DE759340C - Tin-free solder - Google Patents

Tin-free solder

Info

Publication number
DE759340C
DE759340C DES139464D DES0139464D DE759340C DE 759340 C DE759340 C DE 759340C DE S139464 D DES139464 D DE S139464D DE S0139464 D DES0139464 D DE S0139464D DE 759340 C DE759340 C DE 759340C
Authority
DE
Germany
Prior art keywords
tin
free solder
soldering
solder
alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DES139464D
Other languages
German (de)
Inventor
Reinhold Reichmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens AG
Original Assignee
Siemens and Halske AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens AG filed Critical Siemens and Halske AG
Priority to DES139464D priority Critical patent/DE759340C/en
Application granted granted Critical
Publication of DE759340C publication Critical patent/DE759340C/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

Zinnfreies Lot Es sind Lote bekannt, bei denen der Gehalt an Zinn, Wismut und Antimon gering ist, jedoch ist bei solchen: Loben die Bindungsfähigkeit an die Unterlagen vom Gehalt an Zinn: abhängig.Tin-free solder There are known solders in which the content of tin, Bismuth and antimony are low, but with such: Praise the ability to bind on the documents on the content of tin: dependent.

Die Erfindung sieht eine Lotzusammentsetzung gänzlich ohne Zinne vor und ergibt überraschenderweise eine vorzügliche Haftung auf allen bekannten: lötbaren Metallen. Das Lot setzt sich zusammen aus mindestens 80% Pb, mindestens zo% Cd, Rest Zn. Es hat sich hierbei gezeigt, da;ß die guten Eigenschaften des Lobes von dem Verhältnis von Cd und Zn abhängen. Es soll dieses Verhältnis. erfindungsgemäß 2o: z nicht übersteigen und 5 : r nicht unterschreiben. Dieses Lot hast den Vorteil, kein Zinn, Wismut oder Antimon zu enthalten. Die niedrigste Löttemperatur von, etwa 240°"C erzielt man mit einer Legierung der Zusammensetzung 82% Pb, 17% Cd'., 10/9 Zn. Soll am: Cd gespart werden, kann; das vorhandene Lot mit mehr Pb versetzt werden, so daß der Pb-Gehalt bis auf fast 9o % ansteigen kann. Für solche Legierungen liegen die Löttemperaturen entsprechend höher. Die F1ießbarkeit und Haftfestigkeit wird hierbei nicht verändlert. Es ist nur eine höhere Erwärmung des zu lötenden Gegenstands erforderlich.The invention provides a solder composition entirely without pinnacles and surprisingly results in excellent adhesion on all known: solderable Metals. The solder is composed of at least 80% Pb, at least zo% Cd, Remainder Zn. It has been shown here that the good properties of praise of depend on the ratio of Cd and Zn. It's supposed to be this ratio. according to the invention Do not exceed 2o: z and do not sign 5: r. This plumb bob has the advantage Containing no tin, bismuth or antimony. The lowest soldering temperature of, about 240 ° "C is achieved with an alloy with the composition 82% Pb, 17% Cd '., 10/9 Zn. Should be saved on: Cd, can; the existing solder is mixed with more Pb, so that the Pb content can rise to almost 90%. For such alloys lie the soldering temperatures are correspondingly higher. The flowability and adhesive strength will not changed here. It's just a higher heating of the object to be soldered necessary.

Bei normalen Metallen kann die Kolbenlötung mit Lötwasser oder Lötfett durchgeführt werden. Bei AI-Legierungen, z. B. einer Al-Zn-Legierung, erfolgt das Löten unter Zuhilfenahme von Laugen (Kali- oder Natronlauge).In the case of normal metals, the iron can be soldered with soldering water or soldering grease be performed. In the case of Al alloys, e.g. B. an Al-Zn alloy, this is done Soldering with the help of alkalis (potash or caustic soda).

Es ist zwar an sich bekannt, daß Pb-CdrZn-Legierungen als Lotmetalle geeignet sind. Die bekannten Legierungen mit go bis 9#4% Pb, io bis 6% Cd und zusätzlich o,5 bis io % Zn haben jedoch Löttemperaturen von 26o bis 300°C. Demgegenüber wird es erfindiungsgemäß erstmalig ermöglicht, durch Erhöhung des Cd-Gehaltes auf mindestens io% eine Erniedrigung der Löttemperatur auf beispielsweise nur 2400C zu erzielen.It is known per se that Pb-CdrZn alloys are used as solder metals are suitable. The known alloys with go up to 9 # 4% Pb, io up to 6% Cd and additionally However, 0.5 to 10% Zn have soldering temperatures of 26o to 300 ° C. In contrast, will it made possible according to the invention for the first time by increasing the Cd content to at least 10% to achieve a lowering of the soldering temperature to, for example, only 2400C.

Claims (1)

PATENTANSPRUCH: Zinnfreies Lot., bestehend aus mindestens 8o0/9 Pb, mindestens io% Cd, Rest Zn, mit der Maßgabe, daß das Verhältnis von Cd zu Zn in den Grenzzen zwischen 2o: i und 5 : i liegt. Zur Abgrenzung des Erfindungsgegenstands vom Stand der Technik ist im Erteilungsverfahren folgende Druckschrift in Betracht gezogen worden: USA.-Patentschrift Nr. 1 333 6i9.PATENT CLAIM: Tin-free solder, consisting of at least 80/9 Pb, at least 10% Cd, remainder Zn, with the proviso that the ratio of Cd to Zn is between 2o: i and 5: i. In order to distinguish the subject invention from the prior art the following document is considered in the issuance process: USA. Patent No. 1 333 6i9..
DES139464D 1939-12-07 1939-12-07 Tin-free solder Expired DE759340C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DES139464D DE759340C (en) 1939-12-07 1939-12-07 Tin-free solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES139464D DE759340C (en) 1939-12-07 1939-12-07 Tin-free solder

Publications (1)

Publication Number Publication Date
DE759340C true DE759340C (en) 1954-01-25

Family

ID=7541105

Family Applications (1)

Application Number Title Priority Date Filing Date
DES139464D Expired DE759340C (en) 1939-12-07 1939-12-07 Tin-free solder

Country Status (1)

Country Link
DE (1) DE759340C (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1333619A (en) * 1918-07-22 1920-03-16 Westinghouse Electric & Mfg Co Solder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1333619A (en) * 1918-07-22 1920-03-16 Westinghouse Electric & Mfg Co Solder

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