DE69911687D1 - Lichtempfindliche zusammensetzung - Google Patents

Lichtempfindliche zusammensetzung

Info

Publication number
DE69911687D1
DE69911687D1 DE69911687T DE69911687T DE69911687D1 DE 69911687 D1 DE69911687 D1 DE 69911687D1 DE 69911687 T DE69911687 T DE 69911687T DE 69911687 T DE69911687 T DE 69911687T DE 69911687 D1 DE69911687 D1 DE 69911687D1
Authority
DE
Germany
Prior art keywords
light sensitive
sensitive composition
composition
light
sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69911687T
Other languages
English (en)
Other versions
DE69911687T2 (de
Inventor
Lin-Chiu Chiang
Jenq-Tain Lin
Nobuyuki Sensui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Application granted granted Critical
Publication of DE69911687D1 publication Critical patent/DE69911687D1/de
Publication of DE69911687T2 publication Critical patent/DE69911687T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/128—Radiation-activated cross-linking agent containing
DE69911687T 1998-05-14 1999-04-09 Lichtempfindliche zusammensetzung Expired - Lifetime DE69911687T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP15074498 1998-05-14
JP15074498 1998-05-14
JP23638698A JP3968886B2 (ja) 1998-05-14 1998-08-07 感光性組成物
JP23638698 1998-08-07

Publications (2)

Publication Number Publication Date
DE69911687D1 true DE69911687D1 (de) 2003-11-06
DE69911687T2 DE69911687T2 (de) 2004-07-29

Family

ID=26480240

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69911687T Expired - Lifetime DE69911687T2 (de) 1998-05-14 1999-04-09 Lichtempfindliche zusammensetzung

Country Status (4)

Country Link
US (2) US6365324B1 (de)
EP (1) EP0957126B1 (de)
JP (1) JP3968886B2 (de)
DE (1) DE69911687T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3426531B2 (ja) * 1998-10-30 2003-07-14 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
JP5216179B2 (ja) * 2000-09-12 2013-06-19 株式会社ピーアイ技術研究所 ネガ型感光性ポリイミド組成物及びそれを用いた画像の形成方法
TW200302253A (en) * 2002-01-15 2003-08-01 Pi R & D Co Ltd Solvent-soluble block copolyimide composition, process for producing the same, positive photosensitive polyimide composition and positive photosensitive block copolyimide ink composition
JP5099979B2 (ja) * 2005-04-27 2012-12-19 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品
CN102298261A (zh) 2005-07-05 2011-12-28 日立化成工业株式会社 感光性粘接剂、粘接薄膜、粘接薄片以及粘接剂图案
JP4586920B2 (ja) * 2006-04-24 2010-11-24 Ｊｓｒ株式会社 感光性樹脂組成物
JP2008083359A (ja) * 2006-09-27 2008-04-10 Jsr Corp 感光性樹脂組成物及び硬化膜
WO2016124493A1 (en) 2015-02-02 2016-08-11 Basf Se Latent acids and their use
CA2997947A1 (en) 2015-09-09 2017-03-16 The Trustees Of Columbia University In The City Of New York Reduction of er-mam-localized app-c99 and methods of treating alzheimer's disease

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131227A (en) 1981-02-09 1982-08-14 Nippon Telegr & Teleph Corp <Ntt> Photopolymer and its production
JPS59145216A (ja) 1983-02-07 1984-08-20 Ube Ind Ltd 有機溶媒可溶性の感光性ポリアミドイミド
CA1299801C (en) 1987-03-31 1992-04-28 Chung J. Lee Soluble polyimidesiloxanes and methods for their preparation and use
US4803147A (en) 1987-11-24 1989-02-07 Hoechst Celanese Corporation Photosensitive polyimide polymer compositions
JPH04108879A (ja) * 1990-08-30 1992-04-09 Nippon Steel Chem Co Ltd ポリイミド樹脂コーテイング剤組成物
US5693379A (en) * 1994-10-20 1997-12-02 Chisso Corporation Polyimide
US6071667A (en) * 1995-04-13 2000-06-06 Hitachi Chemical Co., Ltd. Photosensitive resin composition containing a photosensitive polyamide resin
US6096480A (en) * 1995-07-28 2000-08-01 Ube Industries, Ltd. Photosensitive polyimidosiloxane compositions and insulating films made thereof
JPH09328547A (ja) 1996-06-07 1997-12-22 Nippon Mektron Ltd 新規ポリイミド共重合体およびその製造法
JP3321548B2 (ja) 1996-06-17 2002-09-03 株式会社日立製作所 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法
US6117510A (en) * 1996-07-30 2000-09-12 Ube Industries, Ltd. Adhesive-applied tape
JP3968835B2 (ja) * 1996-12-20 2007-08-29 日本メクトロン株式会社 シロキサンポリイミドを含有する耐熱性接着剤
JP3700311B2 (ja) * 1997-02-05 2005-09-28 日本メクトロン株式会社 シロキサンポリイミドおよびそれを含有する耐熱性接着剤
US6025461A (en) 1997-09-26 2000-02-15 Nippon Mektron, Limited Photosensitive polyimide
JP4434338B2 (ja) * 1997-09-26 2010-03-17 日本メクトロン株式会社 感光性ポリイミド
JP3968885B2 (ja) * 1998-05-14 2007-08-29 日本メクトロン株式会社 感光性組成物

Also Published As

Publication number Publication date
US6365324B1 (en) 2002-04-02
JP2000034348A (ja) 2000-02-02
DE69911687T2 (de) 2004-07-29
JP3968886B2 (ja) 2007-08-29
US6232039B1 (en) 2001-05-15
EP0957126B1 (de) 2003-10-01
EP0957126A1 (de) 1999-11-17

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