DE69935793D1 - Vorrichtung zur bestimmung der leiterbahnstruktur - Google Patents

Vorrichtung zur bestimmung der leiterbahnstruktur

Info

Publication number
DE69935793D1
DE69935793D1 DE69935793T DE69935793T DE69935793D1 DE 69935793 D1 DE69935793 D1 DE 69935793D1 DE 69935793 T DE69935793 T DE 69935793T DE 69935793 T DE69935793 T DE 69935793T DE 69935793 D1 DE69935793 D1 DE 69935793D1
Authority
DE
Germany
Prior art keywords
determining
rail structure
ladder rail
ladder
rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69935793T
Other languages
English (en)
Other versions
DE69935793T2 (de
Inventor
Masahiro Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of DE69935793D1 publication Critical patent/DE69935793D1/de
Publication of DE69935793T2 publication Critical patent/DE69935793T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE69935793T 1998-07-31 1999-07-29 Vorrichtung zur bestimmung der leiterbahnstruktur Expired - Lifetime DE69935793T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP21677298 1998-07-31
JP21677298A JP4071866B2 (ja) 1998-07-31 1998-07-31 配線パターン検査装置
PCT/JP1999/004096 WO2000006997A1 (fr) 1998-07-31 1999-07-29 Processeur d'image

Publications (2)

Publication Number Publication Date
DE69935793D1 true DE69935793D1 (de) 2007-05-24
DE69935793T2 DE69935793T2 (de) 2007-12-27

Family

ID=16693664

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69935793T Expired - Lifetime DE69935793T2 (de) 1998-07-31 1999-07-29 Vorrichtung zur bestimmung der leiterbahnstruktur

Country Status (6)

Country Link
US (1) US6636632B2 (de)
EP (1) EP1109009B1 (de)
JP (1) JP4071866B2 (de)
AU (1) AU4930799A (de)
DE (1) DE69935793T2 (de)
WO (1) WO2000006997A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4013551B2 (ja) * 2000-04-27 2007-11-28 セイコーエプソン株式会社 透孔内異物検査方法及び透孔内異物検査装置
JP2002163638A (ja) * 2000-11-29 2002-06-07 Ibiden Co Ltd 画像データ検査装置および画像データ検査方法
US7813638B2 (en) * 2004-06-07 2010-10-12 Rudolph Technologies, Inc. System for generating camera triggers
KR100773332B1 (ko) * 2006-04-11 2007-11-05 한국전자통신연구원 변조 장치, 복조 장치 및 무선 모뎀
KR100699899B1 (ko) * 2006-05-08 2007-03-28 삼성전자주식회사 집적회로 장치 제조용 마스크 검사 장치 및 그 검사 방법
US8068674B2 (en) * 2007-09-04 2011-11-29 Evolution Robotics Retail, Inc. UPC substitution fraud prevention
US8935107B1 (en) * 2011-02-18 2015-01-13 The United States of America as Represented by the Adminstrator of National Aeronautics and Space Adminstration Shock sensing system and method
US9117290B2 (en) * 2012-07-20 2015-08-25 Samsung Electronics Co., Ltd. Apparatus and method for filling hole area of image
US10762618B1 (en) * 2019-02-14 2020-09-01 United Microelectronics Corp. Mask weak pattern recognition apparatus and mask weak pattern recognition method
US11631169B2 (en) * 2020-08-02 2023-04-18 KLA Corp. Inspection of noisy patterned features

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4578810A (en) * 1983-08-08 1986-03-25 Itek Corporation System for printed circuit board defect detection
GB2152658A (en) * 1984-01-09 1985-08-07 Philips Electronic Associated Object sorting system
KR900007548B1 (ko) * 1985-10-04 1990-10-15 다이닛뽕스쿠링세이소오 가부시키가이샤 패턴 마스킹 방법 및 그 장치
EP0246145B1 (de) * 1986-05-10 1993-07-28 Fujitsu Limited System zur Untersuchung von Mustern
JP2696000B2 (ja) * 1991-02-08 1998-01-14 大日本スクリーン製造株式会社 プリント基板のパターン検査方法
JP3189488B2 (ja) * 1993-04-08 2001-07-16 イビデン株式会社 プリント配線基板の検査装置
JPH0720062A (ja) * 1993-06-15 1995-01-24 Nikon Corp 画像検出装置
JP3189515B2 (ja) * 1993-07-09 2001-07-16 イビデン株式会社 プリント配線基板の検査装置
US5608816A (en) * 1993-12-24 1997-03-04 Matsushita Electric Industrial Co., Ltd. Apparatus for inspecting a wiring pattern according to a micro-inspection and a macro-inspection performed in parallel
JPH11166903A (ja) * 1997-12-03 1999-06-22 Fujitsu Ltd バイアホール検査装置

Also Published As

Publication number Publication date
JP2000046745A (ja) 2000-02-18
EP1109009A1 (de) 2001-06-20
WO2000006997A1 (fr) 2000-02-10
US20010053242A1 (en) 2001-12-20
DE69935793T2 (de) 2007-12-27
EP1109009A4 (de) 2002-05-08
JP4071866B2 (ja) 2008-04-02
EP1109009B1 (de) 2007-04-11
US6636632B2 (en) 2003-10-21
AU4930799A (en) 2000-02-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition