DE69806007T2 - Zusammensetzung zum vermeiden des kriechens eines weichlötflussmittels - Google Patents
Zusammensetzung zum vermeiden des kriechens eines weichlötflussmittelsInfo
- Publication number
- DE69806007T2 DE69806007T2 DE69806007T DE69806007T DE69806007T2 DE 69806007 T2 DE69806007 T2 DE 69806007T2 DE 69806007 T DE69806007 T DE 69806007T DE 69806007 T DE69806007 T DE 69806007T DE 69806007 T2 DE69806007 T2 DE 69806007T2
- Authority
- DE
- Germany
- Prior art keywords
- cream
- avoiding
- composition
- soft solder
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/224—Anti-weld compositions; Braze stop-off compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19021797A JPH1133708A (ja) | 1997-07-15 | 1997-07-15 | 半田用フラックス這い上がり防止剤、該防止剤組成物およびその用途 |
JP25098997 | 1997-09-16 | ||
PCT/JP1998/003152 WO1999003637A1 (en) | 1997-07-15 | 1998-07-14 | Composition for preventing creeping of a flux for soldering |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69806007D1 DE69806007D1 (de) | 2002-07-18 |
DE69806007T2 true DE69806007T2 (de) | 2002-11-28 |
Family
ID=26505943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69806007T Expired - Fee Related DE69806007T2 (de) | 1997-07-15 | 1998-07-14 | Zusammensetzung zum vermeiden des kriechens eines weichlötflussmittels |
Country Status (6)
Country | Link |
---|---|
US (1) | US6283360B1 (de) |
EP (1) | EP0996523B1 (de) |
CN (1) | CN1140378C (de) |
DE (1) | DE69806007T2 (de) |
MY (1) | MY129177A (de) |
WO (1) | WO1999003637A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4343354B2 (ja) * | 1999-11-02 | 2009-10-14 | Agcセイミケミカル株式会社 | 半田用フラックス這い上がり防止剤組成物とその用途 |
US6904673B1 (en) | 2002-09-24 | 2005-06-14 | International Business Machines Corporation | Control of flux by ink stop line in chip joining |
WO2004033579A1 (ja) * | 2002-10-10 | 2004-04-22 | Seimi Chemical Co., Ltd. | オイルバリア組成物 |
WO2009031262A1 (ja) * | 2007-09-03 | 2009-03-12 | Panasonic Corporation | 配線基板 |
JP5295131B2 (ja) * | 2008-01-18 | 2013-09-18 | Agcセイミケミカル株式会社 | はんだ用フラックス這い上がり防止組成物、該組成物を被覆したはんだ用電子部材、該部材のはんだ付け方法および電気製品 |
CN101811235B (zh) * | 2010-05-07 | 2012-11-28 | 常州大学 | 一种能够消除锡珠的用于波峰焊用助焊剂的添加剂 |
US8070046B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Amine flux composition and method of soldering |
US8070045B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable amine flux composition and method of soldering |
US11837415B2 (en) | 2021-01-15 | 2023-12-05 | KYOCERA AVX Components Corpration | Solid electrolytic capacitor |
CN114769941A (zh) * | 2022-04-27 | 2022-07-22 | 浙江亚通焊材有限公司 | 一种水溶性铝硅焊膏及其制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3869465A (en) * | 1971-03-29 | 1975-03-04 | Hoechst Ag | Dispersions of polymer fluorine-containing acrylic acid derivatives |
JPS62149784A (ja) * | 1979-03-01 | 1987-07-03 | Daikin Ind Ltd | 付着防止剤ならびにその用途 |
DE3403880A1 (de) * | 1984-02-04 | 1985-08-08 | Hoechst Ag, 6230 Frankfurt | Fluoralkylgruppen enthaltende salze von ss-alkylaminopropionsaeureestern, verfahren zu ihrer synthese und deren verwendung zur herstellung waessriger, fluoralkylgruppenhaltiger polyacrylatdispersionen |
EP0191882B1 (de) * | 1985-02-21 | 1989-06-07 | Asahi Glass Company Ltd. | Verfahren zum Weichlöten von elektrischen Bauteilen |
US4615479A (en) | 1985-02-21 | 1986-10-07 | Asahi Glass Company Ltd. | Method for soldering an electrical product |
JPH01137694A (ja) * | 1987-11-25 | 1989-05-30 | Alps Electric Co Ltd | ソルダーレジスト |
JP2595275B2 (ja) * | 1987-12-28 | 1997-04-02 | 株式会社ネオス | 付着防止剤 |
JPH05175642A (ja) * | 1991-12-26 | 1993-07-13 | Seiko Epson Corp | ハンダ付けプリント基板用水系フラックスニジミ揚がり防止剤 |
US5725789A (en) * | 1995-03-31 | 1998-03-10 | Minnesota Mining And Manufacturing Company | Aqueous oil and water repellent compositions |
-
1998
- 1998-07-14 CN CNB98807074XA patent/CN1140378C/zh not_active Expired - Fee Related
- 1998-07-14 US US09/462,481 patent/US6283360B1/en not_active Expired - Fee Related
- 1998-07-14 DE DE69806007T patent/DE69806007T2/de not_active Expired - Fee Related
- 1998-07-14 EP EP98931094A patent/EP0996523B1/de not_active Expired - Lifetime
- 1998-07-14 WO PCT/JP1998/003152 patent/WO1999003637A1/en active IP Right Grant
- 1998-07-15 MY MYPI98003230A patent/MY129177A/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE69806007D1 (de) | 2002-07-18 |
CN1140378C (zh) | 2004-03-03 |
US6283360B1 (en) | 2001-09-04 |
EP0996523B1 (de) | 2002-06-12 |
CN1263485A (zh) | 2000-08-16 |
EP0996523A1 (de) | 2000-05-03 |
MY129177A (en) | 2007-03-30 |
WO1999003637A1 (en) | 1999-01-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |