DE3424876A1 - Integrated circuit - Google Patents

Integrated circuit

Info

Publication number
DE3424876A1
DE3424876A1 DE19843424876 DE3424876A DE3424876A1 DE 3424876 A1 DE3424876 A1 DE 3424876A1 DE 19843424876 DE19843424876 DE 19843424876 DE 3424876 A DE3424876 A DE 3424876A DE 3424876 A1 DE3424876 A1 DE 3424876A1
Authority
DE
Germany
Prior art keywords
capacitor
chip
circuit according
circuit
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19843424876
Other languages
German (de)
Inventor
Monika 3262 Auetal Ribbe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deutsche Thomson oHG
Original Assignee
Telefunken Fernseh und Rundfunk GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Fernseh und Rundfunk GmbH filed Critical Telefunken Fernseh und Rundfunk GmbH
Priority to DE19843424876 priority Critical patent/DE3424876A1/en
Publication of DE3424876A1 publication Critical patent/DE3424876A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The invention relates to an integrated circuit (IC). According to the invention, a filter capacitor which is connected to two potentials of an operating voltage of the integrated circuit (IC) is incorporated in the housing of the integrated circuit (IC). <IMAGE>

Description

H 84/5 -H 84/5 -

Integrierter SchaltkreisIntegrated circuit

Die Erfindung betrifft einen integrierten Schaltkreis nach der im Oberbegriff des Anspruchs 1 angegebenen Art.The invention relates to an integrated circuit according to the type specified in the preamble of claim 1.

Es sind Platinen bekannt, bei denen neben integrierten Schaltkreisen, im folgenden IC genannt, ein Sieb- oder Glättungskondensator angeordnet ist. Die Siebkondensatoren wirken für eventuelle kurzzeitige hochfrequente Störungen als Kurzschluß und schützen daher den IC vor Betriebsstörungen oder vor Zerstörungen. Die Glättungskondensatoren schützen die ICs vor niederfrequenten Störungen. Werden, insbesondere auf Speicherplatinen, logische Operationen ausgeführt, so wirken sich diese als Störung für die Platine aus. Solche Störungen können durch die obengenannten Kondensatpren verhindert werden. Diese Kondensatoren beanspruchen aber Platz, wenn sie zwischen den ICs angeordnet sind. Es ist bekannt, die Kondensatoren platzsparend in Fassungen unterzubringen» in die die ICs eingesetzt werden. ■' Bei vielen Platinen werden aber ICs ohne Fassungen verwendet. sThere are known circuit boards in which, in addition to integrated circuits, hereinafter referred to as IC, a filter or smoothing capacitor is arranged. The filter capacitors work for any short-term high-frequency interference as a short circuit and therefore protect the IC from operational malfunctions or from destruction. The smoothing capacitors protect the ICs from low-frequency interference. Are, especially on memory boards, If logical operations are carried out, these have a disruptive effect on the board. Such disturbances can be caused by the above-mentioned condensation can be prevented. However, these capacitors take up space when they are between the ICs are arranged. It is known to accommodate the capacitors in a space-saving manner in sockets in which the ICs are inserted. ■ ' However, ICs without sockets are used on many boards. s

Der Erfindung liegt die Aufgabe zugrunde, Kondensatoren, die neben ICs auf Platinen angeordnet sind, platzsparend unterzubringen. The invention is based on the object of accommodating capacitors, which are arranged next to ICs on circuit boards, in a space-saving manner.

Diese Aufgabe wird durch die im Anspruch 1 angegebene Erfindung gelöst. Vorteilhafte Weiterbildungen der Erfindung sind in den UnteranSprüchen genannt. Durch die Erfindung wird erreicht, daß die Fläche der Platinen verkleinert werden kann.This object is achieved by the invention specified in claim 1. Advantageous developments of the invention are in the Called subordinate claims. The invention achieves that the area of the boards can be reduced.

Vorteilhaft ist die vereinfachte Herstellung von Platinen, da Leiterbahnen bzw. Durchkontaktierungen bei doppelt beschichteten Platinen für die Versorgung der Kondensatoren eingespart werden können. Diese Leiterbahnen sind insofern ein Problem, da die Versorgung der ICs in den meisten Fällen diagonal angeordnet ist, so daß eine direkte Verbindung zwischen Betriebsund Bezugsspannung über den Kondensator eine Querverbindung darstellt, die die Datenbusse, Adreßbusse oder Steuerleitungen, dieThe simplified production of circuit boards is advantageous, since conductor tracks or vias are used in the case of double-coated ones Boards for the supply of the capacitors can be saved. These conductor tracks are a problem insofar as since the supply of the ICs is arranged diagonally in most cases, so that a direct connection between operating and The reference voltage across the capacitor represents a cross connection, which the data buses, address buses or control lines which

• M • M

EPOCOPY JpEPOCOPY Jp

die einzelnen ICs untereinander verbinden, unterbrechen können. Das bedeutet Umlegung der Leiterbahnen von der Löt- auf die Bestückungsseite oder umgekehrt. Damit wird ein Herstellungsauf wand betrieben, der nach Einführung der genannten Erfindung nicht mehr nötig ist.connect and interrupt the individual ICs. This means moving the conductor tracks from the soldering side to the component side or vice versa. So that a manufacturing expense is operated after the introduction of the invention mentioned is no longer necessary.

Zum besseren Verständnis der Erfindung wird nachstehend ein Ausführungsbeispiel anhand einer Zeichnung näher erläutert. Die Zeichnung zeigt einen IC mit einem Gehäuse 17« nit Anschlußbeinen · 1-14, mit einem die Schaltung enthaltenden Chip l6 und mit einem Kondensator 15. Der Kondensator 15 ist neben dem Chip l6 angeordnet. Die Anschlußbeine 7 und lk, die zur Verseifung des Chips mit einer Betriebsspannung dienen, sind mit den Anschlüssen des Kondensators verbunden.For a better understanding of the invention, an exemplary embodiment is explained in more detail below with reference to a drawing. The drawing shows an IC with a housing 17 'with connecting legs 1-14, with a chip 16 containing the circuit and with a capacitor 15. The capacitor 15 is arranged next to the chip 16. The connecting legs 7 and lk, which are used to saponify the chip with an operating voltage, are connected to the terminals of the capacitor.

Claims (9)

TELEFUNKEN Fernseh und Rundfunk GmbH Göttinger Chaussee 76TELEFUNKEN Fernseh und Rundfunk GmbH Goettinger Chaussee 76 3000 Hannover 913000 Hanover 91 Hannover,den 28.06.1984 E/PTL-Nb/vß H 84/5Hanover, June 28, 1984 E / PTL-Nb / vß H 84/5 PatentansprücheClaims ill Integrierter Schaltkreis mit einem Gehäuse (17)? Anschlußbeinen (l-l4) und einem die Schaltung enthaltenden Chip (l6), dadurch gekennzeichnet, daß in dem Gehäuse (17) außerhalb des Chip (l6) ein mit der Schaltung verbundener Kondensator (15) untergebracht ist. ill Integrated circuit with a housing (17)? Connection legs (l-l4) and a chip (l6) containing the circuit, characterized in that a capacitor (15) connected to the circuit is accommodated in the housing (17) outside the chip (l6). 2. Schaltkreis nach Anspruch 1, dadurch gekennzeichnet, daß der Kondensator (15) ein Siebkondensator für eine Betriebsspannung des Schaltkreises ist. ,/r ./2. Circuit according to claim 1, characterized in that the capacitor (15) is a filter capacitor for an operating voltage of the circuit. , / r ./ 3. Schaltkreis nach Anspruch 1, dadurch gekennzeichnet, daß die Anschlüsse des Kondensators (15) mit zwei Anschlußbeinen (7, Ik) verbunden sind.3. Circuit according to claim 1, characterized in that the connections of the capacitor (15) are connected to two connecting legs (7, Ik) . k. Schaltkreis nach Anspruch 1, dadurch gekennzeichnet, daß die Anschlüsse des Kondensators (15) mit zwei Anschlüssen des Chip (l6) verbunden sind. k. Circuit according to Claim 1, characterized in that the connections of the capacitor (15) are connected to two connections of the chip (16). 5. Schaltkreis nach Anspruch 1, dadurch gekennzeichnet, daß der Kondensator (15) zusammen mit dem Chip (l6) in ein Verguß-5. Circuit according to claim 1, characterized in that the capacitor (15) together with the chip (l6) in a potting EPOCOPY JPEPOCOPY JP \ . ~ 2 ~ H 84/5 \ . ~ 2 ~ H 84/5 material eingegossen ist.material is poured in. 6. Schaltkreis nach Anspruch 1, dadurch gekennzeichnet, daß der Kondensator (15) über oder unter dem Chip (l6) angeordnet ist.6. Circuit according to claim 1, characterized in that the capacitor (15) is arranged above or below the chip (l6). 7. Schaltkreis nach Anspruch 1, dadurch gekennzeichnet, daß der Kondensator (15) neben dim Chip (l6) angeordnet ist.7. Circuit according to claim 1, characterized in that the capacitor (15) is arranged next to the dim chip (l6). 8. Schaltkreis nach Anspruch 1, dadurch gekennzeichnet, daß der Chip (l6) auf den Kondensator (15) aufgedampft ist.8. Circuit according to claim 1, characterized in that the chip (l6) is vapor-deposited on the capacitor (15). 9. Schaltkreis nach Anspruch 1, dadurch gekennzeichnet, daß der Kondensator (15) direkt auf den Chip (l6) aufgedampft ist.9. Circuit according to claim 1, characterized in that the capacitor (15) is vapor-deposited directly onto the chip (l6).
DE19843424876 1984-07-06 1984-07-06 Integrated circuit Withdrawn DE3424876A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843424876 DE3424876A1 (en) 1984-07-06 1984-07-06 Integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843424876 DE3424876A1 (en) 1984-07-06 1984-07-06 Integrated circuit

Publications (1)

Publication Number Publication Date
DE3424876A1 true DE3424876A1 (en) 1986-02-06

Family

ID=6239966

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843424876 Withdrawn DE3424876A1 (en) 1984-07-06 1984-07-06 Integrated circuit

Country Status (1)

Country Link
DE (1) DE3424876A1 (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2514123A1 (en) * 1974-04-19 1975-10-30 Ibm ARRANGEMENT FOR A SEAL PACKING OF SEMICONDUCTIVE SUBSTRATES
DE2312254B2 (en) * 1972-03-15 1980-05-22 Motorola, Inc., Schaumburg, Ill. (V.St.A.) Contact strips for semiconductor components and process for their manufacture
WO1982003947A1 (en) * 1981-05-06 1982-11-11 Western Electric Co A package for a semiconductor chip having a capacitor as an integral part thereof
DE8226406U1 (en) * 1982-12-30 Siemens AG, 1000 Berlin und 8000 München Solid state circuit
DE3234668A1 (en) * 1982-01-15 1983-07-21 AVX Corp.,(n.d.Ges.d.Staates Delaware), 11022 Great Neck, N.Y. IC COMPONENT WITH OWN DAMPING FOR A VARIETY OF CABLES
DE3207652A1 (en) * 1982-03-03 1983-09-15 Siemens AG, 1000 Berlin und 8000 München Electronic component comprising an integrated circuit and back-up capacitor contained in the housing, and method of producing such a component
DE3214991A1 (en) * 1982-04-22 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Semiconductor chip with discrete capacitor
DE8327377U1 (en) * 1983-09-23 1984-01-26 Metz Apparatewerke Inh. Paul Metz, 8510 Fürth Integrated building block
DE3323472A1 (en) * 1982-07-30 1984-02-09 Rogers Corp., 06263 Rogers, Conn. DECOUPLING ARRANGEMENT FOR AN INTEGRATED CIRCUIT ARRANGED ON A PCB
DE8329993U1 (en) * 1983-10-18 1984-02-23 Metz Apparatewerke Inh. Paul Metz, 8510 Fürth Integrated building block

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8226406U1 (en) * 1982-12-30 Siemens AG, 1000 Berlin und 8000 München Solid state circuit
DE2312254B2 (en) * 1972-03-15 1980-05-22 Motorola, Inc., Schaumburg, Ill. (V.St.A.) Contact strips for semiconductor components and process for their manufacture
DE2514123A1 (en) * 1974-04-19 1975-10-30 Ibm ARRANGEMENT FOR A SEAL PACKING OF SEMICONDUCTIVE SUBSTRATES
WO1982003947A1 (en) * 1981-05-06 1982-11-11 Western Electric Co A package for a semiconductor chip having a capacitor as an integral part thereof
DE3234668A1 (en) * 1982-01-15 1983-07-21 AVX Corp.,(n.d.Ges.d.Staates Delaware), 11022 Great Neck, N.Y. IC COMPONENT WITH OWN DAMPING FOR A VARIETY OF CABLES
DE3207652A1 (en) * 1982-03-03 1983-09-15 Siemens AG, 1000 Berlin und 8000 München Electronic component comprising an integrated circuit and back-up capacitor contained in the housing, and method of producing such a component
DE3214991A1 (en) * 1982-04-22 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Semiconductor chip with discrete capacitor
DE3323472A1 (en) * 1982-07-30 1984-02-09 Rogers Corp., 06263 Rogers, Conn. DECOUPLING ARRANGEMENT FOR AN INTEGRATED CIRCUIT ARRANGED ON A PCB
DE8327377U1 (en) * 1983-09-23 1984-01-26 Metz Apparatewerke Inh. Paul Metz, 8510 Fürth Integrated building block
DE8329993U1 (en) * 1983-10-18 1984-02-23 Metz Apparatewerke Inh. Paul Metz, 8510 Fürth Integrated building block

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DE-Buch: Karl Reiß, Helmut Liedl, Walter Spichall:Intergrierte Digitalbausteine, kleines Praktikum, 2. Aufl., Siemens AG, 1970, S. 216-218 *
DE-Z: Elektronik, Nr.10, 14. Mai 1980 *
GB-Buch: G.B.Clayton, Newnes-Butterworths:Operati-onal Amplifiers,London 1979, S.43-45 *
JP-Z: Patent Abstracts of Japan, E-235, Vol.8, No.84, 18. April 1984 *

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