DE69816726D1 - Verfahren und Vorrichtung zur in-situ Endpunktbestimmung und zur Optimierung eines chemisch-mechanischen Polierverfahrens mit Linear Poliergerät - Google Patents
Verfahren und Vorrichtung zur in-situ Endpunktbestimmung und zur Optimierung eines chemisch-mechanischen Polierverfahrens mit Linear PoliergerätInfo
- Publication number
- DE69816726D1 DE69816726D1 DE69816726T DE69816726T DE69816726D1 DE 69816726 D1 DE69816726 D1 DE 69816726D1 DE 69816726 T DE69816726 T DE 69816726T DE 69816726 T DE69816726 T DE 69816726T DE 69816726 D1 DE69816726 D1 DE 69816726D1
- Authority
- DE
- Germany
- Prior art keywords
- belt
- removal rate
- chemical
- end point
- optimizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US869655 | 1997-05-28 | ||
US08/869,655 US6146248A (en) | 1997-05-28 | 1997-05-28 | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69816726D1 true DE69816726D1 (de) | 2003-09-04 |
DE69816726T2 DE69816726T2 (de) | 2004-08-05 |
Family
ID=25354009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69816726T Expired - Fee Related DE69816726T2 (de) | 1997-05-28 | 1998-05-28 | Verfahren und Vorrichtung zur in-situ Endpunktbestimmung und zur Optimierung eines chemisch-mechanischen Polierverfahrens mit Linear Poliergerät |
Country Status (7)
Country | Link |
---|---|
US (2) | US6146248A (de) |
EP (1) | EP0893203B1 (de) |
JP (1) | JPH1177524A (de) |
KR (1) | KR19980087549A (de) |
AT (1) | ATE246071T1 (de) |
DE (1) | DE69816726T2 (de) |
TW (1) | TW440888B (de) |
Families Citing this family (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6676717B1 (en) * | 1995-03-28 | 2004-01-13 | Applied Materials Inc | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
US6537133B1 (en) * | 1995-03-28 | 2003-03-25 | Applied Materials, Inc. | Method for in-situ endpoint detection for chemical mechanical polishing operations |
DE69635816T2 (de) * | 1995-03-28 | 2006-10-12 | Applied Materials, Inc., Santa Clara | Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
US6876454B1 (en) | 1995-03-28 | 2005-04-05 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US6108091A (en) * | 1997-05-28 | 2000-08-22 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US6361646B1 (en) | 1998-06-08 | 2002-03-26 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
US7295314B1 (en) | 1998-07-10 | 2007-11-13 | Nanometrics Incorporated | Metrology/inspection positioning system |
US6320609B1 (en) | 1998-07-10 | 2001-11-20 | Nanometrics Incorporated | System using a polar coordinate stage and continuous image rotation to compensate for stage rotation |
US6908374B2 (en) * | 1998-12-01 | 2005-06-21 | Nutool, Inc. | Chemical mechanical polishing endpoint detection |
US6994607B2 (en) * | 2001-12-28 | 2006-02-07 | Applied Materials, Inc. | Polishing pad with window |
US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US6179709B1 (en) * | 1999-02-04 | 2001-01-30 | Applied Materials, Inc. | In-situ monitoring of linear substrate polishing operations |
KR100435246B1 (ko) * | 1999-03-31 | 2004-06-11 | 가부시키가이샤 니콘 | 연마체, 연마장치, 연마장치의 조정방법, 연마막 두께또는 연마종점의 측정방법, 및 반도체 디바이스의 제조방법 |
JP3334796B2 (ja) * | 1999-04-20 | 2002-10-15 | 日本電気株式会社 | 半導体装置の研磨シミュレーション方法 |
KR20000077146A (ko) * | 1999-05-03 | 2000-12-26 | 조셉 제이. 스위니 | 화학기계적 평탄화 시스템 |
US6406363B1 (en) | 1999-08-31 | 2002-06-18 | Lam Research Corporation | Unsupported chemical mechanical polishing belt |
US20020090819A1 (en) * | 1999-08-31 | 2002-07-11 | Cangshan Xu | Windowless belt and method for improved in-situ wafer monitoring |
US6524164B1 (en) * | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
US6454630B1 (en) * | 1999-09-14 | 2002-09-24 | Applied Materials, Inc. | Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same |
US6358130B1 (en) * | 1999-09-29 | 2002-03-19 | Rodel Holdings, Inc. | Polishing pad |
JP3782629B2 (ja) * | 1999-12-13 | 2006-06-07 | 株式会社荏原製作所 | 膜厚測定方法及び膜厚測定装置 |
JP3854056B2 (ja) * | 1999-12-13 | 2006-12-06 | 株式会社荏原製作所 | 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置 |
KR100718737B1 (ko) | 2000-01-17 | 2007-05-15 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱 장치 |
US6753638B2 (en) | 2000-02-03 | 2004-06-22 | Calient Networks, Inc. | Electrostatic actuator for micromechanical systems |
US6280288B1 (en) * | 2000-02-04 | 2001-08-28 | Norton Company | Process for determining optimum grinding conditions |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US7374477B2 (en) * | 2002-02-06 | 2008-05-20 | Applied Materials, Inc. | Polishing pads useful for endpoint detection in chemical mechanical polishing |
US6685537B1 (en) | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
US6612901B1 (en) * | 2000-06-07 | 2003-09-02 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
US6495464B1 (en) | 2000-06-30 | 2002-12-17 | Lam Research Corporation | Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool |
US6567718B1 (en) * | 2000-07-28 | 2003-05-20 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring consumable performance |
CN1468162A (zh) | 2000-10-06 | 2004-01-14 | 包括填充的半透明区域的抛光垫 | |
US6517413B1 (en) * | 2000-10-25 | 2003-02-11 | Taiwan Semiconductor Manufacturing Company | Method for a copper CMP endpoint detection system |
US20020072296A1 (en) | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
US6572463B1 (en) | 2000-12-27 | 2003-06-03 | Lam Research Corp. | Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same |
WO2002051587A1 (en) * | 2000-12-27 | 2002-07-04 | Lam Research Corporation | Methods for making reinforced wafer polshing pads and apparatuses implementing the same |
US6561889B1 (en) | 2000-12-27 | 2003-05-13 | Lam Research Corporation | Methods for making reinforced wafer polishing pads and apparatuses implementing the same |
US6623331B2 (en) * | 2001-02-16 | 2003-09-23 | Cabot Microelectronics Corporation | Polishing disk with end-point detection port |
WO2002070200A1 (en) * | 2001-03-01 | 2002-09-12 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
US6336841B1 (en) * | 2001-03-29 | 2002-01-08 | Macronix International Co. Ltd. | Method of CMP endpoint detection |
US6612902B1 (en) * | 2001-03-29 | 2003-09-02 | Lam Research Corporation | Method and apparatus for end point triggering with integrated steering |
US6561870B2 (en) * | 2001-03-30 | 2003-05-13 | Lam Research Corporation | Adjustable force applying air platen and spindle system, and methods for using the same |
US6641470B1 (en) | 2001-03-30 | 2003-11-04 | Lam Research Corporation | Apparatus for accurate endpoint detection in supported polishing pads |
US6620031B2 (en) | 2001-04-04 | 2003-09-16 | Lam Research Corporation | Method for optimizing the planarizing length of a polishing pad |
US20020193058A1 (en) * | 2001-06-15 | 2002-12-19 | Carter Stephen P. | Polishing apparatus that provides a window |
ATE313412T1 (de) * | 2001-06-26 | 2006-01-15 | Lam Res Corp | System zur endpunktbestimmung beim chemisch- mechanischen polieren |
US6722249B2 (en) | 2001-11-06 | 2004-04-20 | Rodel Holdings, Inc | Method of fabricating a polishing pad having an optical window |
US6716093B2 (en) * | 2001-12-07 | 2004-04-06 | Lam Research Corporation | Low friction gimbaled substrate holder for CMP apparatus |
US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
US6722946B2 (en) | 2002-01-17 | 2004-04-20 | Nutool, Inc. | Advanced chemical mechanical polishing system with smart endpoint detection |
US6857947B2 (en) | 2002-01-17 | 2005-02-22 | Asm Nutool, Inc | Advanced chemical mechanical polishing system with smart endpoint detection |
US6942546B2 (en) | 2002-01-17 | 2005-09-13 | Asm Nutool, Inc. | Endpoint detection for non-transparent polishing member |
WO2003079428A1 (en) * | 2002-03-13 | 2003-09-25 | Nutool, Inc. | Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers |
US7160173B2 (en) | 2002-04-03 | 2007-01-09 | 3M Innovative Properties Company | Abrasive articles and methods for the manufacture and use of same |
US6939203B2 (en) * | 2002-04-18 | 2005-09-06 | Asm Nutool, Inc. | Fluid bearing slide assembly for workpiece polishing |
US7435165B2 (en) * | 2002-10-28 | 2008-10-14 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US6652388B1 (en) * | 2003-01-29 | 2003-11-25 | Callaway Golf Company | Method and apparatus for assembling a shaft to a golf club head and a golf club having such assembly |
US7089081B2 (en) * | 2003-01-31 | 2006-08-08 | 3M Innovative Properties Company | Modeling an abrasive process to achieve controlled material removal |
US7008295B2 (en) * | 2003-02-04 | 2006-03-07 | Applied Materials Inc. | Substrate monitoring during chemical mechanical polishing |
US6991514B1 (en) | 2003-02-21 | 2006-01-31 | Verity Instruments, Inc. | Optical closed-loop control system for a CMP apparatus and method of manufacture thereof |
US6934595B1 (en) * | 2003-02-26 | 2005-08-23 | National Semiconductor Corp. | Method and system for reducing semiconductor wafer breakage |
US6930782B1 (en) | 2003-03-28 | 2005-08-16 | Lam Research Corporation | End point detection with imaging matching in semiconductor processing |
WO2004090502A2 (en) * | 2003-04-01 | 2004-10-21 | Filmetrics, Inc. | Whole-substrate spectral imaging system for cmp |
KR100541545B1 (ko) * | 2003-06-16 | 2006-01-11 | 삼성전자주식회사 | 화학기계적 연마 장비의 연마 테이블 |
KR100506942B1 (ko) * | 2003-09-03 | 2005-08-05 | 삼성전자주식회사 | 화학적 기계적 연마장치 |
US20050173259A1 (en) * | 2004-02-06 | 2005-08-11 | Applied Materials, Inc. | Endpoint system for electro-chemical mechanical polishing |
US7654885B2 (en) * | 2003-10-03 | 2010-02-02 | Applied Materials, Inc. | Multi-layer polishing pad |
US8066552B2 (en) | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US7059936B2 (en) * | 2004-03-23 | 2006-06-13 | Cabot Microelectronics Corporation | Low surface energy CMP pad |
US6955588B1 (en) | 2004-03-31 | 2005-10-18 | Lam Research Corporation | Method of and platen for controlling removal rate characteristics in chemical mechanical planarization |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US20070197147A1 (en) * | 2006-02-15 | 2007-08-23 | Applied Materials, Inc. | Polishing system with spiral-grooved subpad |
US7179151B1 (en) * | 2006-03-27 | 2007-02-20 | Freescale Semiconductor, Inc. | Polishing pad, a polishing apparatus, and a process for using the polishing pad |
US7497763B2 (en) * | 2006-03-27 | 2009-03-03 | Freescale Semiconductor, Inc. | Polishing pad, a polishing apparatus, and a process for using the polishing pad |
JP5006883B2 (ja) * | 2006-10-06 | 2012-08-22 | 株式会社荏原製作所 | 加工終点検知方法および加工装置 |
US20090041412A1 (en) * | 2007-08-07 | 2009-02-12 | Jeffrey Dean Danley | Laser erosion processes for fiber optic ferrules |
CN101450449B (zh) * | 2007-11-30 | 2010-09-29 | 上海华虹Nec电子有限公司 | Cmp工艺条件调整控制方法 |
SG190249A1 (en) * | 2010-11-18 | 2013-06-28 | Cabot Microelectronics Corp | Polishing pad comprising transmissive region |
US9425109B2 (en) | 2014-05-30 | 2016-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Planarization method, method for polishing wafer, and CMP system |
CN115365962B (zh) * | 2022-10-27 | 2023-05-16 | 江油星联电子科技有限公司 | 一种电路板加工用磨板装置 |
Family Cites Families (76)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3841031A (en) * | 1970-10-21 | 1974-10-15 | Monsanto Co | Process for polishing thin elements |
US4193226A (en) * | 1977-09-21 | 1980-03-18 | Kayex Corporation | Polishing apparatus |
US4308586A (en) * | 1980-05-02 | 1981-12-29 | Nanometrics, Incorporated | Method for the precise determination of photoresist exposure time |
US4516855A (en) * | 1981-04-03 | 1985-05-14 | International Business Machines Corporation | Method and apparatus for determining the polarization state of a light wave field |
US4462860A (en) * | 1982-05-24 | 1984-07-31 | At&T Bell Laboratories | End point detection |
DE3419463C1 (de) * | 1984-05-24 | 1985-09-12 | Sagax Instrument AB, Sundbyberg | Vorrichtung zur Erfassung von Stoffeigenschaften von Probenoberflaechen |
US4653924A (en) * | 1984-06-12 | 1987-03-31 | Victor Company Of Japan, Ltd. | Rotating analyzer type ellipsometer |
US4710030A (en) * | 1985-05-17 | 1987-12-01 | Bw Brown University Research Foundation | Optical generator and detector of stress pulses |
US4681450A (en) * | 1985-06-21 | 1987-07-21 | Research Corporation | Photodetector arrangement for measuring the state of polarization of light |
US4927432A (en) * | 1986-03-25 | 1990-05-22 | Rodel, Inc. | Pad material for grinding, lapping and polishing |
US4776695A (en) * | 1986-05-16 | 1988-10-11 | Prometrix Corporation | High accuracy film thickness measurement system |
US4811522A (en) * | 1987-03-23 | 1989-03-14 | Gill Jr Gerald L | Counterbalanced polishing apparatus |
US5061072A (en) * | 1988-01-11 | 1991-10-29 | C/O The Secretary, Comonwealth Of Australia Department Of Defence | Differential ellipsometer |
US4844617A (en) * | 1988-01-20 | 1989-07-04 | Tencor Instruments | Confocal measuring microscope with automatic focusing |
US4793895A (en) * | 1988-01-25 | 1988-12-27 | Ibm Corporation | In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection |
JPH01193166A (ja) * | 1988-01-28 | 1989-08-03 | Showa Denko Kk | 半導体ウェハ鏡面研磨用パッド |
US4957368A (en) * | 1989-03-16 | 1990-09-18 | Photoacoustic Technology, Inc. | Apparatus and process for performing ellipsometric measurements of surfaces |
US5042951A (en) * | 1989-09-19 | 1991-08-27 | Therma-Wave, Inc. | High resolution ellipsometric apparatus |
US5166752A (en) * | 1990-01-11 | 1992-11-24 | Rudolph Research Corporation | Simultaneous multiple angle/multiple wavelength ellipsometer and method |
US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5177908A (en) * | 1990-01-22 | 1993-01-12 | Micron Technology, Inc. | Polishing pad |
JPH03234467A (ja) | 1990-02-05 | 1991-10-18 | Canon Inc | スタンパの金型取付面の研磨方法およびその研磨機 |
US5067805A (en) * | 1990-02-27 | 1991-11-26 | Prometrix Corporation | Confocal scanning optical microscope |
US5081421A (en) * | 1990-05-01 | 1992-01-14 | At&T Bell Laboratories | In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection |
US5213655A (en) * | 1990-05-16 | 1993-05-25 | International Business Machines Corporation | Device and method for detecting an end point in polishing operation |
US5081796A (en) * | 1990-08-06 | 1992-01-21 | Micron Technology, Inc. | Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer |
US5036015A (en) * | 1990-09-24 | 1991-07-30 | Micron Technology, Inc. | Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers |
IT1243537B (it) * | 1990-10-19 | 1994-06-16 | Melchiorre Off Mecc | Metodo e dispositivo per il controllo al termine di ogni ciclo (post process) dei pezzi lavorati in una macchina lappatrice a doppio plateau |
US5290396A (en) * | 1991-06-06 | 1994-03-01 | Lsi Logic Corporation | Trench planarization techniques |
US5197999A (en) * | 1991-09-30 | 1993-03-30 | National Semiconductor Corporation | Polishing pad for planarization |
US5240552A (en) * | 1991-12-11 | 1993-08-31 | Micron Technology, Inc. | Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection |
US5308438A (en) * | 1992-01-30 | 1994-05-03 | International Business Machines Corporation | Endpoint detection apparatus and method for chemical/mechanical polishing |
US5329732A (en) * | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
US5486701A (en) * | 1992-06-16 | 1996-01-23 | Prometrix Corporation | Method and apparatus for measuring reflectance in two wavelength bands to enable determination of thin film thickness |
US5265378A (en) * | 1992-07-10 | 1993-11-30 | Lsi Logic Corporation | Detecting the endpoint of chem-mech polishing and resulting semiconductor device |
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5433650A (en) * | 1993-05-03 | 1995-07-18 | Motorola, Inc. | Method for polishing a substrate |
US5337015A (en) * | 1993-06-14 | 1994-08-09 | International Business Machines Corporation | In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage |
US5554064A (en) * | 1993-08-06 | 1996-09-10 | Intel Corporation | Orbital motion chemical-mechanical polishing apparatus and method of fabrication |
JP3326443B2 (ja) * | 1993-08-10 | 2002-09-24 | 株式会社ニコン | ウエハ研磨方法及びその装置 |
US5658183A (en) * | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
US5700180A (en) | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
US5486129A (en) * | 1993-08-25 | 1996-01-23 | Micron Technology, Inc. | System and method for real-time control of semiconductor a wafer polishing, and a polishing head |
IL107549A (en) * | 1993-11-09 | 1996-01-31 | Nova Measuring Instr Ltd | Device for measuring the thickness of thin films |
US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
WO1995018353A1 (en) * | 1993-12-28 | 1995-07-06 | Tang Wallace T Y | Method and apparatus for monitoring thin films |
US5413941A (en) * | 1994-01-06 | 1995-05-09 | Micron Technology, Inc. | Optical end point detection methods in semiconductor planarizing polishing processes |
US5439551A (en) * | 1994-03-02 | 1995-08-08 | Micron Technology, Inc. | Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes |
US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
JP3313505B2 (ja) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
US5461007A (en) * | 1994-06-02 | 1995-10-24 | Motorola, Inc. | Process for polishing and analyzing a layer over a patterned semiconductor substrate |
JPH08195363A (ja) * | 1994-10-11 | 1996-07-30 | Ontrak Syst Inc | 流体軸受を有する半導体ウェーハポリシング装置 |
US5593344A (en) * | 1994-10-11 | 1997-01-14 | Ontrak Systems, Inc. | Wafer polishing machine with fluid bearings and drive systems |
US5643044A (en) * | 1994-11-01 | 1997-07-01 | Lund; Douglas E. | Automatic chemical and mechanical polishing system for semiconductor wafers |
US5595526A (en) * | 1994-11-30 | 1997-01-21 | Intel Corporation | Method and apparatus for endpoint detection in a chemical/mechanical process for polishing a substrate |
JPH08240413A (ja) * | 1995-01-06 | 1996-09-17 | Toshiba Corp | 膜厚測定装置及びポリシング装置 |
DE69635816T2 (de) * | 1995-03-28 | 2006-10-12 | Applied Materials, Inc., Santa Clara | Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5908530A (en) * | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
US5816891A (en) * | 1995-06-06 | 1998-10-06 | Advanced Micro Devices, Inc. | Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput |
US5838447A (en) * | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
JP3601910B2 (ja) * | 1995-07-20 | 2004-12-15 | 株式会社荏原製作所 | ポリッシング装置及び方法 |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
US5597442A (en) * | 1995-10-16 | 1997-01-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Chemical/mechanical planarization (CMP) endpoint method using measurement of polishing pad temperature |
US5609517A (en) * | 1995-11-20 | 1997-03-11 | International Business Machines Corporation | Composite polishing pad |
US5961372A (en) | 1995-12-05 | 1999-10-05 | Applied Materials, Inc. | Substrate belt polisher |
US5762536A (en) * | 1996-04-26 | 1998-06-09 | Lam Research Corporation | Sensors for a linear polisher |
US5916012A (en) | 1996-04-26 | 1999-06-29 | Lam Research Corporation | Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher |
US5800248A (en) * | 1996-04-26 | 1998-09-01 | Ontrak Systems Inc. | Control of chemical-mechanical polishing rate across a substrate surface |
EP0806266A3 (de) * | 1996-05-09 | 1998-12-09 | Canon Kabushiki Kaisha | Polierverfahren und -vorrichtung zur Verwendung desselben |
US6594542B1 (en) * | 1996-10-04 | 2003-07-15 | Applied Materials, Inc. | Method and system for controlling chemical mechanical polishing thickness removal |
US5722877A (en) | 1996-10-11 | 1998-03-03 | Lam Research Corporation | Technique for improving within-wafer non-uniformity of material removal for performing CMP |
JP3454658B2 (ja) | 1997-02-03 | 2003-10-06 | 大日本スクリーン製造株式会社 | 研磨処理モニター装置 |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US5934974A (en) | 1997-11-05 | 1999-08-10 | Aplex Group | In-situ monitoring of polishing pad wear |
US6018091A (en) * | 1998-06-08 | 2000-01-25 | Quantum Marketing Corporation | Methods for thermally degrading unwanted substances using particular metal compositions |
-
1997
- 1997-05-28 US US08/869,655 patent/US6146248A/en not_active Expired - Fee Related
-
1998
- 1998-05-28 JP JP18677498A patent/JPH1177524A/ja active Pending
- 1998-05-28 DE DE69816726T patent/DE69816726T2/de not_active Expired - Fee Related
- 1998-05-28 EP EP98304242A patent/EP0893203B1/de not_active Expired - Lifetime
- 1998-05-28 KR KR1019980020318A patent/KR19980087549A/ko not_active Application Discontinuation
- 1998-05-28 AT AT98304242T patent/ATE246071T1/de not_active IP Right Cessation
- 1998-11-24 TW TW087108349A patent/TW440888B/zh not_active IP Right Cessation
-
2000
- 2000-03-16 US US09/527,171 patent/US6261155B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6146248A (en) | 2000-11-14 |
KR19980087549A (ko) | 1998-12-05 |
EP0893203A2 (de) | 1999-01-27 |
JPH1177524A (ja) | 1999-03-23 |
EP0893203A3 (de) | 2000-01-12 |
TW440888B (en) | 2001-06-16 |
US6261155B1 (en) | 2001-07-17 |
ATE246071T1 (de) | 2003-08-15 |
DE69816726T2 (de) | 2004-08-05 |
EP0893203B1 (de) | 2003-07-30 |
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