DE8715288U1 - - Google Patents

Info

Publication number
DE8715288U1
DE8715288U1 DE8715288U DE8715288U DE8715288U1 DE 8715288 U1 DE8715288 U1 DE 8715288U1 DE 8715288 U DE8715288 U DE 8715288U DE 8715288 U DE8715288 U DE 8715288U DE 8715288 U1 DE8715288 U1 DE 8715288U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8715288U
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE8715288U1 publication Critical patent/DE8715288U1/de
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
DE8715288U 1986-11-20 1987-11-18 Expired DE8715288U1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/933,403 US4771234A (en) 1986-11-20 1986-11-20 Vacuum actuated test fixture

Publications (1)

Publication Number Publication Date
DE8715288U1 true DE8715288U1 (de) 1988-01-07

Family

ID=25463886

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8715288U Expired DE8715288U1 (de) 1986-11-20 1987-11-18

Country Status (3)

Country Link
US (1) US4771234A (de)
JP (1) JPH0769374B2 (de)
DE (1) DE8715288U1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3841087A1 (de) * 1988-12-07 1990-06-21 Franz Mothes Vacuum - adapter mit balgdichtung, zur kontaktierung von bestueckten platinen in herkoemmlicher und in smd-bauweise
DE102006051947A1 (de) * 2006-11-01 2008-05-08 Evonik Röhm Gmbh Dichtungselement für die Polymerisation von ethylenisch ungesättigten Monomeren nach dem Kammerverfahren

Families Citing this family (52)

* Cited by examiner, † Cited by third party
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US4967147A (en) * 1988-05-26 1990-10-30 Zehntel, Inc. Circuit tester having mechanical fingers and pogo probes for causing electrical contact with test fixture assemblies
GB2237939B (en) * 1989-09-22 1994-03-23 Multiprobe Limited Testing apparatus
US5027063A (en) * 1990-04-24 1991-06-25 John Fluke Mfg. Co., Inc. Vacuum-actuated test fixture for testing electronic components
EP0477821A2 (de) * 1990-09-25 1992-04-01 S.P.E.A. S.r.l. Handhabe-Vorrichtung für elektronische Module für ein automatisches Testgerät
US5153504A (en) * 1991-04-23 1992-10-06 International Business Machines Corporation Pneumatically actuated hold down gate
US6313649B2 (en) 1992-06-11 2001-11-06 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US6380751B2 (en) * 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5744974A (en) * 1993-09-17 1998-04-28 Xilinx, Inc. Test head interface with vacuum-activated interconnection components
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
US5575076A (en) * 1994-07-13 1996-11-19 Methode Electronics, Inc. Circuit board testing fixture with registration plate
US5430385A (en) * 1994-08-15 1995-07-04 H+W Test Products, Inc. Test fixture for printed circuit boards having a dual seal system
US5537051A (en) * 1995-04-24 1996-07-16 Motorola, Inc. Apparatus for testing integrated circuits
US5654631A (en) * 1995-11-15 1997-08-05 Xilinx, Inc. Vacuum lock handler and tester interface for semiconductor devices
US5949238A (en) * 1995-12-20 1999-09-07 Siemens Medical Systems, Inc. Method and apparatus for probing large pin count integrated circuits
US5939892A (en) * 1996-04-12 1999-08-17 Methode Electronics, Inc. Circuit board testing fixture
US5744976A (en) * 1996-05-24 1998-04-28 International Business Machines Corporation Floating guide plate test fixture
US5773988A (en) * 1996-10-29 1998-06-30 Hewlett-Packard Company Standard- and limited-access hybrid test fixture
US5945836A (en) 1996-10-29 1999-08-31 Hewlett-Packard Company Loaded-board, guided-probe test fixture
US6407565B1 (en) 1996-10-29 2002-06-18 Agilent Technologies, Inc. Loaded-board, guided-probe test fixture
US5936415A (en) * 1996-12-20 1999-08-10 Xilinx, Inc. Method and apparatus for a pin-configurable integrated circuit tester board
TW326927U (en) * 1997-01-24 1998-02-11 Acer Peripherals Inc Jig for testing circuit board
AU3979697A (en) * 1997-02-24 1998-09-09 Tti Testron, Inc. Probe plate for a test fixture
US5963027A (en) * 1997-06-06 1999-10-05 Cascade Microtech, Inc. Probe station having environment control chambers with orthogonally flexible lateral wall assembly
US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6005405A (en) * 1997-06-30 1999-12-21 Hewlett Packard Company Probe plate assembly for high-node-count circuit board test fixtures
US6002264A (en) * 1997-08-19 1999-12-14 Hewlett-Packard Company Interconnect adapter to printed circuit assembly for testing in an operational environment
TW455978B (en) * 1998-02-16 2001-09-21 Amic Technology Taiwan Inc Method for testing wafers
EP0996198A1 (de) 1998-10-20 2000-04-26 Sumitomo Wiring Systems, Ltd. Elektrischer Verbinderkasten, Positionierungsverfahren und Prüfvorrichtung dafür
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6828773B2 (en) * 2002-03-21 2004-12-07 Agilent Technologies, Inc. Adapter method and apparatus for interfacing a tester with a device under test
US6784675B2 (en) * 2002-06-25 2004-08-31 Agilent Technologies, Inc. Wireless test fixture adapter for printed circuit assembly tester
WO2004008158A2 (en) 2002-07-17 2004-01-22 Delta Design, Inc. Nestless plunge mechanism for semiconductor testing
US6894479B2 (en) * 2002-08-26 2005-05-17 Agilent Technologies, Inc. Connector cable and method for probing vacuum-sealable electronic nodes of an electrical testing device
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7239126B2 (en) * 2003-06-23 2007-07-03 General Motors Corporation System bench wireless mapping board
US6819099B1 (en) * 2003-08-06 2004-11-16 Intel Corporation Programmable carrier plate for automated circuit board tester
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7339368B2 (en) * 2004-07-21 2008-03-04 Intel Corporation Methods and apparatus for testing circuit boards
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7138811B1 (en) * 2005-07-01 2006-11-21 Xilinx, Inc. Seals used for testing on an integrated circuit tester
US20080106294A1 (en) * 2006-11-02 2008-05-08 Stephen William Smith Apparatus and method for universal connectivity in test applications
US7683648B1 (en) * 2007-06-11 2010-03-23 Nvidia Corporation Integrated circuit socket and method of use for providing adjustable contact pitch
US7492174B2 (en) * 2007-06-18 2009-02-17 James Hall Testing apparatus for surface mounted connectors
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
IT1395561B1 (it) * 2009-09-03 2012-09-28 Applied Materials Inc Apparato di collaudo e relativo procedimento
US8058888B2 (en) * 2009-10-13 2011-11-15 Nanya Technology Corporation Test apparatus for electronic device package and method for testing electronic device package
GB2593515A (en) * 2020-03-26 2021-09-29 Asm Assembly Systems Singapore Pte Ltd Tooling Vacuum unit

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4322682A (en) * 1979-05-21 1982-03-30 Everett/Charles Inc. Vacuum actuated test head having programming plate
US4352061A (en) * 1979-05-24 1982-09-28 Fairchild Camera & Instrument Corp. Universal test fixture employing interchangeable wired personalizers
GB2111307B (en) * 1981-12-07 1985-08-14 Marconi Instruments Ltd Electrical connection arrangements
DE3311977A1 (de) * 1983-03-31 1984-10-04 Siemens AG, 1000 Berlin und 8000 München Anordnung zum elektrischen abtasten einer baugruppe
US4538104A (en) * 1983-04-11 1985-08-27 Test Point 1, Inc. In-circuit test apparatus for printed circuit board
GB2139019A (en) * 1983-04-29 1984-10-31 Gen Electric Co Plc Printed circuit board testers
US4573009A (en) * 1983-12-07 1986-02-25 Zehntel, Inc. Printed circuit board test fixture with flexion means for providing registration between the test probes and the circuit board
US4626776A (en) * 1984-06-07 1986-12-02 O. B. Test Group, Inc. Programmable test fixture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3841087A1 (de) * 1988-12-07 1990-06-21 Franz Mothes Vacuum - adapter mit balgdichtung, zur kontaktierung von bestueckten platinen in herkoemmlicher und in smd-bauweise
DE102006051947A1 (de) * 2006-11-01 2008-05-08 Evonik Röhm Gmbh Dichtungselement für die Polymerisation von ethylenisch ungesättigten Monomeren nach dem Kammerverfahren

Also Published As

Publication number Publication date
US4771234A (en) 1988-09-13
JPS63139262A (ja) 1988-06-11
JPH0769374B2 (ja) 1995-07-31

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