DE69903749D1 - Parallel-kühlung für hochleistungsvorrichtungen in einer serien-gekühlten umgebung - Google Patents

Parallel-kühlung für hochleistungsvorrichtungen in einer serien-gekühlten umgebung

Info

Publication number
DE69903749D1
DE69903749D1 DE69903749T DE69903749T DE69903749D1 DE 69903749 D1 DE69903749 D1 DE 69903749D1 DE 69903749 T DE69903749 T DE 69903749T DE 69903749 T DE69903749 T DE 69903749T DE 69903749 D1 DE69903749 D1 DE 69903749D1
Authority
DE
Germany
Prior art keywords
series
performance devices
parallel cooling
cooled environment
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69903749T
Other languages
English (en)
Other versions
DE69903749T2 (de
Inventor
M Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Unisys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisys Corp filed Critical Unisys Corp
Application granted granted Critical
Publication of DE69903749D1 publication Critical patent/DE69903749D1/de
Publication of DE69903749T2 publication Critical patent/DE69903749T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69903749T 1998-11-24 1999-11-23 Parallel-kühlung für hochleistungsvorrichtungen in einer serien-gekühlten umgebung Expired - Fee Related DE69903749T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/198,719 US6198628B1 (en) 1998-11-24 1998-11-24 Parallel cooling of high power devices in a serially cooled evironment
PCT/US1999/027752 WO2000032023A1 (en) 1998-11-24 1999-11-23 Parallel cooling of high power devices in a serially cooled environment

Publications (2)

Publication Number Publication Date
DE69903749D1 true DE69903749D1 (de) 2002-12-05
DE69903749T2 DE69903749T2 (de) 2003-07-24

Family

ID=22734517

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69903749T Expired - Fee Related DE69903749T2 (de) 1998-11-24 1999-11-23 Parallel-kühlung für hochleistungsvorrichtungen in einer serien-gekühlten umgebung

Country Status (6)

Country Link
US (1) US6198628B1 (de)
EP (1) EP1133906B1 (de)
JP (1) JP2002530901A (de)
BR (1) BR9915601A (de)
DE (1) DE69903749T2 (de)
WO (1) WO2000032023A1 (de)

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US7841199B2 (en) * 2005-05-17 2010-11-30 American Power Conversion Corporation Cold aisle isolation
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US8107238B2 (en) 2005-09-19 2012-01-31 Chatsworth Products, Inc. Ducted exhaust equipment enclosure
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US8257155B2 (en) * 2006-01-20 2012-09-04 Chatsworth Products, Inc. Selectively routing air within an electronic equipment enclosure
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US20080037214A1 (en) * 2006-08-11 2008-02-14 Open Source Systems, Inc. Computer chassis for two horizontally oriented motherboards
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US20090061755A1 (en) * 2007-08-28 2009-03-05 Panduit Corp. Intake Duct
US9681587B2 (en) * 2007-08-30 2017-06-13 Pce, Inc. System and method for cooling electronic equipment
US10229026B1 (en) * 2007-11-17 2019-03-12 EMC IP Holding Company LLC Method and apparatus for providing environmental management in distributed system data centers
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DE102009037567B4 (de) * 2009-08-14 2011-09-22 Sinitec Vertriebsgesellschaft Mbh Kühlanordnung, Serverrack und Verfahren zur Steuerung einer Kühlanordnung
US8174826B2 (en) 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8279597B2 (en) 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8179674B2 (en) 2010-05-28 2012-05-15 International Business Machines Corporation Scalable space-optimized and energy-efficient computing system
US8358503B2 (en) 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
US8653363B2 (en) 2010-06-01 2014-02-18 Chatsworth Products, Inc. Magnetic filler panel for use in airflow control system in electronic equipment enclosure
US9313927B2 (en) 2010-11-08 2016-04-12 Chatsworth Products, Inc. Header panel assembly for preventing air circulation above electronic equipment enclosure
US9585266B2 (en) 2010-11-08 2017-02-28 Chatsworth Products, Inc. Header panel assembly for preventing air circulation above electronic equipment enclosure
US9955616B2 (en) 2010-11-08 2018-04-24 Chatsworth Products, Inc. Header panel assembly for preventing air circulation above electronic equipment enclosure
US9655259B2 (en) 2011-12-09 2017-05-16 Chatsworth Products, Inc. Data processing equipment structure
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WO2013095516A1 (en) 2011-12-22 2013-06-27 Schneider Electric It Corporation Analysis of effect of transient events on temperature in a data center
TWI459893B (zh) * 2012-01-20 2014-11-01 Delta Electronics Inc 機櫃系統及其排風設備
US9839155B2 (en) 2012-05-16 2017-12-05 Panduit Corp. Thermal ducting system
US9007746B2 (en) * 2012-12-12 2015-04-14 Siemens Industry, Inc. Modular draw out fan module with chimney design for cooling components in low voltage switchgear
US10324506B2 (en) 2015-06-05 2019-06-18 Hewlett Packard Enterprise Development Lp Thermal management apparatus
US10761954B2 (en) 2015-10-27 2020-09-01 Hewlett Packard Enterprise Development Lp Sensor detection architecture

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Also Published As

Publication number Publication date
JP2002530901A (ja) 2002-09-17
EP1133906A1 (de) 2001-09-19
EP1133906B1 (de) 2002-10-30
US6198628B1 (en) 2001-03-06
WO2000032023A1 (en) 2000-06-02
DE69903749T2 (de) 2003-07-24
BR9915601A (pt) 2001-08-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee