DE69911792D1 - Herstellung einer oxidschicht mit nicht gleichmässiger dicke auf der oberfläche eines siliziumsubstrats - Google Patents

Herstellung einer oxidschicht mit nicht gleichmässiger dicke auf der oberfläche eines siliziumsubstrats

Info

Publication number
DE69911792D1
DE69911792D1 DE69911792T DE69911792T DE69911792D1 DE 69911792 D1 DE69911792 D1 DE 69911792D1 DE 69911792 T DE69911792 T DE 69911792T DE 69911792 T DE69911792 T DE 69911792T DE 69911792 D1 DE69911792 D1 DE 69911792D1
Authority
DE
Germany
Prior art keywords
producing
oxide layer
silicon substrate
uniform thickness
uniform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69911792T
Other languages
English (en)
Inventor
Aomar Halimaoui
Andre Grouillet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orange SA
Original Assignee
France Telecom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by France Telecom SA filed Critical France Telecom SA
Application granted granted Critical
Publication of DE69911792D1 publication Critical patent/DE69911792D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/48—Ion implantation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/02—Pretreatment of the material to be coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
DE69911792T 1998-07-28 1999-07-19 Herstellung einer oxidschicht mit nicht gleichmässiger dicke auf der oberfläche eines siliziumsubstrats Expired - Lifetime DE69911792D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9809607A FR2781780B1 (fr) 1998-07-28 1998-07-28 Procede de formation d'une couche d'oxyde d'epaisseur non-uniforme a la surface d'un substrat de silicium
PCT/FR1999/001756 WO2000006489A1 (fr) 1998-07-28 1999-07-19 Procede de formation d'une couche d'oxyde d'epaisseur non-uniforme a la surface d'un substrat de silicium

Publications (1)

Publication Number Publication Date
DE69911792D1 true DE69911792D1 (de) 2003-11-06

Family

ID=9529083

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69911792T Expired - Lifetime DE69911792D1 (de) 1998-07-28 1999-07-19 Herstellung einer oxidschicht mit nicht gleichmässiger dicke auf der oberfläche eines siliziumsubstrats

Country Status (5)

Country Link
EP (1) EP1100750B1 (de)
JP (1) JP2002521831A (de)
DE (1) DE69911792D1 (de)
FR (1) FR2781780B1 (de)
WO (1) WO2000006489A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4437352B2 (ja) * 2000-02-29 2010-03-24 富士通マイクロエレクトロニクス株式会社 半導体装置の製造方法
JP2006222151A (ja) * 2005-02-08 2006-08-24 Oki Electric Ind Co Ltd 半導体素子の製造方法
US9318108B2 (en) 2010-01-18 2016-04-19 Apple Inc. Intelligent automated assistant
US10049663B2 (en) 2016-06-08 2018-08-14 Apple, Inc. Intelligent automated assistant for media exploration

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116530A (ja) * 1984-07-03 1986-01-24 Matsushita Electronics Corp 半導体装置の製造方法
US5021354A (en) * 1989-12-04 1991-06-04 Motorola, Inc. Process for manufacturing a semiconductor device
US5106768A (en) * 1990-08-31 1992-04-21 United Microelectronics Corporation Method for the manufacture of CMOS FET by P+ maskless technique
US5937310A (en) * 1996-04-29 1999-08-10 Advanced Micro Devices, Inc. Reduced bird's beak field oxidation process using nitrogen implanted into active region

Also Published As

Publication number Publication date
FR2781780B1 (fr) 2000-10-27
EP1100750A1 (de) 2001-05-23
FR2781780A1 (fr) 2000-02-04
EP1100750B1 (de) 2003-10-01
JP2002521831A (ja) 2002-07-16
WO2000006489A1 (fr) 2000-02-10

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: FRANCE TELECOM, PARIS, FR

8332 No legal effect for de