DE824422C - Method of joining metal parts by brazing - Google Patents
Method of joining metal parts by brazingInfo
- Publication number
- DE824422C DE824422C DES4223A DES0004223A DE824422C DE 824422 C DE824422 C DE 824422C DE S4223 A DES4223 A DE S4223A DE S0004223 A DES0004223 A DE S0004223A DE 824422 C DE824422 C DE 824422C
- Authority
- DE
- Germany
- Prior art keywords
- brazing
- adhesive
- metal parts
- parts
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
- H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3607—Silica or silicates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Joining Of Glass To Other Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
Verfahren zum Verbinden von Metallteilen durch Hartlöten 1)ie Erfindung betrifft ein `'erfahren zum stoffschlüssigen \`erbinden von ':Metallteilen, z. B. das Befestigen von Hartmetallschneiden an Werkzeugen, insbesondere durch Hartlöten. Die Vorbereitung für eine serienmäßige Fertigung solcher Teile ist jedoch umständlich und zeitraubend, da die Gefahr besteht, daß das Plättchen beim Einbringen in die Lötvorrichtung, z. B. einen Ofen oder eine Hochfrequenzvorrichtung, oder während der Behandlung in diesen verrutscht oder abfällt. Man hat bisher deshalb in der Regel die Hartmetallplättchen auf (lern Stahlschaft angedrahtet. Es ist nun bereits vorgeschlagen worden, die durch 1-lartlöten o. dgl. zu verbindenden Metallteile vorher durch ein geeignetes Klebemittel miteinander zu verkleben, so> daß ein Verschieben oder Auseinanderfallen mit Sicherheit vermieden wird. Dabei wurde an Klebemittel gedacht, die sich bei der Behandlungstemperatur möglichst restlos verflüchtigen bzw. verbrennen, um keine die Verbindung störenden oder nachteilig beeinflußenden Rückstände entstehen zu lassen. Als Ausführungsbeispiele wurden Harze, insbesondere Kolophonium, vorgeschlagen.Method of joining metal parts by brazing 1) he invention concerns an '' experience of cohesive \ `binding of ': metal parts, e.g. B. attaching hard metal cutting edges to tools, especially by brazing. However, the preparation for series production of such parts is cumbersome and time-consuming, since there is a risk that the platelet when introduced into the Soldering device, e.g. B. a furnace or a high frequency device, or during the treatment slips or falls off in these. So far, therefore, in the Rule the hard metal plate on (learn to wire the steel shaft. It is now already it has been proposed that the metal parts to be connected by 1-soldering or the like to be glued together beforehand with a suitable adhesive, so that> shifting or falling apart is definitely avoided. It was attached to adhesive that evaporate as completely as possible at the treatment temperature or burn in order not to disrupt or adversely affect the connection To leave residues. Resins, in particular Rosin, suggested.
Gemäß der Erfindung wurde nun die Feststellung gemacht, daß sich für die Zwecke der Verklebung von stoffschlüssig, insbesondere durch Hartlöten miteinander zu verbindenden Metallteilen mit Vorzug Flußmittel auf Basis eines gelösten Silicates eignen. Solche Klebemittel haben eine ausreichende Klebekraft, so daß sie nach kurzzeitiger Trocknung eine einwandfreie feste Verklebung der Metallteile ergeben, und sie behindern das Verlöten auch nicht, trotzdem sie bei der Behandlungstemperatur sich weder verfliichtigen #noch verbrennen. Sie werden bei dieser Behandlungstemperatur jedoch so dünnflüssig, daß sie zwischen den zu verbindenden Metallen ausfließen, wobei sie mit eventuellen Oxydhäuten eine Schlacke bilden und damit sogar eine die Lötverbindung fördernde Reinigung der Lötflächen bewirken. Dabei wird gegenüber den vorerwähnten Klebemitteln auf Basis von Harzen noch der nicht zu unterschätzende Vorteil erreicht, daß sich dadurch, daß keine Verbrennung oder Verflüchtigung stattfindet, keine störenden Gase oder Dämpfe bilden.According to the invention, the finding has now been made that for the purposes of gluing cohesively, in particular by brazing together Metal parts to be connected preferably flux based on a dissolved silicate suitable. Such adhesives have sufficient adhesive strength, so that after a short time Drying result in a perfect, solid bond of the metal parts, and they hinder nor soldering, although they do not become necessary at the treatment temperature #still burn. you will be at this treatment temperature, however so thin that they flow out between the metals to be joined, whereby they form a slag with possible oxide skins and thus even form a solder joint bring about beneficial cleaning of the soldering surfaces. This is compared to the aforementioned Resin-based adhesives still achieve the advantage that should not be underestimated, that, because there is no combustion or volatilization, there are no disturbing Form gases or vapors.
Für die Zwecke der Erfindung hat sich beispielsweise eine 35 o/oige Natron-Wasserglas-Lösung bewährt. Mit einer solchen Lösung wird die Lötstelle bestrichen, die Teile aufeinandergelegt und angedrückt. Nach kurzer Trocknung an der Luft sind dann die Teile so fest miteinander verklebt, daß die Lötung vorgenommen werden kann.For the purposes of the invention, for example, a 35% Soda water glass solution has been tried and tested. The solder joint is coated with such a solution, the parts placed on top of each other and pressed on. After a short drying time in the air then the parts are glued together so tightly that the soldering can be carried out.
Dem gelösten Silicat können gegebenenfalls geeignete andere die Verklebung oder die Hartlötung fördernde Stoffe zugesetzt werden. Weiter kann es vorteilhaft sein, das Klebemittel mit dem fein verteilten Lötmetall zu vermischen. Beispielsweise können .Io Gewichtsteile von 35 o/oigem Natron-Wasserglas, 6o Gewichtsteile reduzierten Kupferpulvers beigemischt werden. Eine solche Klebepaste bewährt sich gut bei Lötungen mit hoher Temperatur, z. B. bei dem Auflöten von Schnellstählen, wobei wegen der gleichzeitig erfolgenden Stahlhärtung mit Temperaturen von etwa 120o° gearbeitet wird. In anderen Fällen ist es vorteilhafter, mit niedrigeren Temperaturen zu arbeiten. So wird beispielsweise bei dem Auflöten von Hartmetallplättchen mittels Hochfrequenz das Hartmetall heißer als der Stahl, so daß man, um Schädigungen des Hartmetalls zu vermeiden, bestrebt ist, mit möglichst niedriger Temperatur auszukommen. In diesem Fall wird zweckmäßig die Klebepaste ohne Beimengungen von Lötmetallpulver verwendet und das Lötmetall in an sich bekannter Weise in Form eines dünnen Kupfer-oder Messingbleches zwischen Stahl und Hartmetall eingelegt. Man hat dadurch die Sicherheit, daß sich auch bei niedrigerer Temperatur ein zusammenhängender Film von flüssigem Kupfer bildet.Other suitable adhesives can optionally be used with the dissolved silicate or substances promoting brazing are added. It can also be beneficial be able to mix the adhesive with the finely divided solder. For example can reduce .Io parts by weight of 35% soda water glass, 60 parts by weight Copper powder can be added. Such an adhesive paste works well for soldering at high temperature, e.g. B. in the soldering of high-speed steels, because of the simultaneous steel hardening with temperatures of about 120o ° worked will. In other cases it is more advantageous to work with lower temperatures. For example, when soldering hard metal plates using high frequency the cemented carbide hotter than the steel, so that one in order to avoid damage to the cemented carbide to avoid, endeavors to get by with the lowest possible temperature. In this In this case, the adhesive paste is expediently used without the addition of solder powder and the solder in a manner known per se in the form of a thin copper or brass sheet inserted between steel and hard metal. You have the security that a coherent film of liquid copper even at lower temperatures forms.
Bei der Lötung unbearbeiteter Oberflächen, wenn z. B. die Hartmetallplättchen nicht angeschliffen werden, sondern der Einfachheit halber so aufgelötet werden, wie sie aus der Fabrikation kommen, ist es von Vorteil, dem Klebemittel ein Netzmittel, z. B. ein im Handel erhältliches Natriumsalz einer alkyllierten Naphthalin-Sulfo-Säure zuzusetzen.When soldering unprocessed surfaces, if z. B. the hard metal plate not be sanded, but rather soldered on for the sake of simplicity, as they come from production, it is advantageous to add a wetting agent to the adhesive, z. B. a commercially available sodium salt of an alkylated naphthalene sulfo acid to add.
Claims (3)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES4223A DE824422C (en) | 1950-05-24 | 1950-05-24 | Method of joining metal parts by brazing |
GB74651A GB705271A (en) | 1950-05-24 | 1951-01-10 | Improvements in or relating to the manufacture of magnetic elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES4223A DE824422C (en) | 1950-05-24 | 1950-05-24 | Method of joining metal parts by brazing |
Publications (1)
Publication Number | Publication Date |
---|---|
DE824422C true DE824422C (en) | 1951-12-10 |
Family
ID=7470543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DES4223A Expired DE824422C (en) | 1950-05-24 | 1950-05-24 | Method of joining metal parts by brazing |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE824422C (en) |
GB (1) | GB705271A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1116138B (en) * | 1959-01-30 | 1961-10-26 | Wieland Fa Dr Th | Paste for defining parts to be soldered |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4808326A (en) * | 1985-06-10 | 1989-02-28 | Takeuchi Press Industries Co., Ltd. | Resin-bonded magnetic composition and process for producing magnetic molding therefrom |
-
1950
- 1950-05-24 DE DES4223A patent/DE824422C/en not_active Expired
-
1951
- 1951-01-10 GB GB74651A patent/GB705271A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1116138B (en) * | 1959-01-30 | 1961-10-26 | Wieland Fa Dr Th | Paste for defining parts to be soldered |
Also Published As
Publication number | Publication date |
---|---|
GB705271A (en) | 1954-03-10 |
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