DE69736479D1 - Bildsensorplättchen, herstellungsverfahren und bildsensor - Google Patents

Bildsensorplättchen, herstellungsverfahren und bildsensor

Info

Publication number
DE69736479D1
DE69736479D1 DE69736479T DE69736479T DE69736479D1 DE 69736479 D1 DE69736479 D1 DE 69736479D1 DE 69736479 T DE69736479 T DE 69736479T DE 69736479 T DE69736479 T DE 69736479T DE 69736479 D1 DE69736479 D1 DE 69736479D1
Authority
DE
Germany
Prior art keywords
sensor
manufacturing
picture
image sensor
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69736479T
Other languages
English (en)
Other versions
DE69736479T2 (de
Inventor
Hisayoshi Fujimoto
Hiroaki Masaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE69736479D1 publication Critical patent/DE69736479D1/de
Application granted granted Critical
Publication of DE69736479T2 publication Critical patent/DE69736479T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/617Noise processing, e.g. detecting, correcting, reducing or removing noise for reducing electromagnetic interference, e.g. clocking noise
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/701Line sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/71Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75Circuitry for providing, modifying or processing image signals from the pixel array
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Facsimile Heads (AREA)
DE69736479T 1996-04-15 1997-04-15 Bildsensorplättchen, herstellungsverfahren und bildsensor Expired - Fee Related DE69736479T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP9226896 1996-04-15
JP9226896 1996-04-15
JP9226796 1996-04-15
JP9226996 1996-04-15
JP9226796 1996-04-15
JP9226996 1996-04-15
PCT/JP1997/001305 WO1997039486A1 (fr) 1996-04-15 1997-04-15 Puce de detecteur d'image, son procede de fabrication et detecteur d'image

Publications (2)

Publication Number Publication Date
DE69736479D1 true DE69736479D1 (de) 2006-09-21
DE69736479T2 DE69736479T2 (de) 2007-04-12

Family

ID=27306984

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69736479T Expired - Fee Related DE69736479T2 (de) 1996-04-15 1997-04-15 Bildsensorplättchen, herstellungsverfahren und bildsensor

Country Status (7)

Country Link
US (2) US6169279B1 (de)
EP (1) EP0924770B1 (de)
KR (1) KR100384360B1 (de)
CN (1) CN1163969C (de)
DE (1) DE69736479T2 (de)
TW (1) TW350621U (de)
WO (1) WO1997039486A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003087514A (ja) * 2000-11-15 2003-03-20 Nippon Sheet Glass Co Ltd 画像読取り装置、その光源およびシェーディング補正装置
JP2003115584A (ja) * 2001-10-05 2003-04-18 Canon Inc 撮像装置及び読取装置
US20050110464A1 (en) * 2003-11-25 2005-05-26 Baker Howard S. Fuel cell voltage monitoring system
JP2006072058A (ja) * 2004-09-03 2006-03-16 Pentax Corp レーザ走査装置
US7528040B2 (en) 2005-05-24 2009-05-05 Cree, Inc. Methods of fabricating silicon carbide devices having smooth channels
JP5170501B2 (ja) * 2006-05-16 2013-03-27 株式会社デンソー 電力変換装置
JP2017220893A (ja) * 2016-06-10 2017-12-14 株式会社村田製作所 増幅器
KR20200078590A (ko) * 2017-12-01 2020-07-01 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 이미지 센서 라인 방향
CN117008369B (zh) * 2023-09-27 2023-12-22 惠科股份有限公司 显示面板、显示面板的电阻验证方法以及显示装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3435354A1 (de) 1983-09-27 1986-01-23 Kyocera Corp., Kyoto Photoelektrische wandleranordnung
JPS63108808A (ja) 1986-10-24 1988-05-13 Mitsubishi Electric Corp 光検知器内蔵プリアンプ
US4886977A (en) * 1986-11-11 1989-12-12 Canon Kabushiki Kaisha Photoelectric converter provided with voltage dividing means
JP2669462B2 (ja) 1987-08-05 1997-10-27 キヤノン株式会社 光電変換装置
JPH01208974A (ja) 1988-02-16 1989-08-22 Sony Corp Mos型固体撮像装置
JPH0220065A (ja) 1988-07-08 1990-01-23 Ricoh Co Ltd ラインセンサ
JPH0247979A (ja) * 1988-08-09 1990-02-16 Fuji Xerox Co Ltd 画像読取装置
JP2823578B2 (ja) 1989-02-10 1998-11-11 キヤノン株式会社 光電変換装置及びその駆動方法
JPH06273602A (ja) * 1993-03-24 1994-09-30 Matsushita Electric Ind Co Ltd 密着型イメージセンサ
JP2991039B2 (ja) * 1994-06-16 1999-12-20 三菱電機株式会社 密着型イメージセンサ
JPH0888807A (ja) 1994-09-16 1996-04-02 Canon Inc イメージセンサ
US6128039A (en) * 1999-01-11 2000-10-03 Omnivision Technologies, Inc. Column amplifier for high fixed pattern noise reduction

Also Published As

Publication number Publication date
KR100384360B1 (ko) 2003-11-17
EP0924770A1 (de) 1999-06-23
US6468827B1 (en) 2002-10-22
EP0924770A4 (de) 1999-07-21
CN1163969C (zh) 2004-08-25
KR20000005441A (ko) 2000-01-25
EP0924770B1 (de) 2006-08-09
DE69736479T2 (de) 2007-04-12
WO1997039486A1 (fr) 1997-10-23
US6169279B1 (en) 2001-01-02
TW350621U (en) 1999-01-11
CN1215502A (zh) 1999-04-28

Similar Documents

Publication Publication Date Title
GB9904689D0 (en) CMOS image sensor and method for fabricating the same
DE69721607D1 (de) Bildherstellungsverfahren
DE69723542D1 (de) Bildsensor
DE69508372D1 (de) Bildsensor
DE69503473D1 (de) Festkörper-Bildaufnahme-Vorrichtung und Herstellungsmethode
DE69816185D1 (de) Bildverarbeitungsverfahren und -vorrichtung
DE69823116D1 (de) Bildverarbeitungsverfahren und -gerät
DE69827071D1 (de) Bildverarbeitungsverfahren und -gerät
DE69834209D1 (de) Bildverarbeitungsverfahren
DE69825196D1 (de) Bildverarbeitungsverfahren und -vorrichtung
KR960009615A (ko) 촬상장치
DE69829264D1 (de) Bilderzeugungsgerät und Bilderzeugungsverfahren
DE69818523D1 (de) Bilddekodierungsverfahren und -gerät
NO984031L (no) Bµreelement og fremgangsmÕte for fremstilling av samme
DE69715584D1 (de) Bilderzeugungsgerät und -Verfahren
DE69635601D1 (de) Halbleiterbildsensor und Videokamera, diesen beinhaltend
DE69611584D1 (de) Wärmebildgerät
DE69938489D1 (de) Bilderzeugungsgerät und System
DE69736161D1 (de) Bilderzeugungsverfahren und Bilderzeugungsgerät
DE69532929D1 (de) Bildherstellungsverfahren
DE69836467D1 (de) Bilderzeugungsvorrichtung und -verfahren
DE69823402D1 (de) Bildverarbeitungsvorrichtung und -verfahren
DE69721850D1 (de) Bildkodierungsverfahren und Bildkodierer
DE69833998D1 (de) Bilderzeugungsverfahren und -vorrichtung
DE69736412D1 (de) Bilderzeugungsverfahren und -vorrichtung

Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: FUJIMOTO, HISAYOSHI, ROHM CO., LTD., KYOTO-SHI, KY

Inventor name: MASAOKA, HIROAKI, ROHM CO., LTD., KYOTO-SHI, KYOTO

8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, SCHUMACHER, KNAUER, VON HIRSCHHAUSEN, 4513

8339 Ceased/non-payment of the annual fee