device are compressed.

Die Vorteile der Erfindung sowie weitere Einzelheiten derselben werden an Hand eines in der Zeichnung in den Fig. r und 2 in Seitenansicht und Schnitt dargestellten Ausführungsbeispiels zur Durchführung der Erfindung beschrieben. Zwei miteinander zu verleimende Bretter z und 2' sind unter Zwischenschaltung einer Leimfuge 3 aufeinandergelegt und werden mittels in der Zeichnung nicht dargestellter Vorrichtungen, gegebenenfalls -auch von Hand, durch ein Hochfrequenzfeld hindurchbewegt, welches zwischen den beiden Kon-: densatorelektroden 4 und 5 erzeugt wird. Ferner . ist oberhalb und unterhalb des Hochfrequenzfeldes je eine mit Anpreßrollen versehene Druckvorrichtung 6. und 7 vorgesehen, welche in der durch Pfeile gekennzeichneten. Richtung die Bretter zusammenpressen.. Die Druckvorrichtungen bestehen zweckmäßig aus elektrisch isolierenden Material, um eine Streuung des Hochfrequenzfeldes zu vermeiden. Um der Schrumpfung des Bretterstapels während der Verleimung Rechnung zu tragen, können in die Druckvorrichtung Federn eingeschaltet werden, welche in der Zeichnung durch die Federn 8 und 9 kurz angedeutet sind.The advantages of the invention as well as further details thereof will be given on the basis of one in the drawing in FIGS. r and 2 in side view and section illustrated embodiment described for carrying out the invention. Two Boards to be glued together z and 2 'are with the interposition of a glue joint 3 placed one on top of the other and by means of devices not shown in the drawing, possibly-also by hand, moved through a high-frequency field, which between the two capacitor: capacitor electrodes 4 and 5 is generated. Furthermore. is one above and one below the high-frequency field each provided with pressure rollers Printing device 6 and 7 provided, which in the indicated by arrows. Press the boards together in the direction. The pressure devices are functional made of electrically insulating material in order to scatter the high-frequency field avoid. To account for the shrinkage of the stack of boards during gluing to wear, springs can be switched into the pressure device, which in the drawing by the springs 8 and 9 are briefly indicated.

Das zwischen den Elektroden 4 und 5 erzeugte Hochfrequenzfeld und die Druckvorrichtungen 6 und 7 umfassen zwar nur einen kleinen Teil der gesamten Brettlänge, doch wird beim Hindurchführen der Bretter jede einzelne Stelle derselben sowie der zwischen ihnen befindlichen Leimfuge nacheinander der Einwirkung des Hochfrequenzfeldes sowie auch gleichzeitig der Pressung ausgesetzt.The high frequency field generated between the electrodes 4 and 5 and the printing devices 6 and 7 comprise only a small part of the total Board length, but every single point becomes the same when the boards are passed through as well as the glue joint located between them one after the other the action of the high-frequency field as well as being exposed to the pressure at the same time.

Wie aus Fig.2 der Zeichnung ersichtlich, sind die Elektroden 4 und 5 in der Nähe der Leimfuge mit Vorsprüngen versehen, welche sich rippenförmig längs der Leimfuge erstrecken. Hierdurch wird erreicht, daß die Feldlinien in erhöhtem Maß durch die Leimfuge verlaufen und nur zu einem geringeren Teil die Holzbretter durchdringen, so daß sich eine gute Ausnutzung der Hochfrequenzenergie und somit ein guter Wirkungsgrad ergibt.As can be seen from Figure 2 of the drawing, the electrodes 4 and 5 in the vicinity of the glue joint provided with projections, which are rib-shaped lengthways the glue line extend. This ensures that the field lines in increased Measure through the glue joint and only to a lesser extent the wooden boards penetrate, so that a good utilization of the high frequency energy and thus gives a good efficiency.

Die vorstehend für die Verleimung von Brettern beschriebene Erfindung ist auch zur Verleimung beliebiger anderer Gegenstände großer Längenausdehneng und beliebigen Werkstöffs geeignet, beispielsweise zur Verleimung von dicken Holzbohlen.The invention described above for the gluing of boards can also be used to glue any other objects of great length and length Suitable for any material, for example for gluing thick wooden planks.

Claims (1)

PATENTANSPRUCH: Verfahren zum Verleimen von Brettern und anderen Gegenständen aus Holz und anderen Werkstoffen mittels elektrischer Hochfrequenzfelder von einer Wellenlänge unter roo m, insbesondere Ultrakurzwellenfelder, dadurch gekennzeichnet, daß die mit Leim bestrichenen und aneinandergelegten Bretter zwischen derart ausgebildeten, zur Ausbreitung des Hochfrequenzfeldes bestimmten Feldelektroden hindurchgeführt werden, daß die räumliche Ausdehnung der Elektroden in der Durchführungsrichtung wesentlich geringer ist als die der Bretter und @daß ferner die Bretter im wesentlichen lediglich im Hochfrequenzfeld oder zum mindesten indessen Nähe mittels einergeeigneten Druckvorrichtung zusammengepreßt werden.PATENT CLAIM: Method for gluing boards and other objects made of wood and other materials by means of high-frequency electrical fields from a Wavelength below roo m, in particular ultra-short wave fields, characterized in that that the boards coated with glue and placed next to each other between so formed, for the propagation of the high-frequency field certain field electrodes passed through that the spatial extent of the electrodes in the feedthrough direction is much less than that of the boards and @ that, furthermore, the boards are essentially only in the high-frequency field or at least in the vicinity by means of a suitable one Pressure device are compressed.
DES5056D 1939-08-12 1939-10-15 Method for gluing boards made of wood or other materials using high-frequency electrical fields Expired DE885746C (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DES5056D DE885746C (en) 1939-08-12 1939-10-15 Method for gluing boards made of wood or other materials using high-frequency electrical fields
CH222067D CH222067A (en) 1939-08-12 1940-08-02 Device with at least one electrical discharge tube.
FR871825D FR871825A (en) 1939-10-14 1941-04-30 Process for gluing wooden planks or other substances

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US222067XA 1939-08-12 1939-08-12
DE221067X 1939-10-14
DE871825X 1939-10-14
DES5056D DE885746C (en) 1939-08-12 1939-10-15 Method for gluing boards made of wood or other materials using high-frequency electrical fields

Publications (1)

Publication Number Publication Date
DE885746C true DE885746C (en) 1953-08-06

Family

ID=27431444

Family Applications (1)

Application Number Title Priority Date Filing Date
DES5056D Expired DE885746C (en) 1939-08-12 1939-10-15 Method for gluing boards made of wood or other materials using high-frequency electrical fields

Country Status (2)

Country Link
CH (1) CH222067A (en)
DE (1) DE885746C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061535A (en) * 1990-06-28 1991-10-29 Minnesota Mining And Manufacturing Company Patterned silicone release coated article
US5244677A (en) * 1988-12-29 1993-09-14 Minnesota Mining And Manufacturing Company Application system for drug containing microemulsions

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE461496A (en) * 1941-06-16
US2524455A (en) * 1948-02-19 1950-10-03 Cooper Hewitt Electric Co Mount assembly for sun lamps

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244677A (en) * 1988-12-29 1993-09-14 Minnesota Mining And Manufacturing Company Application system for drug containing microemulsions
US5061535A (en) * 1990-06-28 1991-10-29 Minnesota Mining And Manufacturing Company Patterned silicone release coated article

Also Published As

Publication number Publication date
CH222067A (en) 1942-06-30

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