DE69838737D1 - Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes - Google Patents

Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes

Info

Publication number
DE69838737D1
DE69838737D1 DE69838737T DE69838737T DE69838737D1 DE 69838737 D1 DE69838737 D1 DE 69838737D1 DE 69838737 T DE69838737 T DE 69838737T DE 69838737 T DE69838737 T DE 69838737T DE 69838737 D1 DE69838737 D1 DE 69838737D1
Authority
DE
Germany
Prior art keywords
manufacturing
recording head
jet recording
liquid jet
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69838737T
Other languages
English (en)
Other versions
DE69838737T2 (de
Inventor
Makoto Terui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69838737D1 publication Critical patent/DE69838737D1/de
Application granted granted Critical
Publication of DE69838737T2 publication Critical patent/DE69838737T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14024Assembling head parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1603Production of bubble jet print heads of the front shooter type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Wire Bonding (AREA)
DE69838737T 1997-02-19 1998-02-18 Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes Expired - Fee Related DE69838737T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9050925A JPH10230611A (ja) 1997-02-19 1997-02-19 液体噴射記録ヘッドおよびその製造方法
JP5092597 1997-02-19

Publications (2)

Publication Number Publication Date
DE69838737D1 true DE69838737D1 (de) 2007-12-27
DE69838737T2 DE69838737T2 (de) 2008-10-30

Family

ID=12872395

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69805459T Expired - Fee Related DE69805459T2 (de) 1997-02-19 1998-02-18 Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes und mit diesem Verfahren hergestellter Flüssigkeitsstrahlaufzeichnungskopf
DE69838737T Expired - Fee Related DE69838737T2 (de) 1997-02-19 1998-02-18 Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69805459T Expired - Fee Related DE69805459T2 (de) 1997-02-19 1998-02-18 Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes und mit diesem Verfahren hergestellter Flüssigkeitsstrahlaufzeichnungskopf

Country Status (4)

Country Link
US (1) US6126271A (de)
EP (2) EP0860281B1 (de)
JP (1) JPH10230611A (de)
DE (2) DE69805459T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632386B2 (ja) 2000-12-21 2011-02-16 キヤノン株式会社 液体吐出記録ヘッド
TW528685B (en) * 2001-08-24 2003-04-21 Microjet Technology Co Ltd Pressure regulating method for ink cartridge and the device thereof
KR100462604B1 (ko) 2002-05-20 2004-12-20 삼성전자주식회사 잉크젯 프린트헤드 및 잉크젯 프린트헤드의fpc케이블의 본딩 방법 및 이를 적용한 장치
CN100355573C (zh) * 2002-12-27 2007-12-19 佳能株式会社 用于制造喷墨记录头的基础件
US7323115B2 (en) * 2003-02-13 2008-01-29 Canon Kabushiki Kaisha Substrate processing method and ink jet recording head substrate manufacturing method
JP4641440B2 (ja) * 2005-03-23 2011-03-02 キヤノン株式会社 インクジェット記録ヘッドおよび該インクジェット記録ヘッドの製造方法
JP5173624B2 (ja) * 2008-06-20 2013-04-03 キヤノン株式会社 記録ヘッド及び記録ヘッドの製造方法
JP6512906B2 (ja) 2014-05-30 2019-05-15 キヤノン株式会社 液体吐出ヘッドおよび液体吐出装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1127227A (en) * 1977-10-03 1982-07-06 Ichiro Endo Liquid jet recording process and apparatus therefor
JPS5936879B2 (ja) * 1977-10-14 1984-09-06 キヤノン株式会社 熱転写記録用媒体
US4330787A (en) * 1978-10-31 1982-05-18 Canon Kabushiki Kaisha Liquid jet recording device
US4345262A (en) * 1979-02-19 1982-08-17 Canon Kabushiki Kaisha Ink jet recording method
US4463359A (en) * 1979-04-02 1984-07-31 Canon Kabushiki Kaisha Droplet generating method and apparatus thereof
US4313124A (en) * 1979-05-18 1982-01-26 Canon Kabushiki Kaisha Liquid jet recording process and liquid jet recording head
US4558333A (en) * 1981-07-09 1985-12-10 Canon Kabushiki Kaisha Liquid jet recording head
JPS59123670A (ja) * 1982-12-28 1984-07-17 Canon Inc インクジエツトヘツド
JPS59138461A (ja) * 1983-01-28 1984-08-08 Canon Inc 液体噴射記録装置
JPS6071260A (ja) * 1983-09-28 1985-04-23 Erumu:Kk 記録装置
US4635073A (en) * 1985-11-22 1987-01-06 Hewlett Packard Company Replaceable thermal ink jet component and thermosonic beam bonding process for fabricating same
GB8624513D0 (en) * 1986-10-13 1986-11-19 Microelectronics & Computer Single point bonding method
EP0366405A3 (de) * 1988-10-25 1991-09-04 Hewlett-Packard Company Elektrischer Lötverbinder für eine Tab-Schaltung
JP3120267B2 (ja) * 1994-11-25 2000-12-25 株式会社新川 シングルポイントボンディング方法

Also Published As

Publication number Publication date
EP1162068A2 (de) 2001-12-12
EP1162068B1 (de) 2007-11-14
DE69805459D1 (de) 2002-06-27
US6126271A (en) 2000-10-03
JPH10230611A (ja) 1998-09-02
EP1162068A3 (de) 2002-04-10
EP0860281A1 (de) 1998-08-26
EP0860281B1 (de) 2002-05-22
DE69838737T2 (de) 2008-10-30
DE69805459T2 (de) 2002-11-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee