DE69736505D1 - Halbleiterchipgehäuse in Chip-Grösse - Google Patents

Halbleiterchipgehäuse in Chip-Grösse

Info

Publication number
DE69736505D1
DE69736505D1 DE69736505T DE69736505T DE69736505D1 DE 69736505 D1 DE69736505 D1 DE 69736505D1 DE 69736505 T DE69736505 T DE 69736505T DE 69736505 T DE69736505 T DE 69736505T DE 69736505 D1 DE69736505 D1 DE 69736505D1
Authority
DE
Germany
Prior art keywords
chip
size semiconductor
package
semiconductor chip
chip package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69736505T
Other languages
English (en)
Other versions
DE69736505T2 (de
Inventor
Tatsuo Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69736505D1 publication Critical patent/DE69736505D1/de
Publication of DE69736505T2 publication Critical patent/DE69736505T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
DE69736505T 1996-08-21 1997-08-20 Halbleiterchipgehäuse in Chip-Grösse Expired - Fee Related DE69736505T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21898096 1996-08-21
JP8218980A JP2828057B2 (ja) 1996-08-21 1996-08-21 チップサイズパッケージ

Publications (2)

Publication Number Publication Date
DE69736505D1 true DE69736505D1 (de) 2006-09-28
DE69736505T2 DE69736505T2 (de) 2006-12-21

Family

ID=16728388

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69736505T Expired - Fee Related DE69736505T2 (de) 1996-08-21 1997-08-20 Halbleiterchipgehäuse in Chip-Grösse

Country Status (5)

Country Link
US (1) US5909010A (de)
EP (1) EP0825647B1 (de)
JP (1) JP2828057B2 (de)
CA (1) CA2213542C (de)
DE (1) DE69736505T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6249052B1 (en) * 1998-06-01 2001-06-19 Paul T. Lin Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration
US6915566B2 (en) * 1999-03-01 2005-07-12 Texas Instruments Incorporated Method of fabricating flexible circuits for integrated circuit interconnections
JP2000323599A (ja) * 1999-05-13 2000-11-24 Nec Corp Ｌｓｉのパッケージ構造
US20020003049A1 (en) * 1999-12-29 2002-01-10 Sanjay Dabral Inline and "Y" input-output bus topology
US6507118B1 (en) 2000-07-14 2003-01-14 3M Innovative Properties Company Multi-metal layer circuit
US6888064B2 (en) 2002-12-18 2005-05-03 International Business Machines Corporation Modular packaging arrangements and methods
US20050139685A1 (en) * 2003-12-30 2005-06-30 Douglas Kozlay Design & method for manufacturing low-cost smartcards with embedded fingerprint authentication system modules
TWI250629B (en) * 2005-01-12 2006-03-01 Ind Tech Res Inst Electronic package and fabricating method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4772936A (en) * 1984-09-24 1988-09-20 United Technologies Corporation Pretestable double-sided tab design
US4616406A (en) * 1984-09-27 1986-10-14 Advanced Micro Devices, Inc. Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein
EP0382203B1 (de) * 1989-02-10 1995-04-26 Fujitsu Limited Keramische Packung vom Halbleiteranordnungstyp und Verfahren zum Zusammensetzen derselben
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
JPH04252054A (ja) * 1991-01-10 1992-09-08 Fujitsu Ltd 半導体装置
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
US5477611A (en) * 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
US5367763A (en) * 1993-09-30 1994-11-29 Atmel Corporation TAB testing of area array interconnected chips
JP3056960B2 (ja) * 1993-12-27 2000-06-26 株式会社東芝 半導体装置及びｂｇａパッケージ
KR100194130B1 (ko) * 1994-03-30 1999-06-15 니시무로 타이죠 반도체 패키지
US5663106A (en) * 1994-05-19 1997-09-02 Tessera, Inc. Method of encapsulating die and chip carrier
US5616953A (en) * 1994-09-01 1997-04-01 Micron Technology, Inc. Lead frame surface finish enhancement
US5528083A (en) * 1994-10-04 1996-06-18 Sun Microsystems, Inc. Thin film chip capacitor for electrical noise reduction in integrated circuits
JPH08222681A (ja) * 1995-02-14 1996-08-30 Toshiba Corp 樹脂封止型半導体装置
KR0169820B1 (ko) * 1995-08-22 1999-01-15 김광호 금속 회로 기판을 갖는 칩 스케일 패키지

Also Published As

Publication number Publication date
EP0825647A2 (de) 1998-02-25
DE69736505T2 (de) 2006-12-21
US5909010A (en) 1999-06-01
CA2213542A1 (en) 1998-02-21
EP0825647A3 (de) 1998-07-15
JPH1064948A (ja) 1998-03-06
EP0825647B1 (de) 2006-08-16
CA2213542C (en) 2002-01-15
JP2828057B2 (ja) 1998-11-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee