DE8226406U1 - Solid state circuit - Google Patents
Solid state circuitInfo
- Publication number
- DE8226406U1 DE8226406U1 DE8226406U DE8226406DU DE8226406U1 DE 8226406 U1 DE8226406 U1 DE 8226406U1 DE 8226406 U DE8226406 U DE 8226406U DE 8226406D U DE8226406D U DE 8226406DU DE 8226406 U1 DE8226406 U1 DE 8226406U1
- Authority
- DE
- Germany
- Prior art keywords
- solid
- state circuit
- circuit according
- additional part
- solid state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007787 solid Substances 0.000 title description 2
- 239000003990 capacitor Substances 0.000 claims description 11
- 230000001070 adhesive Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- NIJJYAXOARWZEE-UHFFFAOYSA-N Depacane Chemical compound CCCC(C(O)=O)CCC NIJJYAXOARWZEE-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
· S· S
SIEMENS AKTIENGESELLSCHAFT Unser Zeichen Berlin und München VPA 82 G 2 9 3 8 DESIEMENS AKTIENGESELLSCHAFT Our mark Berlin and Munich VPA 82 G 2 9 3 8 DE
FestkörperschaltungSolid state circuit
Die Neuerung bezieht sich auf eine Festkörperschaltung mit einer Vielzahl von aktiven und/oder passiven Bauteilen, die sich auf oder in einem gemeinsamen Körper befinden und mit diesem untrennbar verbunden sind, und der Körper eine Vielzahl von in eir.v«m vorgegebenen Rasterüiaß angeordnete Anschlußstifte aufweist. The innovation relates to a solid-state circuit with a large number of active and / or passive components that are on or in a common Bodies are located and are inextricably linked with it, and the body has a multitude of given in eir.v «m Has Rastüiaß arranged terminal pins.
Die Familie der Festkörperschaltungen, auch integrierte Schaltungen genannt, ist heute groß. Integrierte Schaltungen können in Schichttechnik durch Aufdampfen sehr dünner oder durch Aufdrucken dickerer Schichten hergestellt werden. Bei integrierten Halbleiterschaltungen, die auch Monolithe genannt werden, sind alle aktiven und passiven Bauelemente in einem Kristall vereinigt. Dies wird durch Anwendung der sogenannten Planartechnik und Epitaxie erzielt. Erwähnenswert ist noch, daß bei den in Schichttechnik hergestellten integrierten Schaltungen ein Unterschied gemacht wird zwischen Dickschicht- und Dünnschichtschaltungen (Siemens-Fachbuch "Elektronische Schaltkreis systeme", Ausgabe 1971, Seiten 305 bis 318).The family of solid-state circuits, also known as integrated circuits, is large today. Integrated Circuits can be made in layer technology by vapor deposition very thin layers or by printing thick layers getting produced. In the case of integrated semiconductor circuits, which are also called monoliths, all active and passive components combined in one crystal. This is done by applying the so-called Planar technology and epitaxy achieved. It is also worth mentioning that the integrated Circuits a distinction is made between thick-film and thin-film circuits (Siemens-Fachbuch "Electronic circuit systems", 1971 edition, pages 305 to 318).
In der Regel wird eine Vielzahl meist verschiedener Festkörperschaltungen auf einer Plrtine vereinigt und durch eine spezielle gedruckte Schaltung entsprechend einem vorgegebenen Stromlaufplan verbunden. Zur Vermeidung von kurzzeitigen Spannungseinbrüchen in der Stromversorgung und den daraus resultierendenAs a rule, a large number of mostly different solid-state circuits are combined on one board and connected by a special printed circuit according to a given circuit diagram. To avoid of short-term voltage drops in the power supply and the resulting
HSH-6-Jas / 15.9.82HSH-6-Jas / 9/15/82
- 2 - VPA 82 G 2 3 3 8 DE- 2 - VPA 82 G 2 3 3 8 DE
unerwünschten Beeinflussungen der Festkörperschaltungen untereinander werden unmittelbar neben der einen oder anderen Festkörperschaltung sogenannte Pufferkondensatoren angeordnet, um die Stromversorgung an Ort und Stelle möglichst gut zu stabilisieren. Bisher werden für diese Aufgaben diskrete Kondensatoren eingesetzt, deren Anschlüsse allerdings individuell gekürzt und gebogen werden müssen. Damit ist Jedoch eine automatische Bestückung von Leiterplatten nicht möglieh. undesirable effects on the solid-state circuits so-called buffer capacitors are placed directly next to each other next to one or the other solid-state circuit arranged in order to stabilize the power supply on the spot as well as possible. Until now discrete capacitors are used for these tasks, but their connections are shortened individually and need to be bent. However, this does not allow the automatic assembly of printed circuit boards.
Der Neuerung liegt die Aufgabe zugrunde, Bauteile mit einer Möglichkeit der Spannungsstabilisierung zu schaffen, die mit ihren Anschlußstiften ein vorgegebenes Rastermaß einhalten und eine automatische Bestückung der Leiterplatten gestatten.The innovation is based on the task of adding components with a possibility of voltage stabilization create that adhere to a predetermined grid size with their connection pins and an automatic assembly of the printed circuit boards.
Ausgehend von der o.g. Festkörperschaltung wird die Aufgabe gemäß der Neuerung dadurch gelöst, daß der Körper um einen zusätzlichen Teil mit einem gesonder- ♦ ten Kondensator und diesem zugeordnete Anschlußstifte erweitert ist. Vorteilhaft ist hierbei, daß kein besonderer Arbeitsgang für das Einsetzen der Pufferkondensatoren erforderlich ist. Bei diesem neuen Bauteil wird der Pufferkondensator bei der Fertigung der Festkörperschaltung gehäusemäßig mit integriert. In vorteilhafter Weise kann zwischen dem Körper und dem zusätzlichen Teil mit dem Kondensator eine Sollbruchstelle vorgesehen werden. Der Kondensator ist dabei mit den Stromversorgungsanschlüssen der integrierten Schaltung nicht verbunden. Aufgrund der Sollbruchstelle ist es möglich, bedarfsweise von Fall zu Fall eine Trennung des Kondensatorteiles von dem die integrierteBased on the above-mentioned solid-state circuit, the object is achieved according to the innovation in that the Body around an additional part with a separate capacitor and connecting pins assigned to it is expanded. The advantage here is that there is no special operation for inserting the buffer capacitors is required. In this new component, the buffer capacitor is used in the manufacture of the Solid-state circuit integrated in the housing. Advantageously, between the body and the Additional part with the capacitor a predetermined breaking point can be provided. The capacitor is included not connected to the power supply terminals of the integrated circuit. Because of the predetermined breaking point it is possible, if necessary, from case to case to separate the condenser part from the integrated one
-3- VPA 82 G 2 9 3 δ DE-3- VPA 82 G 2 9 3 δ DE
Schaltung enthaltenden Körper vorzunehmen. Es ist in vorteilhafter Weise auch möglich, daß der zusätzliche Teil mit dem Kondensator als gesonderter Teil vorhanden und mit dem Körper durch eine Klebeverbindung vereinigt ist.Make circuit containing body. It is also possible in an advantageous manner that the additional Part with the capacitor as a separate part and with the body by an adhesive connection is united.
Ein Ausführungsbeispiel der Neuerung 1st in der Zeichnung in zwei Ansichten dargestellt und wird nachfolgend kurz erläutert.An exemplary embodiment of the innovation is shown in the drawing in two views and is described below briefly explained.
Die Zeichnung zeigt in Seiten- und Draufsicht eine Festkörperschaltung, beispielsweise ein Dual-Inline-Plastikgehäuse 1 mit einer Marke 2 zur Kennzeichnung einer vorgesehenen Einbaulage. Das Dual-Inline-Plastikgehäuse 1 trägt auf beiden Breitseiten eine Vielzahl von Kontaktstiften 10 und es ist um einen zusätzlichen Teil 3 erweitert. Dieser beinhaltet einen Kondensator3\ der mit zugeordneten Anschlußstiften 33 und 34 verbunden ist. Zwischen dem zusätzlichen Teil 3 und dem benachbarten Plastikkörper ist eine Sollbruchstelle 4 vorgesehen. Sie hat den Zweck, daß der zusätzliche Teil 3 mit dem Kondensator 31 bedarfsweise vom übrigen Bauteil abgetrennt werden kann.The drawing shows, in side and top view, a solid-state circuit, for example a dual-inline plastic housing 1 with a mark 2 for identifying an intended installation position. The dual-inline plastic housing 1 carries a large number of contact pins 10 on both broad sides and it is expanded by an additional part 3. This contains a capacitor 3 \ which is connected to associated connection pins 33 and 34. A predetermined breaking point 4 is provided between the additional part 3 and the adjacent plastic body. Its purpose is that the additional part 3 with the capacitor 31 can be separated from the rest of the component if necessary.
Die Neuerung kann in vorteilhafter Weise auch bei anderen Gehäusewerkstoffen angewandt werden.The innovation can advantageously also be used with other housing materials.
4 Schutzansprüche
1 Figur4 claims for protection
1 figure
Claims (4)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE8226406U1 true DE8226406U1 (en) | 1982-12-30 |
Family
ID=1330796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8226406U Expired DE8226406U1 (en) | Solid state circuit |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE8226406U1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3424876A1 (en) * | 1984-07-06 | 1986-02-06 | Telefunken Fernseh Und Rundfunk Gmbh, 3000 Hannover | Integrated circuit |
-
0
- DE DE8226406U patent/DE8226406U1/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3424876A1 (en) * | 1984-07-06 | 1986-02-06 | Telefunken Fernseh Und Rundfunk Gmbh, 3000 Hannover | Integrated circuit |
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