DE69938511D1 - Mikro-relais - Google Patents
Mikro-relaisInfo
- Publication number
- DE69938511D1 DE69938511D1 DE69938511T DE69938511T DE69938511D1 DE 69938511 D1 DE69938511 D1 DE 69938511D1 DE 69938511 T DE69938511 T DE 69938511T DE 69938511 T DE69938511 T DE 69938511T DE 69938511 D1 DE69938511 D1 DE 69938511D1
- Authority
- DE
- Germany
- Prior art keywords
- support member
- contact
- relay
- upper portion
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0065—Mechanical properties
- B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0161—Controlling physical properties of the material
- B81C2201/0163—Controlling internal stress of deposited layers
- B81C2201/0167—Controlling internal stress of deposited layers by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
- Saccharide Compounds (AREA)
- Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG1999/000005 WO2000046852A1 (en) | 1999-02-04 | 1999-02-04 | Micro-relay |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69938511D1 true DE69938511D1 (de) | 2008-05-21 |
DE69938511T2 DE69938511T2 (de) | 2009-05-07 |
Family
ID=20430181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69938511T Expired - Fee Related DE69938511T2 (de) | 1999-02-04 | 1999-02-04 | Mikro-relais |
Country Status (10)
Country | Link |
---|---|
US (1) | US6765300B1 (de) |
EP (1) | EP1166352B1 (de) |
JP (1) | JP2002537630A (de) |
KR (1) | KR100540245B1 (de) |
CN (1) | CN1173398C (de) |
AT (1) | ATE392010T1 (de) |
CA (1) | CA2361756A1 (de) |
DE (1) | DE69938511T2 (de) |
TW (1) | TW420814B (de) |
WO (1) | WO2000046852A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7244367B2 (en) * | 2001-12-11 | 2007-07-17 | Jds Uniphase Corporation | Metal alloy elements in micromachined devices |
SG101537A1 (en) * | 2002-06-03 | 2004-01-30 | Sensfab Pte Ltd | Method of forming atomic force microscope tips |
JP2004055410A (ja) * | 2002-07-22 | 2004-02-19 | Advantest Corp | バイモルフスイッチ、バイモルフスイッチ製造方法、電子回路、及び電子回路製造方法 |
US6621022B1 (en) * | 2002-08-29 | 2003-09-16 | Intel Corporation | Reliable opposing contact structure |
KR20040092228A (ko) * | 2003-04-25 | 2004-11-03 | 엘지전자 주식회사 | 저전압 마이크로 스위치 |
US20050134141A1 (en) * | 2003-12-23 | 2005-06-23 | Jovica Savic | Meso-microelectromechanical system having a glass beam and method for its fabrication |
JP4506529B2 (ja) * | 2005-03-18 | 2010-07-21 | オムロン株式会社 | 静電マイクロスイッチおよびその製造方法、ならびに静電マイクロスイッチを備えた装置 |
JP2007167998A (ja) * | 2005-12-20 | 2007-07-05 | Toshiba Corp | 梁構造を有する装置、および半導体装置 |
JP4929753B2 (ja) * | 2006-02-22 | 2012-05-09 | オムロン株式会社 | 薄膜構造体の形成方法並びに薄膜構造体、振動センサ、圧力センサ及び加速度センサ |
JP5118546B2 (ja) * | 2008-04-25 | 2013-01-16 | 太陽誘電株式会社 | 電気式微小機械スイッチ |
US8779886B2 (en) * | 2009-11-30 | 2014-07-15 | General Electric Company | Switch structures |
US8558330B2 (en) * | 2011-10-31 | 2013-10-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Deep well process for MEMS pressure sensor |
US10964505B2 (en) | 2015-11-16 | 2021-03-30 | Cavendish Kinetics, Inc. | Naturally closed MEMs switch for ESD protection |
TWI683337B (zh) * | 2018-10-05 | 2020-01-21 | 松川精密股份有限公司 | 微型繼電器 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4205340C1 (en) * | 1992-02-21 | 1993-08-05 | Siemens Ag, 8000 Muenchen, De | Micro-mechanical electrostatic relay with parallel electrodes - has frame shaped armature substrate with armature contacts above base electrode contacts on base substrate |
JP3402642B2 (ja) * | 1993-01-26 | 2003-05-06 | 松下電工株式会社 | 静電駆動型リレー |
US5479042A (en) * | 1993-02-01 | 1995-12-26 | Brooktree Corporation | Micromachined relay and method of forming the relay |
DE4437261C1 (de) | 1994-10-18 | 1995-10-19 | Siemens Ag | Mikromechanisches elektrostatisches Relais |
US6483056B2 (en) * | 2000-10-27 | 2002-11-19 | Daniel J Hyman | Microfabricated relay with multimorph actuator and electrostatic latch mechanism |
-
1999
- 1999-02-04 EP EP99902030A patent/EP1166352B1/de not_active Expired - Lifetime
- 1999-02-04 DE DE69938511T patent/DE69938511T2/de not_active Expired - Fee Related
- 1999-02-04 KR KR1020017009841A patent/KR100540245B1/ko not_active IP Right Cessation
- 1999-02-04 CA CA002361756A patent/CA2361756A1/en not_active Abandoned
- 1999-02-04 AT AT99902030T patent/ATE392010T1/de not_active IP Right Cessation
- 1999-02-04 WO PCT/SG1999/000005 patent/WO2000046852A1/en active IP Right Grant
- 1999-02-04 JP JP2000597838A patent/JP2002537630A/ja active Pending
- 1999-02-04 US US09/890,575 patent/US6765300B1/en not_active Expired - Fee Related
- 1999-02-04 CN CNB998164208A patent/CN1173398C/zh not_active Expired - Fee Related
- 1999-02-12 TW TW088102358A patent/TW420814B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE392010T1 (de) | 2008-04-15 |
US6765300B1 (en) | 2004-07-20 |
JP2002537630A (ja) | 2002-11-05 |
WO2000046852A1 (en) | 2000-08-10 |
EP1166352B1 (de) | 2008-04-09 |
EP1166352A1 (de) | 2002-01-02 |
KR20010113675A (ko) | 2001-12-28 |
CA2361756A1 (en) | 2000-08-10 |
TW420814B (en) | 2001-02-01 |
DE69938511T2 (de) | 2009-05-07 |
CN1338116A (zh) | 2002-02-27 |
CN1173398C (zh) | 2004-10-27 |
KR100540245B1 (ko) | 2006-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |