DE69935179D1 - Strukturierungstechnik unter Verwendung eines Templates und Tintenstrahlsystems - Google Patents
Strukturierungstechnik unter Verwendung eines Templates und TintenstrahlsystemsInfo
- Publication number
- DE69935179D1 DE69935179D1 DE69935179T DE69935179T DE69935179D1 DE 69935179 D1 DE69935179 D1 DE 69935179D1 DE 69935179 T DE69935179 T DE 69935179T DE 69935179 T DE69935179 T DE 69935179T DE 69935179 D1 DE69935179 D1 DE 69935179D1
- Authority
- DE
- Germany
- Prior art keywords
- template
- inkjet system
- structuring technique
- structuring
- technique
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Liquid Crystal (AREA)
- Printing Methods (AREA)
- Ink Jet (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Decoration By Transfer Pictures (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14489298 | 1998-05-26 | ||
JP14489298A JP3780700B2 (ja) | 1998-05-26 | 1998-05-26 | パターン形成方法、パターン形成装置、パターン形成用版、パターン形成用版の製造方法、カラーフィルタの製造方法、導電膜の製造方法及び液晶パネルの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69935179D1 true DE69935179D1 (de) | 2007-04-05 |
DE69935179T2 DE69935179T2 (de) | 2007-12-20 |
Family
ID=15372782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69935179T Expired - Lifetime DE69935179T2 (de) | 1998-05-26 | 1999-05-26 | Strukturierungstechnik unter Verwendung eines Templates und Tintenstrahlsystems |
Country Status (7)
Country | Link |
---|---|
US (2) | US6646662B1 (de) |
EP (1) | EP0962962B1 (de) |
JP (1) | JP3780700B2 (de) |
KR (1) | KR100586224B1 (de) |
CN (1) | CN1161242C (de) |
DE (1) | DE69935179T2 (de) |
TW (1) | TW404890B (de) |
Families Citing this family (104)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6873087B1 (en) * | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
US7432634B2 (en) | 2000-10-27 | 2008-10-07 | Board Of Regents, University Of Texas System | Remote center compliant flexure device |
EP1303792B1 (de) | 2000-07-16 | 2012-10-03 | Board Of Regents, The University Of Texas System | Hoch auflösende ausrichtungsverfahren und entsprechende systeme für die präge-lithographie |
JP4740518B2 (ja) | 2000-07-17 | 2011-08-03 | ボード・オブ・リージエンツ,ザ・ユニバーシテイ・オブ・テキサス・システム | 転写リソグラフィ・プロセスのための自動液体ディスペンス方法およびシステム |
US20050160011A1 (en) * | 2004-01-20 | 2005-07-21 | Molecular Imprints, Inc. | Method for concurrently employing differing materials to form a layer on a substrate |
EP1390975A2 (de) | 2000-08-21 | 2004-02-25 | The Board Of Regents, The University Of Texas System | Translationstufe auf basis von biegung |
AU2001297642A1 (en) | 2000-10-12 | 2002-09-04 | Board Of Regents, The University Of Texas System | Template for room temperature, low pressure micro- and nano-imprint lithography |
DE10061297C2 (de) * | 2000-12-08 | 2003-05-28 | Siemens Ag | Verfahren zur Sturkturierung eines OFETs |
JP2002224604A (ja) * | 2001-01-31 | 2002-08-13 | Hitachi Ltd | パターン転写装置,パターン転写方法および転写用原版の製造方法 |
US6973710B2 (en) * | 2001-08-03 | 2005-12-13 | Seiko Epson Corporation | Method and apparatus for making devices |
US7179079B2 (en) | 2002-07-08 | 2007-02-20 | Molecular Imprints, Inc. | Conforming template for patterning liquids disposed on substrates |
US6926929B2 (en) * | 2002-07-09 | 2005-08-09 | Molecular Imprints, Inc. | System and method for dispensing liquids |
US7077992B2 (en) | 2002-07-11 | 2006-07-18 | Molecular Imprints, Inc. | Step and repeat imprint lithography processes |
US6908861B2 (en) * | 2002-07-11 | 2005-06-21 | Molecular Imprints, Inc. | Method for imprint lithography using an electric field |
US7442336B2 (en) * | 2003-08-21 | 2008-10-28 | Molecular Imprints, Inc. | Capillary imprinting technique |
US7019819B2 (en) * | 2002-11-13 | 2006-03-28 | Molecular Imprints, Inc. | Chucking system for modulating shapes of substrates |
US8349241B2 (en) | 2002-10-04 | 2013-01-08 | Molecular Imprints, Inc. | Method to arrange features on a substrate to replicate features having minimal dimensional variability |
US6980282B2 (en) * | 2002-12-11 | 2005-12-27 | Molecular Imprints, Inc. | Method for modulating shapes of substrates |
US7641840B2 (en) | 2002-11-13 | 2010-01-05 | Molecular Imprints, Inc. | Method for expelling gas positioned between a substrate and a mold |
US20040112862A1 (en) * | 2002-12-12 | 2004-06-17 | Molecular Imprints, Inc. | Planarization composition and method of patterning a substrate using the same |
US7365103B2 (en) * | 2002-12-12 | 2008-04-29 | Board Of Regents, The University Of Texas System | Compositions for dark-field polymerization and method of using the same for imprint lithography processes |
MY136129A (en) * | 2002-12-13 | 2008-08-29 | Molecular Imprints Inc | Magnification correction employing out-of-plane distortion of a substrate |
US7186656B2 (en) | 2004-05-21 | 2007-03-06 | Molecular Imprints, Inc. | Method of forming a recessed structure employing a reverse tone process |
US6951173B1 (en) | 2003-05-14 | 2005-10-04 | Molecular Imprints, Inc. | Assembly and method for transferring imprint lithography templates |
US7307118B2 (en) | 2004-11-24 | 2007-12-11 | Molecular Imprints, Inc. | Composition to reduce adhesion between a conformable region and a mold |
US7150622B2 (en) | 2003-07-09 | 2006-12-19 | Molecular Imprints, Inc. | Systems for magnification and distortion correction for imprint lithography processes |
US8211214B2 (en) | 2003-10-02 | 2012-07-03 | Molecular Imprints, Inc. | Single phase fluid imprint lithography method |
US7090716B2 (en) * | 2003-10-02 | 2006-08-15 | Molecular Imprints, Inc. | Single phase fluid imprint lithography method |
US7261830B2 (en) * | 2003-10-16 | 2007-08-28 | Molecular Imprints, Inc. | Applying imprinting material to substrates employing electromagnetic fields |
US7122482B2 (en) | 2003-10-27 | 2006-10-17 | Molecular Imprints, Inc. | Methods for fabricating patterned features utilizing imprint lithography |
KR20060126967A (ko) * | 2003-11-12 | 2006-12-11 | 몰레큘러 임프린츠 인코퍼레이티드 | 고속 충전 및 처리량을 달성하기 위한 분배 구조 및 전도성주형 |
US20050098534A1 (en) * | 2003-11-12 | 2005-05-12 | Molecular Imprints, Inc. | Formation of conductive templates employing indium tin oxide |
US20050158419A1 (en) * | 2004-01-15 | 2005-07-21 | Watts Michael P. | Thermal processing system for imprint lithography |
US20050156353A1 (en) * | 2004-01-15 | 2005-07-21 | Watts Michael P. | Method to improve the flow rate of imprinting material |
US7019835B2 (en) | 2004-02-19 | 2006-03-28 | Molecular Imprints, Inc. | Method and system to measure characteristics of a film disposed on a substrate |
US8076386B2 (en) | 2004-02-23 | 2011-12-13 | Molecular Imprints, Inc. | Materials for imprint lithography |
US20050189676A1 (en) * | 2004-02-27 | 2005-09-01 | Molecular Imprints, Inc. | Full-wafer or large area imprinting with multiple separated sub-fields for high throughput lithography |
US7906180B2 (en) | 2004-02-27 | 2011-03-15 | Molecular Imprints, Inc. | Composition for an etching mask comprising a silicon-containing material |
US7140861B2 (en) | 2004-04-27 | 2006-11-28 | Molecular Imprints, Inc. | Compliant hard template for UV imprinting |
US20050253307A1 (en) * | 2004-05-11 | 2005-11-17 | Molecualr Imprints, Inc. | Method of patterning a conductive layer on a substrate |
US7504268B2 (en) | 2004-05-28 | 2009-03-17 | Board Of Regents, The University Of Texas System | Adaptive shape substrate support method |
US20050270516A1 (en) * | 2004-06-03 | 2005-12-08 | Molecular Imprints, Inc. | System for magnification and distortion correction during nano-scale manufacturing |
US20070228593A1 (en) | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Residual Layer Thickness Measurement and Correction |
JP4592521B2 (ja) * | 2004-07-16 | 2010-12-01 | 大日精化工業株式会社 | カラーフィルターの製造方法、画素形成用インク、カラーフィルターおよびそれを使用した画像表示装置 |
US7785526B2 (en) * | 2004-07-20 | 2010-08-31 | Molecular Imprints, Inc. | Imprint alignment method, system, and template |
US20060017876A1 (en) * | 2004-07-23 | 2006-01-26 | Molecular Imprints, Inc. | Displays and method for fabricating displays |
US7309225B2 (en) | 2004-08-13 | 2007-12-18 | Molecular Imprints, Inc. | Moat system for an imprint lithography template |
US7105452B2 (en) * | 2004-08-13 | 2006-09-12 | Molecular Imprints, Inc. | Method of planarizing a semiconductor substrate with an etching chemistry |
US7282550B2 (en) * | 2004-08-16 | 2007-10-16 | Molecular Imprints, Inc. | Composition to provide a layer with uniform etch characteristics |
US7939131B2 (en) | 2004-08-16 | 2011-05-10 | Molecular Imprints, Inc. | Method to provide a layer with uniform etch characteristics |
JP4399337B2 (ja) * | 2004-09-13 | 2010-01-13 | 株式会社フューチャービジョン | 平面パターンを有する基板およびそれを用いた表示装置 |
US7547504B2 (en) | 2004-09-21 | 2009-06-16 | Molecular Imprints, Inc. | Pattern reversal employing thick residual layers |
US7205244B2 (en) | 2004-09-21 | 2007-04-17 | Molecular Imprints | Patterning substrates employing multi-film layers defining etch-differential interfaces |
US7041604B2 (en) * | 2004-09-21 | 2006-05-09 | Molecular Imprints, Inc. | Method of patterning surfaces while providing greater control of recess anisotropy |
US7241395B2 (en) * | 2004-09-21 | 2007-07-10 | Molecular Imprints, Inc. | Reverse tone patterning on surfaces having planarity perturbations |
US7252777B2 (en) * | 2004-09-21 | 2007-08-07 | Molecular Imprints, Inc. | Method of forming an in-situ recessed structure |
US20060062922A1 (en) | 2004-09-23 | 2006-03-23 | Molecular Imprints, Inc. | Polymerization technique to attenuate oxygen inhibition of solidification of liquids and composition therefor |
US7244386B2 (en) | 2004-09-27 | 2007-07-17 | Molecular Imprints, Inc. | Method of compensating for a volumetric shrinkage of a material disposed upon a substrate to form a substantially planar structure therefrom |
US7292326B2 (en) | 2004-11-30 | 2007-11-06 | Molecular Imprints, Inc. | Interferometric analysis for the manufacture of nano-scale devices |
US7630067B2 (en) | 2004-11-30 | 2009-12-08 | Molecular Imprints, Inc. | Interferometric analysis method for the manufacture of nano-scale devices |
US20070231421A1 (en) | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Enhanced Multi Channel Alignment |
KR20070086766A (ko) * | 2004-12-01 | 2007-08-27 | 몰레큘러 임프린츠 인코퍼레이티드 | 임프린트 리소그래피 공정용 열관리를 위한 노출 방법 |
WO2006060757A2 (en) | 2004-12-01 | 2006-06-08 | Molecular Imprints, Inc. | Eliminating printability of sub-resolution defects in imprint lithography |
US7281919B2 (en) * | 2004-12-07 | 2007-10-16 | Molecular Imprints, Inc. | System for controlling a volume of material on a mold |
JP2006162538A (ja) * | 2004-12-10 | 2006-06-22 | Seiko Instruments Inc | 微量質量測定装置 |
JP4888991B2 (ja) * | 2005-01-18 | 2012-02-29 | 新科實業有限公司 | 面形状形成方法及び装置、磁気ヘッドの浮上面形成方法及び装置 |
JP2006201212A (ja) * | 2005-01-18 | 2006-08-03 | Shinka Jitsugyo Kk | 面形状形成方法及び装置、磁気ヘッドの浮上面形成方法及び装置 |
US7636999B2 (en) | 2005-01-31 | 2009-12-29 | Molecular Imprints, Inc. | Method of retaining a substrate to a wafer chuck |
US7635263B2 (en) | 2005-01-31 | 2009-12-22 | Molecular Imprints, Inc. | Chucking system comprising an array of fluid chambers |
JP3958344B2 (ja) * | 2005-06-07 | 2007-08-15 | キヤノン株式会社 | インプリント装置、インプリント方法及びチップの製造方法 |
US7256131B2 (en) * | 2005-07-19 | 2007-08-14 | Molecular Imprints, Inc. | Method of controlling the critical dimension of structures formed on a substrate |
US8557351B2 (en) | 2005-07-22 | 2013-10-15 | Molecular Imprints, Inc. | Method for adhering materials together |
US8808808B2 (en) | 2005-07-22 | 2014-08-19 | Molecular Imprints, Inc. | Method for imprint lithography utilizing an adhesion primer layer |
US7759407B2 (en) | 2005-07-22 | 2010-07-20 | Molecular Imprints, Inc. | Composition for adhering materials together |
US7665981B2 (en) | 2005-08-25 | 2010-02-23 | Molecular Imprints, Inc. | System to transfer a template transfer body between a motion stage and a docking plate |
US7316554B2 (en) | 2005-09-21 | 2008-01-08 | Molecular Imprints, Inc. | System to control an atmosphere between a body and a substrate |
US8142703B2 (en) * | 2005-10-05 | 2012-03-27 | Molecular Imprints, Inc. | Imprint lithography method |
US7906058B2 (en) | 2005-12-01 | 2011-03-15 | Molecular Imprints, Inc. | Bifurcated contact printing technique |
US7803308B2 (en) | 2005-12-01 | 2010-09-28 | Molecular Imprints, Inc. | Technique for separating a mold from solidified imprinting material |
CN104317161A (zh) | 2005-12-08 | 2015-01-28 | 分子制模股份有限公司 | 用于衬底双面图案形成的方法和系统 |
US7670530B2 (en) | 2006-01-20 | 2010-03-02 | Molecular Imprints, Inc. | Patterning substrates employing multiple chucks |
US8001924B2 (en) * | 2006-03-31 | 2011-08-23 | Asml Netherlands B.V. | Imprint lithography |
US8850980B2 (en) | 2006-04-03 | 2014-10-07 | Canon Nanotechnologies, Inc. | Tessellated patterns in imprint lithography |
KR20090003153A (ko) | 2006-04-03 | 2009-01-09 | 몰레큘러 임프린츠 인코퍼레이티드 | 다수의 필드와 정렬 마크를 갖는 기판을 동시에 패턴화하는방법 |
US8142850B2 (en) | 2006-04-03 | 2012-03-27 | Molecular Imprints, Inc. | Patterning a plurality of fields on a substrate to compensate for differing evaporation times |
US7802978B2 (en) | 2006-04-03 | 2010-09-28 | Molecular Imprints, Inc. | Imprinting of partial fields at the edge of the wafer |
US20070231422A1 (en) * | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | System to vary dimensions of a thin template |
US8012395B2 (en) | 2006-04-18 | 2011-09-06 | Molecular Imprints, Inc. | Template having alignment marks formed of contrast material |
WO2007124007A2 (en) * | 2006-04-21 | 2007-11-01 | Molecular Imprints, Inc. | Method for detecting a particle in a nanoimprint lithography system |
US8215946B2 (en) | 2006-05-18 | 2012-07-10 | Molecular Imprints, Inc. | Imprint lithography system and method |
US8015939B2 (en) | 2006-06-30 | 2011-09-13 | Asml Netherlands B.V. | Imprintable medium dispenser |
US7830498B2 (en) * | 2006-10-10 | 2010-11-09 | Hewlett-Packard Development Company, L.P. | Hydraulic-facilitated contact lithography apparatus, system and method |
US8142702B2 (en) * | 2007-06-18 | 2012-03-27 | Molecular Imprints, Inc. | Solvent-assisted layer formation for imprint lithography |
FR2933492B1 (fr) * | 2008-07-07 | 2015-02-06 | Hemodia | Appareil et procede de fonctionnalisation de micro-capteurs |
WO2010063504A2 (en) * | 2008-12-04 | 2010-06-10 | Asml Netherlands B.V. | Imprint lithography apparatus and method |
JP5982386B2 (ja) * | 2010-11-05 | 2016-08-31 | モレキュラー・インプリンツ・インコーポレーテッド | 非凸形ナノ構造のパターン形成 |
TW201244014A (en) * | 2011-04-22 | 2012-11-01 | Inotera Memories Inc | Semiconductor method of making an array columnar hollow structure |
US9630423B2 (en) * | 2013-09-16 | 2017-04-25 | Xerox Corporation | Hydrophilic imaging member surface material for variable data ink-based digital printing systems and methods for manufacturing hydrophilic imaging member surface materials |
PT3126532T (pt) * | 2014-04-04 | 2019-09-19 | Bramac S R L | Método para marcação de referências num artigo plano e sistema associado |
JP6298690B2 (ja) * | 2014-04-09 | 2018-03-20 | 株式会社ディスコ | 保護膜形成方法 |
JP6005698B2 (ja) * | 2014-08-29 | 2016-10-12 | 株式会社ミノグループ | 微細凹凸パターン付き基板の製造方法 |
JP6584182B2 (ja) * | 2015-07-16 | 2019-10-02 | キヤノン株式会社 | インプリント装置、インプリント方法および物品製造方法 |
KR102430018B1 (ko) * | 2017-12-20 | 2022-08-05 | 엘지디스플레이 주식회사 | 이송 헤드 어셈블리 및 발광소자 이송장치 |
CN111300370B (zh) * | 2020-03-12 | 2023-04-14 | 南京尚科得科技发展有限公司 | 一种牛角梳制作的划线装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2777411A (en) * | 1954-02-16 | 1957-01-15 | Wilbro Corp | Method of making lined bottle caps |
US3958255A (en) * | 1974-12-31 | 1976-05-18 | International Business Machines Corporation | Ink jet nozzle structure |
US4021276A (en) * | 1975-12-29 | 1977-05-03 | Western Electric Company, Inc. | Method of making rib-structure shadow mask for ion implantation |
US4166277A (en) * | 1977-10-25 | 1979-08-28 | Northern Telecom Limited | Electrostatic ink ejection printing head |
US4164745A (en) * | 1978-05-08 | 1979-08-14 | Northern Telecom Limited | Printing by modulation of ink viscosity |
ATE147014T1 (de) * | 1990-10-18 | 1997-01-15 | Canon Kk | Herstellungsverfahren eines tintenstrahldruckkopfes |
EP0534474B1 (de) * | 1991-09-27 | 2002-01-16 | Canon Kabushiki Kaisha | Verfahren zur Behandlung eines Substrats aus Silizium |
US5481280A (en) * | 1992-11-30 | 1996-01-02 | Lam; Si-Ty | Color ink transfer printing |
US5381166A (en) * | 1992-11-30 | 1995-01-10 | Hewlett-Packard Company | Ink dot size control for ink transfer printing |
JPH07117144A (ja) | 1993-10-22 | 1995-05-09 | Dainippon Printing Co Ltd | 面光源用導光板の製造方法 |
JPH08252920A (ja) * | 1995-03-16 | 1996-10-01 | Brother Ind Ltd | 積層型圧電素子の製造方法 |
DE69707853T2 (de) | 1996-03-15 | 2002-06-27 | Harvard College | Verfahren zum formen von gegenständen und zum mikrostrukturieren von oberflächen durch giessformen mit kapillarwirkung |
JP3984689B2 (ja) * | 1996-11-11 | 2007-10-03 | キヤノン株式会社 | インクジェットヘッドの製造方法 |
CA2572786A1 (en) * | 1997-04-04 | 1998-10-15 | University Of Southern California | Method for electrochemical fabrication including etching to remove flash |
US6008825A (en) * | 1997-08-27 | 1999-12-28 | Eastman Kodak Company | Microfluidic printing independent of orientation |
US6057865A (en) * | 1997-09-23 | 2000-05-02 | Eastman Kodak Company | Transferring of color segments to a receiver |
US6919009B2 (en) * | 1999-10-01 | 2005-07-19 | Nanoplex Technologies, Inc. | Method of manufacture of colloidal rod particles as nanobarcodes |
US6753036B2 (en) * | 2001-07-16 | 2004-06-22 | The Regents Of The University Of California | Method for fabrication of electrodes |
US20030106487A1 (en) * | 2001-12-10 | 2003-06-12 | Wen-Chiang Huang | Photonic crystals and method for producing same |
-
1998
- 1998-05-26 JP JP14489298A patent/JP3780700B2/ja not_active Expired - Fee Related
-
1999
- 1999-05-25 TW TW088108694A patent/TW404890B/zh not_active IP Right Cessation
- 1999-05-25 US US09/317,998 patent/US6646662B1/en not_active Expired - Lifetime
- 1999-05-26 EP EP99304095A patent/EP0962962B1/de not_active Expired - Lifetime
- 1999-05-26 DE DE69935179T patent/DE69935179T2/de not_active Expired - Lifetime
- 1999-05-26 KR KR1019990019049A patent/KR100586224B1/ko not_active IP Right Cessation
- 1999-05-26 CN CNB991075668A patent/CN1161242C/zh not_active Expired - Fee Related
-
2003
- 2003-04-29 US US10/424,790 patent/US7306742B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0962962A3 (de) | 2002-01-02 |
US6646662B1 (en) | 2003-11-11 |
DE69935179T2 (de) | 2007-12-20 |
US20030198897A1 (en) | 2003-10-23 |
KR19990088567A (ko) | 1999-12-27 |
JP3780700B2 (ja) | 2006-05-31 |
TW404890B (en) | 2000-09-11 |
US7306742B2 (en) | 2007-12-11 |
CN1275484A (zh) | 2000-12-06 |
EP0962962A2 (de) | 1999-12-08 |
KR100586224B1 (ko) | 2006-06-07 |
CN1161242C (zh) | 2004-08-11 |
EP0962962B1 (de) | 2007-02-21 |
JPH11334048A (ja) | 1999-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69935179D1 (de) | Strukturierungstechnik unter Verwendung eines Templates und Tintenstrahlsystems | |
DE69941075D1 (de) | Tinte, Tintenstrahl-Aufzeichnungsverfahren unter Verwendung derselben, und Photoinitiator | |
DE69727642D1 (de) | Wässrige pigmenthaltige Tinte und Tintenstrahl-Aufzeichnungsverfahren unter Verwendung derselben | |
DE69700413D1 (de) | Tintenstrahlaufzeichnungsverfahren, Vorrichtung und Materialien | |
DE69613544T2 (de) | Tintensortiment und Tintenstrahlaufzeichnungsverfahren unter Verwendung desselben | |
DE69524659D1 (de) | Tintenstrahlkopfsubstrat und Tintenstrahlkopf unter Verwendung desselben | |
DE69509304D1 (de) | Tintenstrahl-Drucktinte und Druckverfahren unter Verwendung derselben | |
DE69934468D1 (de) | Druckersystem und Drucker die Druckdaten wiederverwenden | |
DE69825937D1 (de) | Tintensortiment, Aufzeichnungsverfahren und Aufzeichnungsgerät unter Verwendung desselben | |
DE69927071D1 (de) | Tintenstrahldrucker und Druckverfahren unter Verwendung desselben | |
DE69813990D1 (de) | Vorrichtung und Verfahren zur Energiesteuerung für einen Thermischen Tintenstrahldruckkopf | |
DE69007432D1 (de) | Tinte und Tintenstrahldruckverfahren, Tintenpatrone, Tintenstrahlerzeugungsvorrichtung und Tintenstrahldruckvorrichtung unter Verwendung derselben. | |
DE69722143T2 (de) | Verschliessvorrichtung und Tintenstrahlgerät unter Verwendung derselben | |
DE69518790D1 (de) | Verfahren und Vorrichtung zum Farbdruck unter Verwendung einer Farbtonbereichsumsetzung im Munsell Farbraum | |
DE69924548D1 (de) | Druckdatenerzeugung und Drucksteuerungsverfahren und -gerät | |
DE69614263D1 (de) | Mittel zur aktivierung eines werkzeugs im bohrloch | |
DE69828343D1 (de) | Tintenstrahlaufzeichnungs- Verfahren und Vorrichtung | |
DE69915669D1 (de) | Hydroformylierungsverfahren unter verwendung eines chlorphosphit-metall katalysatorsystems | |
DE69924912D1 (de) | Verschlüsselungsverfahren und Vorrichtung unter Verwendung einer elliptischen Kurve | |
DE69605378D1 (de) | Tinte, Tintenstrahl-Aufzeichnungsverfahren und Vorrichtung hierfür | |
DE69925073D1 (de) | Tintenstrahldrucker und Inbetriebsstellungsverfahren dafür | |
DE69526406D1 (de) | Druckverfahren und Drucker unter Verwendung desselben | |
DE69933805D1 (de) | Drucker, Druckverfahren und Rechnerprogramm zur Aktualisierung des Druckers | |
DE69909582D1 (de) | Tintenstrahldruckverfahren | |
DE69723963D1 (de) | Seitliche magento-elektronische vorrichtung unter ausnutzung eines quasi zwei-dimensionalen elektrogases |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |