DE69807567T2 - Belaganordnung für thermische Zwischenlage - Google Patents

Belaganordnung für thermische Zwischenlage

Info

Publication number
DE69807567T2
DE69807567T2 DE69807567T DE69807567T DE69807567T2 DE 69807567 T2 DE69807567 T2 DE 69807567T2 DE 69807567 T DE69807567 T DE 69807567T DE 69807567 T DE69807567 T DE 69807567T DE 69807567 T2 DE69807567 T2 DE 69807567T2
Authority
DE
Germany
Prior art keywords
thermal
flexible
elastic material
electronic component
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69807567T
Other languages
German (de)
English (en)
Other versions
DE69807567D1 (de
Inventor
Mark Weixel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69807567D1 publication Critical patent/DE69807567D1/de
Application granted granted Critical
Publication of DE69807567T2 publication Critical patent/DE69807567T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE69807567T 1997-04-28 1998-04-28 Belaganordnung für thermische Zwischenlage Expired - Fee Related DE69807567T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/847,860 US6037659A (en) 1997-04-28 1997-04-28 Composite thermal interface pad

Publications (2)

Publication Number Publication Date
DE69807567D1 DE69807567D1 (de) 2002-10-10
DE69807567T2 true DE69807567T2 (de) 2003-04-30

Family

ID=25301675

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69807567T Expired - Fee Related DE69807567T2 (de) 1997-04-28 1998-04-28 Belaganordnung für thermische Zwischenlage

Country Status (4)

Country Link
US (1) US6037659A (https=)
EP (1) EP0875933B1 (https=)
JP (1) JPH10308485A (https=)
DE (1) DE69807567T2 (https=)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3032505B1 (ja) * 1998-10-19 2000-04-17 北川工業株式会社 ヒートシンク
JP4101391B2 (ja) * 1999-03-31 2008-06-18 電気化学工業株式会社 電子部品の放熱部材
DE19924289A1 (de) * 1999-05-27 2000-12-07 Siemens Ag Elektronisches Schaltungsmodul mit flexibler Zwischenschicht zwischen elektronischen Bauelementen und einem Kühlkörper
US6847529B2 (en) 1999-07-15 2005-01-25 Incep Technologies, Inc. Ultra-low impedance power interconnection system for electronic packages
US6801431B2 (en) * 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US20030214800A1 (en) * 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6947293B2 (en) * 1999-07-15 2005-09-20 Incep Technologies Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6623279B2 (en) 1999-07-15 2003-09-23 Incep Technologies, Inc. Separable power delivery connector
US7369411B2 (en) * 2000-02-25 2008-05-06 Thermagon, Inc. Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink
JP2002134968A (ja) 2000-10-25 2002-05-10 Sony Computer Entertainment Inc 回路基板ユニット、電子機器
US7167379B2 (en) 2001-02-16 2007-01-23 Dibene Ii Joseph T Micro-spring interconnect systems for low impedance high power applications
US6515861B1 (en) * 2001-04-02 2003-02-04 Advanced Micro Devices, Inc. Method and apparatus for shielding electromagnetic emissions from an integrated circuit
US6672378B2 (en) * 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same
GB0118572D0 (en) * 2001-07-31 2001-09-19 Stonewood Electronics Ltd Stone cold
US7176506B2 (en) * 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US6845013B2 (en) * 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
US7115817B2 (en) * 2002-09-18 2006-10-03 Sun Microsystems, Inc. Heat sink and electromagnetic interference reduction device
US7754537B2 (en) * 2003-02-25 2010-07-13 Tessera, Inc. Manufacture of mountable capped chips
US6972480B2 (en) 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
DE20309244U1 (de) * 2003-06-16 2003-08-14 Uniwill Computer Corp., Chung Li, Tao Yuan Struktur zur Abschottung eines thermischen Zwischenmaterials
JP2007528120A (ja) 2003-07-03 2007-10-04 テッセラ テクノロジーズ ハンガリー コルラートルト フェレロェセーギュー タールシャシャーグ 集積回路装置をパッケージングする方法及び装置
US20050095835A1 (en) * 2003-09-26 2005-05-05 Tessera, Inc. Structure and method of making capped chips having vertical interconnects
US20050067681A1 (en) * 2003-09-26 2005-03-31 Tessera, Inc. Package having integral lens and wafer-scale fabrication method therefor
US20050139984A1 (en) * 2003-12-19 2005-06-30 Tessera, Inc. Package element and packaged chip having severable electrically conductive ties
US20050133907A1 (en) * 2003-12-23 2005-06-23 Hildner Thomas R. Mechanism for maintaining consistent thermal interface layer in an integrated circuit assembly
US7164587B1 (en) 2004-01-14 2007-01-16 Sun Microsystems, Inc. Integral heatsink grounding arrangement
US20050189622A1 (en) * 2004-03-01 2005-09-01 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
JP3756168B2 (ja) * 2004-03-19 2006-03-15 株式会社ソニー・コンピュータエンタテインメント 回路の発熱制御方法、装置およびシステム
US20050238835A1 (en) * 2004-04-24 2005-10-27 Chien-Min Sung Graphite composite thermal sealants and associated methods
US8143095B2 (en) * 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
US7511359B2 (en) * 2005-12-29 2009-03-31 Intel Corporation Dual die package with high-speed interconnect
US7936062B2 (en) * 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US20070190747A1 (en) * 2006-01-23 2007-08-16 Tessera Technologies Hungary Kft. Wafer level packaging to lidded chips
US20080002460A1 (en) * 2006-03-01 2008-01-03 Tessera, Inc. Structure and method of making lidded chips
US20080002384A1 (en) * 2006-06-30 2008-01-03 Motorola, Inc. Apparatus for providing radio frequency shielding and heat dissipation for electronic components
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
US8545987B2 (en) * 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8445102B2 (en) * 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US20090127701A1 (en) * 2007-11-15 2009-05-21 Nitin Goel Thermal attach for electronic device cooling
US20090152713A1 (en) * 2007-12-18 2009-06-18 Ioan Sauciuc Integrated circuit assembly including thermal interface material comprised of oil or wax
WO2010142333A1 (en) * 2009-06-10 2010-12-16 Robert Bosch Gmbh Cooling arrangement and method for assembling the cooling arrangement
US8582297B2 (en) 2011-02-03 2013-11-12 International Business Machines Corporation Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics
DE102011005669A1 (de) * 2011-03-17 2012-09-20 Robert Bosch Gmbh Wärmeleitfolie für die Entwärmung und Fixierung elektronischer Bauelemente
CA2789976A1 (en) 2011-09-12 2013-03-12 Rab Lighting, Inc. Light fixture with airflow passage separating driver and emitter
US20150129189A1 (en) * 2012-02-09 2015-05-14 Nokia Solutions And Networks Oy Method and Apparatus for Reducing the Mechanical Stress when Mounting Assemblies with Thermal Pads
US9658000B2 (en) * 2012-02-15 2017-05-23 Abaco Systems, Inc. Flexible metallic heat connector
WO2016056286A1 (ja) * 2014-10-10 2016-04-14 信越化学工業株式会社 熱伝導性シリコーングリースを用いた半導体装置
US9781819B2 (en) * 2015-07-31 2017-10-03 Laird Technologies, Inc. Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
EP3281994A1 (en) * 2016-08-09 2018-02-14 Tianjin Laird Technologies Limited Thermal interface material assemblies and systems and methods for controllably changing surface tack of thermal interface materials
US10319609B2 (en) 2017-06-21 2019-06-11 International Business Machines Corporation Adhesive-bonded thermal interface structures
EP3506345A1 (en) * 2017-12-26 2019-07-03 Joinset Co., Ltd Thermally conductive member
CN113745176A (zh) * 2021-07-14 2021-12-03 日月光半导体制造股份有限公司 半导体器件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4000509A (en) * 1975-03-31 1976-12-28 International Business Machines Corporation High density air cooled wafer package having improved thermal dissipation
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
DE340959T1 (de) * 1988-05-06 1990-08-16 Digital Equipment Corp., Maynard, Mass. Schaltungschipspackung zum schuetzen gegen elektromagnetische interferenzen, elektrostatische entladungen und thermische und mechanische spannungen.
CA1304830C (en) * 1988-09-20 1992-07-07 Toshifumi Sano Cooling structure
JPH03116859A (ja) * 1989-09-29 1991-05-17 Toshiba Lighting & Technol Corp 混成集積回路装置
US5053853A (en) * 1990-05-08 1991-10-01 International Business Machines Corporation Modular electronic packaging system
DE4019091A1 (de) * 1990-06-15 1991-12-19 Battelle Institut E V Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung
US5378924A (en) * 1992-09-10 1995-01-03 Vlsi Technology, Inc. Apparatus for thermally coupling a heat sink to a lead frame
JP2974552B2 (ja) * 1993-06-14 1999-11-10 株式会社東芝 半導体装置
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
US5604978A (en) * 1994-12-05 1997-02-25 International Business Machines Corporation Method for cooling of chips using a plurality of materials
US6016006A (en) * 1996-06-24 2000-01-18 Intel Corporation Thermal grease insertion and retention

Also Published As

Publication number Publication date
EP0875933A2 (en) 1998-11-04
DE69807567D1 (de) 2002-10-10
JPH10308485A (ja) 1998-11-17
US6037659A (en) 2000-03-14
EP0875933B1 (en) 2002-09-04
EP0875933A3 (en) 1999-01-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8339 Ceased/non-payment of the annual fee