DE69805459T2 - Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes und mit diesem Verfahren hergestellter Flüssigkeitsstrahlaufzeichnungskopf - Google Patents

Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes und mit diesem Verfahren hergestellter Flüssigkeitsstrahlaufzeichnungskopf

Info

Publication number
DE69805459T2
DE69805459T2 DE69805459T DE69805459T DE69805459T2 DE 69805459 T2 DE69805459 T2 DE 69805459T2 DE 69805459 T DE69805459 T DE 69805459T DE 69805459 T DE69805459 T DE 69805459T DE 69805459 T2 DE69805459 T2 DE 69805459T2
Authority
DE
Germany
Prior art keywords
recording head
jet recording
liquid jet
manufacturing
head made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69805459T
Other languages
English (en)
Other versions
DE69805459D1 (de
Inventor
Makoto Terui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69805459D1 publication Critical patent/DE69805459D1/de
Publication of DE69805459T2 publication Critical patent/DE69805459T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14024—Assembling head parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Wire Bonding (AREA)
DE69805459T 1997-02-19 1998-02-18 Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes und mit diesem Verfahren hergestellter Flüssigkeitsstrahlaufzeichnungskopf Expired - Fee Related DE69805459T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9050925A JPH10230611A (ja) 1997-02-19 1997-02-19 液体噴射記録ヘッドおよびその製造方法

Publications (2)

Publication Number Publication Date
DE69805459D1 DE69805459D1 (de) 2002-06-27
DE69805459T2 true DE69805459T2 (de) 2002-11-07

Family

ID=12872395

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69805459T Expired - Fee Related DE69805459T2 (de) 1997-02-19 1998-02-18 Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes und mit diesem Verfahren hergestellter Flüssigkeitsstrahlaufzeichnungskopf
DE69838737T Expired - Fee Related DE69838737T2 (de) 1997-02-19 1998-02-18 Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69838737T Expired - Fee Related DE69838737T2 (de) 1997-02-19 1998-02-18 Verfahren zum Herstellen eines Flüssigkeitsstrahlaufzeichnungskopfes

Country Status (4)

Country Link
US (1) US6126271A (de)
EP (2) EP1162068B1 (de)
JP (1) JPH10230611A (de)
DE (2) DE69805459T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632386B2 (ja) 2000-12-21 2011-02-16 キヤノン株式会社 液体吐出記録ヘッド
TW528685B (en) * 2001-08-24 2003-04-21 Microjet Technology Co Ltd Pressure regulating method for ink cartridge and the device thereof
KR100462604B1 (ko) 2002-05-20 2004-12-20 삼성전자주식회사 잉크젯 프린트헤드 및 잉크젯 프린트헤드의ｆｐｃ케이블의 본딩 방법 및 이를 적용한 장치
CN100355573C (zh) * 2002-12-27 2007-12-19 佳能株式会社 用于制造喷墨记录头的基础件
US7323115B2 (en) * 2003-02-13 2008-01-29 Canon Kabushiki Kaisha Substrate processing method and ink jet recording head substrate manufacturing method
JP4641440B2 (ja) * 2005-03-23 2011-03-02 キヤノン株式会社 インクジェット記録ヘッドおよび該インクジェット記録ヘッドの製造方法
JP5173624B2 (ja) * 2008-06-20 2013-04-03 キヤノン株式会社 記録ヘッド及び記録ヘッドの製造方法
JP6512906B2 (ja) 2014-05-30 2019-05-15 キヤノン株式会社 液体吐出ヘッドおよび液体吐出装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1127227A (en) * 1977-10-03 1982-07-06 Ichiro Endo Liquid jet recording process and apparatus therefor
JPS5936879B2 (ja) * 1977-10-14 1984-09-06 キヤノン株式会社 熱転写記録用媒体
US4330787A (en) * 1978-10-31 1982-05-18 Canon Kabushiki Kaisha Liquid jet recording device
US4345262A (en) * 1979-02-19 1982-08-17 Canon Kabushiki Kaisha Ink jet recording method
US4463359A (en) * 1979-04-02 1984-07-31 Canon Kabushiki Kaisha Droplet generating method and apparatus thereof
US4313124A (en) * 1979-05-18 1982-01-26 Canon Kabushiki Kaisha Liquid jet recording process and liquid jet recording head
US4558333A (en) * 1981-07-09 1985-12-10 Canon Kabushiki Kaisha Liquid jet recording head
JPS59123670A (ja) * 1982-12-28 1984-07-17 Canon Inc インクジエツトヘツド
JPS59138461A (ja) * 1983-01-28 1984-08-08 Canon Inc 液体噴射記録装置
JPS6071260A (ja) * 1983-09-28 1985-04-23 Erumu:Kk 記録装置
US4635073A (en) * 1985-11-22 1987-01-06 Hewlett Packard Company Replaceable thermal ink jet component and thermosonic beam bonding process for fabricating same
GB8624513D0 (en) * 1986-10-13 1986-11-19 Microelectronics & Computer Single point bonding method
EP0366405A3 (de) * 1988-10-25 1991-09-04 Hewlett-Packard Company Elektrischer Lötverbinder für eine Tab-Schaltung
JP3120267B2 (ja) * 1994-11-25 2000-12-25 株式会社新川 シングルポイントボンディング方法

Also Published As

Publication number Publication date
DE69838737T2 (de) 2008-10-30
EP1162068A2 (de) 2001-12-12
EP0860281A1 (de) 1998-08-26
DE69838737D1 (de) 2007-12-27
EP0860281B1 (de) 2002-05-22
DE69805459D1 (de) 2002-06-27
JPH10230611A (ja) 1998-09-02
US6126271A (en) 2000-10-03
EP1162068B1 (de) 2007-11-14
EP1162068A3 (de) 2002-04-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee