DE69711378D1 - Photostrukturierbare dielektrische zusammensetzungen - Google Patents

Photostrukturierbare dielektrische zusammensetzungen

Info

Publication number
DE69711378D1
DE69711378D1 DE69711378T DE69711378T DE69711378D1 DE 69711378 D1 DE69711378 D1 DE 69711378D1 DE 69711378 T DE69711378 T DE 69711378T DE 69711378 T DE69711378 T DE 69711378T DE 69711378 D1 DE69711378 D1 DE 69711378D1
Authority
DE
Germany
Prior art keywords
polymer
photoinitiator
dielectric compositions
polycyclic
photostructurable dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69711378T
Other languages
English (en)
Other versions
DE69711378T2 (de
Inventor
A Shick
Saikumar Jayaraman
Edmund Elce
L Goodall
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
BF Goodrich Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BF Goodrich Corp filed Critical BF Goodrich Corp
Application granted granted Critical
Publication of DE69711378D1 publication Critical patent/DE69711378D1/de
Publication of DE69711378T2 publication Critical patent/DE69711378T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Organic Insulating Materials (AREA)
DE69711378T 1996-11-04 1997-11-04 Photostrukturierbare dielektrische zusammensetzungen Expired - Lifetime DE69711378T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3041096P 1996-11-04 1996-11-04
PCT/US1997/020032 WO1998020394A1 (en) 1996-11-04 1997-11-04 Photodefinable dielectric compositions

Publications (2)

Publication Number Publication Date
DE69711378D1 true DE69711378D1 (de) 2002-05-02
DE69711378T2 DE69711378T2 (de) 2002-10-24

Family

ID=21854074

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69711378T Expired - Lifetime DE69711378T2 (de) 1996-11-04 1997-11-04 Photostrukturierbare dielektrische zusammensetzungen

Country Status (9)

Country Link
US (1) US6121340A (de)
EP (1) EP0906588B1 (de)
AT (1) ATE215105T1 (de)
AU (1) AU5196998A (de)
CA (1) CA2271382A1 (de)
DE (1) DE69711378T2 (de)
ES (1) ES2178017T3 (de)
TW (1) TW493106B (de)
WO (1) WO1998020394A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000015014A (ko) * 1998-08-26 2000-03-15 김영환 신규의 포토레지스트용 단량체, 중합체 및 이를 이용한 포토레지스트 조성물
JP4714955B2 (ja) * 1999-09-29 2011-07-06 日本ゼオン株式会社 環状オレフィン系付加重合体およびその製造方法
KR100816931B1 (ko) * 2000-10-04 2008-03-25 제이에스알 가부시끼가이샤 시클릭 올레핀 부가 공중합체 조성물 및 가교-결합된 물질
JP4821943B2 (ja) * 2001-05-30 2011-11-24 Ｊｓｒ株式会社 環状オレフィン系付加型共重合体の架橋体、架橋用組成物および架橋体の製造方法
JP4737451B2 (ja) * 2000-12-22 2011-08-03 Ｊｓｒ株式会社 架橋樹脂フィルム、およびその用途
WO2002088216A1 (fr) * 2001-04-27 2002-11-07 Mitsui Chemicals, Inc. Polymeres cycloolefiniques fluores, procedes de preparation de monomeres cycloolefiniques fluores et polymeres associes, et leur application
JP4645787B2 (ja) * 2001-05-30 2011-03-09 Ｊｓｒ株式会社 液晶配向膜形成基板および液晶表示素子
US7022790B2 (en) * 2002-07-03 2006-04-04 Sumitomo Bakelite Company, Ltd. Photosensitive compositions based on polycyclic polymers
US20060020068A1 (en) * 2004-07-07 2006-01-26 Edmund Elce Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
US7799516B2 (en) * 2002-10-16 2010-09-21 Georgia Tech Research Corporation Polymers, methods of use thereof, and methods of decomposition thereof
US6790914B2 (en) * 2002-11-29 2004-09-14 Jsr Corporation Resin film and applications thereof
US7422836B2 (en) * 2003-02-20 2008-09-09 Promerus Llc Dissolution rate modifiers for photoresist compositions
WO2004090936A2 (en) * 2003-04-11 2004-10-21 Silecs Oy Low-k dielectric material
US7098525B2 (en) 2003-05-08 2006-08-29 3M Innovative Properties Company Organic polymers, electronic devices, and methods
US7279777B2 (en) 2003-05-08 2007-10-09 3M Innovative Properties Company Organic polymers, laminates, and capacitors
US7101654B2 (en) * 2004-01-14 2006-09-05 Promerus Llc Norbornene-type monomers and polymers containing pendent lactone or sultone groups
US7378456B2 (en) * 2004-01-30 2008-05-27 Promerus Llc Directly photodefinable polymer compositions and methods thereof
US20050192409A1 (en) * 2004-02-13 2005-09-01 Rhodes Larry F. Polymers of polycyclic olefins having a polyhedral oligosilsesquioxane pendant group and uses thereof
JP4629367B2 (ja) * 2004-05-31 2011-02-09 東レ・ダウコーニング株式会社 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材およびその製造方法
US7875686B2 (en) * 2004-08-18 2011-01-25 Promerus Llc Polycycloolefin polymeric compositions for semiconductor applications
US7294568B2 (en) * 2004-08-20 2007-11-13 Intel Corporation Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures
US8092628B2 (en) * 2008-10-31 2012-01-10 Brewer Science Inc. Cyclic olefin compositions for temporary wafer bonding
US8771927B2 (en) * 2009-04-15 2014-07-08 Brewer Science Inc. Acid-etch resistant, protective coatings
JP5212659B2 (ja) 2010-07-30 2013-06-19 信越化学工業株式会社 高気体透過性環状オレフィン付加重合体の製造方法
US9893167B2 (en) 2014-03-24 2018-02-13 Intel Corporation Integration methods to fabricate internal spacers for nanowire devices
JP6550275B2 (ja) * 2015-06-15 2019-07-24 東京応化工業株式会社 ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品
US9896527B2 (en) 2016-03-01 2018-02-20 Saudi Arabian Oil Company Highly selective polynorbornene homopolymer membranes for natural gas upgrading
US20170370783A1 (en) * 2016-06-24 2017-12-28 The Regents Of The University Of Michigan Nanoscale Temperature Sensor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3330815A (en) * 1964-03-24 1967-07-11 Union Carbide Corp Novel polynorbornenes, process for production thereof, and products produced therefrom
US3838115A (en) * 1971-02-02 1974-09-24 Copolymer Rubber & Chem Corp Silyl-norbornene and interpolymers prepared of same
DE2314543C3 (de) * 1973-03-23 1980-09-11 Chemische Werke Huels Ag, 4370 Marl Verfahren zur Herstellung von polymeren Kohlenwasserstoffen mit reaktiven Silylseitengruppen
US3920714A (en) * 1972-11-16 1975-11-18 Weber Heinrich Process for the production of polymeric hydrocarbons with reactive silyl side groups
US5179171A (en) * 1985-05-24 1993-01-12 Mitsui Petrochemical Industries, Ltd. Random copolymer, and process for production thereof
US5011730A (en) * 1987-08-14 1991-04-30 The B. F. Goodrich Company Bulk polymerized cycloolefin circuit boards
JPH0242441A (ja) * 1988-03-31 1990-02-13 Nippon Zeon Co Ltd 光学用薄膜体
US5071701A (en) * 1989-11-22 1991-12-10 B. F. Goodrich Corporation Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards
JP3087421B2 (ja) * 1992-01-31 2000-09-11 日本ゼオン株式会社 反応性ケイ素基含有ノルボルネン系ポリマーの製造方法
US5407970A (en) * 1993-04-13 1995-04-18 Minnesota Mining And Manufacturing Company Radiation-curable poly(α-olefin) adhesives containing pendant olefinic funtionality
JPH07104474A (ja) * 1993-09-30 1995-04-21 Nippon Zeon Co Ltd 感光性樹脂組成物
US5468819A (en) * 1993-11-16 1995-11-21 The B.F. Goodrich Company Process for making polymers containing a norbornene repeating unit by addition polymerization using an organo (nickel or palladium) complex
FR2724022B1 (fr) * 1994-08-25 1996-09-20 Alcatel Fibres Optiques Fibre optique comprenant une couche protectrice, et procede de fabrication d'une telle fibre

Also Published As

Publication number Publication date
CA2271382A1 (en) 1998-05-14
DE69711378T2 (de) 2002-10-24
WO1998020394A1 (en) 1998-05-14
ATE215105T1 (de) 2002-04-15
AU5196998A (en) 1998-05-29
EP0906588A1 (de) 1999-04-07
TW493106B (en) 2002-07-01
EP0906588B1 (de) 2002-03-27
US6121340A (en) 2000-09-19
ES2178017T3 (es) 2002-12-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SUMITOMO BAKELITE CO. LTD., TOKIO/TOKYO, JP