DE69711825T2 - Läppvorrichtung und Verfahren - Google Patents

Läppvorrichtung und Verfahren

Info

Publication number
DE69711825T2
DE69711825T2 DE69711825T DE69711825T DE69711825T2 DE 69711825 T2 DE69711825 T2 DE 69711825T2 DE 69711825 T DE69711825 T DE 69711825T DE 69711825 T DE69711825 T DE 69711825T DE 69711825 T2 DE69711825 T2 DE 69711825T2
Authority
DE
Germany
Prior art keywords
lapping device
lapping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69711825T
Other languages
English (en)
Other versions
DE69711825D1 (de
Inventor
Kenkichi Kitajima
Kazuo Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Application granted granted Critical
Publication of DE69711825D1 publication Critical patent/DE69711825D1/de
Publication of DE69711825T2 publication Critical patent/DE69711825T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
DE69711825T 1996-12-19 1997-12-11 Läppvorrichtung und Verfahren Expired - Fee Related DE69711825T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8339594A JPH10180624A (ja) 1996-12-19 1996-12-19 ラッピング装置及び方法

Publications (2)

Publication Number Publication Date
DE69711825D1 DE69711825D1 (de) 2002-05-16
DE69711825T2 true DE69711825T2 (de) 2002-08-29

Family

ID=18328963

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69711825T Expired - Fee Related DE69711825T2 (de) 1996-12-19 1997-12-11 Läppvorrichtung und Verfahren

Country Status (6)

Country Link
US (1) US5941759A (de)
EP (1) EP0849039B1 (de)
JP (1) JPH10180624A (de)
DE (1) DE69711825T2 (de)
MY (1) MY132707A (de)
TW (1) TW374943B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10149712B4 (de) * 2001-07-04 2013-02-14 Disco Corp. Schleifscheibe

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19756537A1 (de) * 1997-12-18 1999-07-01 Wacker Siltronic Halbleitermat Verfahren zum Erzielen eines möglichst linearen Verschleißverhaltens und Werkzeug mit möglichst linearem Verschleißverhalten
US6258177B1 (en) 1999-03-29 2001-07-10 Seh America Apparatus for cleaning the grooves of lapping plates
WO2000069597A1 (fr) * 1999-05-17 2000-11-23 Kashiwara Machine Mfg. Co., Ltd. Procede et dispositif de polissage double face
ATE321628T1 (de) * 1999-06-28 2006-04-15 Seso Verfahren zum polieren von mindestens einer seite eines silizium enthaltende werkstücks
US20020052116A1 (en) * 2000-03-17 2002-05-02 Krishna Vepa Free Floating double side polishing of substrates
JP3485067B2 (ja) * 2000-05-22 2004-01-13 株式会社村田製作所 ラッピング加工方法およびラッピング装置
TWI248842B (en) 2000-06-12 2006-02-11 Hitachi Ltd Semiconductor device and semiconductor module
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6416392B1 (en) * 2000-11-30 2002-07-09 Seh America, Inc. Sound enhanced lapping process
US6672943B2 (en) 2001-01-26 2004-01-06 Wafer Solutions, Inc. Eccentric abrasive wheel for wafer processing
JP2002239895A (ja) * 2001-01-31 2002-08-28 Internatl Business Mach Corp <Ibm> 研磨用保持部材、研磨方法および研磨装置
US6632012B2 (en) 2001-03-30 2003-10-14 Wafer Solutions, Inc. Mixing manifold for multiple inlet chemistry fluids
DE10361767B4 (de) * 2003-12-31 2005-12-22 Thielenhaus Technologies Gmbh Verfahren und Vorrichtung zur mechanischen Bearbeitung von parallelen Stirnflächen an kleinteiligen Werkstücken
US8900033B2 (en) * 2009-12-01 2014-12-02 Sumco Corporation Wafer polishing method
JP5630414B2 (ja) 2011-10-04 2014-11-26 信越半導体株式会社 ウェーハの加工方法
KR101660898B1 (ko) * 2014-08-13 2016-09-28 주식회사 엘지실트론 슬러리 공급 장치 및 이를 포함하는 연마 장치
JP6885492B1 (ja) * 2020-05-13 2021-06-16 信越半導体株式会社 両面研磨方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1491103A (en) * 1919-07-08 1924-04-22 Pratt & Whitney Co Method of and machine for making gauges and other articles
US1541001A (en) * 1920-12-04 1925-06-09 Fafnir Bearing Co Lapping machine
US1476863A (en) * 1922-01-17 1923-12-11 Floyd C Weaver Machine for making true plane surfaces
US2944375A (en) * 1956-10-26 1960-07-12 Lipkins Morton Lapping machine
JPS55106769A (en) * 1979-01-31 1980-08-15 Masami Masuko Lapping method and its apparatus
US4593495A (en) * 1983-11-25 1986-06-10 Toshiba Machine Co., Ltd. Polishing machine
KR860008003A (ko) * 1985-04-08 1986-11-10 제이·로렌스 킨 양면 포리싱 작업용 캐리어 조립체
DE3524978A1 (de) * 1985-07-12 1987-01-22 Wacker Chemitronic Verfahren zum beidseitigen abtragenden bearbeiten von scheibenfoermigen werkstuecken, insbesondere halbleiterscheiben
JPH02190258A (ja) * 1989-01-20 1990-07-26 Nkk Corp チタン板の両面研磨方法
US4996798A (en) * 1989-05-31 1991-03-05 Moore Steven C Ultra-precision lapping apparatus
JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
US5762543A (en) * 1995-11-30 1998-06-09 Speedfam Corporation Polishing apparatus with improved product unloading

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10149712B4 (de) * 2001-07-04 2013-02-14 Disco Corp. Schleifscheibe

Also Published As

Publication number Publication date
TW374943B (en) 1999-11-21
EP0849039A2 (de) 1998-06-24
US5941759A (en) 1999-08-24
EP0849039A3 (de) 1998-12-30
DE69711825D1 (de) 2002-05-16
MY132707A (en) 2007-10-31
EP0849039B1 (de) 2002-04-10
JPH10180624A (ja) 1998-07-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee