DE69808415T2 - Elektroplattierung von nickel-phosphor-legierungsbeschichtungen - Google Patents

Elektroplattierung von nickel-phosphor-legierungsbeschichtungen

Info

Publication number
DE69808415T2
DE69808415T2 DE69808415T DE69808415T DE69808415T2 DE 69808415 T2 DE69808415 T2 DE 69808415T2 DE 69808415 T DE69808415 T DE 69808415T DE 69808415 T DE69808415 T DE 69808415T DE 69808415 T2 DE69808415 T2 DE 69808415T2
Authority
DE
Germany
Prior art keywords
phosphorus alloy
nickel phosphorus
alloy coatings
electroplating nickel
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69808415T
Other languages
English (en)
Other versions
DE69808415D1 (de
Inventor
Michael Martyak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of DE69808415D1 publication Critical patent/DE69808415D1/de
Publication of DE69808415T2 publication Critical patent/DE69808415T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/562Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Paints Or Removers (AREA)
DE69808415T 1997-07-09 1998-07-08 Elektroplattierung von nickel-phosphor-legierungsbeschichtungen Expired - Lifetime DE69808415T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5203997P 1997-07-09 1997-07-09
US09/078,419 US6099624A (en) 1997-07-09 1998-05-14 Nickel-phosphorus alloy coatings
PCT/IB1998/001152 WO1999002765A1 (en) 1997-07-09 1998-07-08 Electroplating of nickel-phosphorus alloys coatings

Publications (2)

Publication Number Publication Date
DE69808415D1 DE69808415D1 (de) 2002-11-07
DE69808415T2 true DE69808415T2 (de) 2003-06-18

Family

ID=26730092

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69808415T Expired - Lifetime DE69808415T2 (de) 1997-07-09 1998-07-08 Elektroplattierung von nickel-phosphor-legierungsbeschichtungen

Country Status (7)

Country Link
US (1) US6099624A (de)
EP (1) EP0925388B1 (de)
JP (1) JP2001500195A (de)
BR (1) BR9806020A (de)
DE (1) DE69808415T2 (de)
ES (1) ES2182338T3 (de)
WO (1) WO1999002765A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10207109B4 (de) 2001-02-21 2018-12-27 Kyocera Corp. Keramische Leiterplatte

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US6475725B1 (en) * 1997-06-20 2002-11-05 Baxter Aktiengesellschaft Recombinant cell clones having increased stability and methods of making and using the same
US6406611B1 (en) * 1999-12-08 2002-06-18 University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
EP1237058A1 (de) * 2001-02-28 2002-09-04 Eta SA Fabriques d'Ebauches Benutzung einer nichtmagnetischen Schicht zum Abdecken von Teilen in einem Uhrengangwerk
US6606983B2 (en) 2001-09-18 2003-08-19 Federal-Mogul World Wide, Inc. Ferrous pistons for diesel engines having EGR coating
US6800121B2 (en) * 2002-06-18 2004-10-05 Atotech Deutschland Gmbh Electroless nickel plating solutions
US6982030B2 (en) * 2002-11-27 2006-01-03 Technic, Inc. Reduction of surface oxidation during electroplating
US20050123681A1 (en) * 2003-12-08 2005-06-09 Jar-Wha Lee Method and apparatus for the treatment of individual filaments of a multifilament yarn
US8137752B2 (en) * 2003-12-08 2012-03-20 Syscom Advanced Materials, Inc. Method and apparatus for the treatment of individual filaments of a multifilament yarn
US7235165B2 (en) * 2004-04-02 2007-06-26 Richard Lacey Electroplating solution and method for electroplating
SG118264A1 (en) * 2004-06-29 2006-01-27 Sony Corp A magnetic material and a MEMS device using the magnetic material
US20060040126A1 (en) * 2004-08-18 2006-02-23 Richardson Rick A Electrolytic alloys with co-deposited particulate matter
CN100441749C (zh) * 2004-10-29 2008-12-10 中国科学院兰州化学物理研究所 耐磨镍磷功能梯度镀层的制备方法
JP2006152378A (ja) * 2004-11-30 2006-06-15 Fujitsu Ltd NiP非磁性めっき膜の製造方法およびこれを用いた磁気ヘッドの製造方法
WO2006113816A2 (en) * 2005-04-20 2006-10-26 Technic, Inc. Underlayer for reducing surface oxidation of plated deposits
CN101688321A (zh) * 2005-08-29 2010-03-31 京瓷株式会社 金属膜及其制法、层叠型电子部件制法及层叠型电子部件
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
TW200743681A (en) * 2006-05-19 2007-12-01 Ching Ho Ni-Co-P electroplating composition, electroplating solution and electroplating method using the same
ITMI20090880A1 (it) * 2009-05-19 2010-11-20 Industrie De Nora Spa Catodo per processi elettrolitici
US20110162751A1 (en) * 2009-12-23 2011-07-07 Exxonmobil Research And Engineering Company Protective Coatings for Petrochemical and Chemical Industry Equipment and Devices
WO2011094441A1 (en) * 2010-01-27 2011-08-04 Rubin Jerry A Coated surgical and dental implements and implants with superior heat dissipation and toughness
DE102010035661A1 (de) 2010-08-27 2012-03-01 Ipt International Plating Technologies Gmbh Elektrolytisches Bad für die galvanische Abscheidung und Verfahren zu dessen Herstellung
WO2012092505A1 (en) 2010-12-29 2012-07-05 Syscom Advanced Materials Metal and metallized fiber hybrid wire
US20130153432A1 (en) * 2011-11-02 2013-06-20 Robert Jones Amorphous Nickel Phosphorus Alloys for Oil and Gas
CN203770066U (zh) * 2013-06-28 2014-08-13 Lg电子株式会社 线性压缩机
CN103668369A (zh) * 2014-01-08 2014-03-26 苏州道蒙恩电子科技有限公司 一种提高金属件耐腐蚀性的电镀方法
PL3147389T3 (pl) 2015-09-25 2019-09-30 Macdermid Enthone Gmbh Wielokorozyjny system zabezpieczający dla części dekoracyjnych z wykończeniem chromowym
US20180363159A1 (en) * 2015-12-18 2018-12-20 Rolex Sa Method for producing a timepiece component
JP6405553B2 (ja) * 2015-12-18 2018-10-17 石原ケミカル株式会社 不導態形成性の軽金属上への導電性皮膜形成方法
JP6781878B2 (ja) * 2016-09-15 2020-11-11 石原ケミカル株式会社 シリコン基板上への導電性皮膜形成方法
CZ307604B6 (cs) * 2017-09-07 2019-01-02 ÄŚeskĂ© vysokĂ© uÄŤenĂ­ technickĂ© v Praze Způsob vytvoření kompozitní vrstvy na povrchu materiálu a kompozitní vrstva
DE102018133532A1 (de) * 2018-12-21 2020-06-25 Maschinenfabrik Kaspar Walter Gmbh & Co Kg Elektrolyt und Verfahren zur Herstellung von Chromschichten
CN112853415B (zh) * 2020-12-31 2022-09-02 江门市瑞期精细化学工程有限公司 一种镍磷合金电镀液及其应用

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US4411961A (en) * 1981-09-28 1983-10-25 Occidental Chemical Corporation Composite electroplated article and process
JPS5953700A (ja) * 1982-09-20 1984-03-28 Toshiba Corp 耐摩耗性が優れた被膜及びその形成方法
US4470886A (en) * 1983-01-04 1984-09-11 Omi International Corporation Gold alloy electroplating bath and process
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
CS240582B1 (en) * 1984-02-08 1986-02-13 Vladimir Holpuch Electrolytic aqueous bath for nickel-phosphorus alloy deposition
US4699695A (en) * 1984-07-20 1987-10-13 Rieger Franz Metallveredelung Nickel plating bath
RO92081B1 (ro) * 1985-05-31 1987-07-31 Institutul De Cercetare Stiintifica Si Inginerie Tehnologica Pentru Industria Constructiilor De Masini Procedeu pentru depunerea nichelului, aliajelor de nichel-fier sau nichel-fosfor
JP2810245B2 (ja) * 1991-01-25 1998-10-15 日本鋼管株式会社 プレス成形性および燐酸塩処理性に優れた冷延鋼板およびその製造方法
JP3498919B2 (ja) * 1993-05-14 2004-02-23 清川メッキ工業株式会社 ヒューズ機能を有する金属皮膜抵抗器とその製造方法
US5944879A (en) * 1997-02-19 1999-08-31 Elf Atochem North America, Inc. Nickel hypophosphite solutions containing increased nickel concentration

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10207109B4 (de) 2001-02-21 2018-12-27 Kyocera Corp. Keramische Leiterplatte

Also Published As

Publication number Publication date
EP0925388A1 (de) 1999-06-30
ES2182338T3 (es) 2003-03-01
US6099624A (en) 2000-08-08
JP2001500195A (ja) 2001-01-09
BR9806020A (pt) 1999-10-13
EP0925388B1 (de) 2002-10-02
WO1999002765A1 (en) 1999-01-21
DE69808415D1 (de) 2002-11-07

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