DE69715939D1 - Verbesserte Bornitridzusammensetzung und Polymerformmasse mit hoher Wärmeleitfähigkeit - Google Patents
Verbesserte Bornitridzusammensetzung und Polymerformmasse mit hoher WärmeleitfähigkeitInfo
- Publication number
- DE69715939D1 DE69715939D1 DE69715939T DE69715939T DE69715939D1 DE 69715939 D1 DE69715939 D1 DE 69715939D1 DE 69715939 T DE69715939 T DE 69715939T DE 69715939 T DE69715939 T DE 69715939T DE 69715939 D1 DE69715939 D1 DE 69715939D1
- Authority
- DE
- Germany
- Prior art keywords
- thermal conductivity
- boron nitride
- high thermal
- molding compound
- polymer molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/610,764 US5681883A (en) | 1996-03-05 | 1996-03-05 | Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69715939D1 true DE69715939D1 (de) | 2002-11-07 |
DE69715939T2 DE69715939T2 (de) | 2003-06-18 |
Family
ID=24446326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69715939T Expired - Lifetime DE69715939T2 (de) | 1996-03-05 | 1997-03-03 | Verbesserte Bornitridzusammensetzung und Polymerformmasse mit hoher Wärmeleitfähigkeit |
Country Status (8)
Country | Link |
---|---|
US (1) | US5681883A (de) |
EP (1) | EP0794227B1 (de) |
JP (1) | JP4108151B2 (de) |
KR (1) | KR100362961B1 (de) |
CA (1) | CA2198422A1 (de) |
DE (1) | DE69715939T2 (de) |
MY (1) | MY119076A (de) |
TW (1) | TW387839B (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19517167A1 (de) * | 1995-05-10 | 1996-11-14 | Veritas Gummiwerke Ag | Verfahren zur Herstellung von Erzeugnissen aus Polymerwerkstoffen mit medikamentöser Depotwirkung |
AU5109099A (en) | 1998-07-15 | 2000-02-07 | Thermon Manufacturing Company | Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof |
EP1114843B1 (de) * | 1999-12-16 | 2006-03-29 | Edison Polymer Innovation Corporation | Oberflächenbehandeltes Bornitrid zur Herstellung von einer auf einem Polymerisat und Bornitrid Zusammensetzung mit niedriger Viskosität und hoher Wärmeleitfähigkeit und Verfahren |
US6162849A (en) * | 1999-01-11 | 2000-12-19 | Ferro Corporation | Thermally conductive thermoplastic |
US6048919A (en) | 1999-01-29 | 2000-04-11 | Chip Coolers, Inc. | Thermally conductive composite material |
US20070241303A1 (en) * | 1999-08-31 | 2007-10-18 | General Electric Company | Thermally conductive composition and method for preparing the same |
US7976941B2 (en) * | 1999-08-31 | 2011-07-12 | Momentive Performance Materials Inc. | Boron nitride particles of spherical geometry and process for making thereof |
US6713088B2 (en) * | 1999-08-31 | 2004-03-30 | General Electric Company | Low viscosity filler composition of boron nitride particles of spherical geometry and process |
US7445797B2 (en) * | 2005-03-14 | 2008-11-04 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and polymer-based compositions made therewith |
US20010049028A1 (en) * | 2000-01-11 | 2001-12-06 | Mccullough Kevin A | Metal injection molding material with high aspect ratio filler |
US6620497B2 (en) | 2000-01-11 | 2003-09-16 | Cool Options, Inc. | Polymer composition with boron nitride coated carbon flakes |
US6680015B2 (en) | 2000-02-01 | 2004-01-20 | Cool Options, Inc. | Method of manufacturing a heat sink assembly with overmolded carbon matrix |
US6660241B2 (en) | 2000-05-01 | 2003-12-09 | Saint-Gobain Ceramics & Plastics, Inc. | Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof |
US6794435B2 (en) | 2000-05-18 | 2004-09-21 | Saint Gobain Ceramics & Plastics, Inc. | Agglomerated hexagonal boron nitride powders, method of making, and uses thereof |
US6710109B2 (en) * | 2000-07-13 | 2004-03-23 | Cool Options, Inc. A New Hampshire Corp. | Thermally conductive and high strength injection moldable composition |
US6764975B1 (en) | 2000-11-28 | 2004-07-20 | Saint-Gobain Ceramics & Plastics, Inc. | Method for making high thermal diffusivity boron nitride powders |
EP1397421B1 (de) * | 2001-04-30 | 2019-09-04 | Saint-Gobain Ceramics and Plastics, Inc. | Polymerverarbeitung und verfahren zur verarbeitung von polymeren |
US6600633B2 (en) | 2001-05-10 | 2003-07-29 | Seagate Technology Llc | Thermally conductive overmold for a disc drive actuator assembly |
US6645612B2 (en) * | 2001-08-07 | 2003-11-11 | Saint-Gobain Ceramics & Plastics, Inc. | High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them |
JP2003060134A (ja) * | 2001-08-17 | 2003-02-28 | Polymatech Co Ltd | 熱伝導性シート |
US20030040563A1 (en) * | 2001-08-23 | 2003-02-27 | Sagal E. Mikhail | Substantially non-abrasive thermally conductive polymer composition containing boron nitride |
US6756005B2 (en) * | 2001-08-24 | 2004-06-29 | Cool Shield, Inc. | Method for making a thermally conductive article having an integrated surface and articles produced therefrom |
US7038009B2 (en) * | 2001-08-31 | 2006-05-02 | Cool Shield, Inc. | Thermally conductive elastomeric pad and method of manufacturing same |
US20030139510A1 (en) * | 2001-11-13 | 2003-07-24 | Sagal E. Mikhail | Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom |
US7494635B2 (en) | 2003-08-21 | 2009-02-24 | Saint-Gobain Ceramics & Plastics, Inc. | Boron nitride agglomerated powder |
US20050072334A1 (en) * | 2003-10-07 | 2005-04-07 | Saint-Gobain Performance Plastics, Inc. | Thermal interface material |
US8221885B2 (en) | 2004-06-02 | 2012-07-17 | Cool Options, Inc. a corporation of the State of New Hampshire | Thermally conductive polymer compositions having low thermal expansion characteristics |
US20070043166A1 (en) * | 2004-07-29 | 2007-02-22 | Norihisa Hoshika | Epoxy resin composition for encapsulating semiconductor chip and semiconductor device |
WO2006023860A2 (en) | 2004-08-23 | 2006-03-02 | General Electric Company | Thermally conductive composition and method for preparing the same |
US7524560B2 (en) * | 2005-08-19 | 2009-04-28 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
CA2620851A1 (en) * | 2005-08-26 | 2007-03-01 | Cool Options, Inc. | Thermally conductive thermoplastics for die-level packaging of microelectronics |
DE102005045767B4 (de) * | 2005-09-23 | 2012-03-29 | Infineon Technologies Ag | Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse |
US7527859B2 (en) * | 2006-10-08 | 2009-05-05 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
DE112008002566B4 (de) * | 2007-09-26 | 2014-08-28 | Mitsubishi Electric Corp. | Wärmeleitfähige Lage und Verfahren zum Herstellen derselben, und Leistungsmodul |
JP5103364B2 (ja) | 2008-11-17 | 2012-12-19 | 日東電工株式会社 | 熱伝導性シートの製造方法 |
US20100256280A1 (en) * | 2009-04-07 | 2010-10-07 | Laird Technologies, Inc. | Methods of forming resin and filler composite systems |
US8288466B2 (en) * | 2009-05-13 | 2012-10-16 | E I Du Pont De Nemours And Company | Composite of a polymer and surface modified hexagonal boron nitride particles |
US8440292B2 (en) * | 2009-05-13 | 2013-05-14 | E I Du Pont De Nemours And Company | Multi-layer article for flexible printed circuits |
US8784980B2 (en) * | 2009-05-13 | 2014-07-22 | E I Du Pont De Nemours And Company | Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles |
US8258346B2 (en) * | 2009-05-13 | 2012-09-04 | E I Du Pont De Nemours And Company | Surface modified hexagonal boron nitride particles |
GB2501536A (en) * | 2012-04-26 | 2013-10-30 | Reckitt & Colman Overseas | Hair removal compositions |
KR101493781B1 (ko) | 2013-02-27 | 2015-02-17 | 한양대학교 에리카산학협력단 | 열전도성 세라믹-폴리머 복합체 및 그 제조방법 |
KR102318231B1 (ko) * | 2015-01-29 | 2021-10-27 | 엘지이노텍 주식회사 | 무기충전재, 이를 포함하는 수지 조성물, 그리고 이를 이용한 방열 기판 |
TWI681004B (zh) | 2015-12-30 | 2020-01-01 | 美商聖高拜陶器塑膠公司 | 改質氮化物顆粒、寡聚物官能化氮化物顆粒、基於聚合物之複合材料及其形成方法 |
WO2017205873A1 (en) * | 2016-05-27 | 2017-11-30 | Saint-Gobain Ceramics & Plastics, Inc. | Process for manufacturing boron nitride agglomerates |
KR102506974B1 (ko) * | 2018-07-31 | 2023-03-07 | 교세라 가부시키가이샤 | 플레이크 형상 밀봉용 수지 조성물, 및 반도체 장치 |
US11560101B2 (en) | 2020-11-17 | 2023-01-24 | Ford Global Technologies, Llc | Headliner-mounted telematics control unit package |
CN115368758A (zh) * | 2022-09-13 | 2022-11-22 | 安徽大学 | 一种非离子表面活性剂非共价改性氮化硼导热填料及基于其的导热复合材料 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3411473A1 (de) * | 1984-03-28 | 1985-10-10 | Siemens AG, 1000 Berlin und 8000 München | Form- und ueberzugsmassen |
DE3525301A1 (de) * | 1985-07-16 | 1987-01-22 | Egbert Dr Brandau | Reaktionsharz |
US5011872A (en) * | 1987-12-21 | 1991-04-30 | The Carborudum Company | Thermally conductive ceramic/polymer composites |
DE3932882A1 (de) * | 1989-10-02 | 1991-04-11 | Siemens Ag | Gut waermeleitender verbundwerkstoff |
US5391624A (en) * | 1992-02-10 | 1995-02-21 | S. C. Johnson & Son, Inc. | Thermosettable compositions |
AU6781694A (en) * | 1993-05-07 | 1994-12-12 | W.L. Gore & Associates, Inc. | Light colored conductive sealant material and method of producing same |
EP0754741B1 (de) * | 1995-07-19 | 2001-10-24 | Raytheon Company | Bei Raumtemperatur stabiler, flexibler einkomponenten Epoxidklebstoff mit thermischer Leitfähigkeit |
-
1996
- 1996-03-05 US US08/610,764 patent/US5681883A/en not_active Expired - Lifetime
-
1997
- 1997-02-25 CA CA002198422A patent/CA2198422A1/en not_active Abandoned
- 1997-02-26 KR KR1019970005958A patent/KR100362961B1/ko not_active IP Right Cessation
- 1997-03-03 EP EP97103424A patent/EP0794227B1/de not_active Expired - Lifetime
- 1997-03-03 DE DE69715939T patent/DE69715939T2/de not_active Expired - Lifetime
- 1997-03-04 MY MYPI97000879A patent/MY119076A/en unknown
- 1997-03-05 JP JP06747297A patent/JP4108151B2/ja not_active Expired - Lifetime
- 1997-03-05 TW TW086102690A patent/TW387839B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5681883A (en) | 1997-10-28 |
EP0794227A3 (de) | 1999-12-29 |
KR970065647A (ko) | 1997-10-13 |
DE69715939T2 (de) | 2003-06-18 |
EP0794227B1 (de) | 2002-10-02 |
JPH1060161A (ja) | 1998-03-03 |
MY119076A (en) | 2005-03-31 |
CA2198422A1 (en) | 1997-09-05 |
EP0794227A2 (de) | 1997-09-10 |
TW387839B (en) | 2000-04-21 |
JP4108151B2 (ja) | 2008-06-25 |
KR100362961B1 (ko) | 2003-03-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: GENERAL ELECTRIC CO., SCHENECTADY, N.Y., US |