DE69710089D1 - Druckfähige zusammensetzungen und deren auftragung auf dielektrische oberflächen für die herstellung von gedruckten leiterplatten - Google Patents

Druckfähige zusammensetzungen und deren auftragung auf dielektrische oberflächen für die herstellung von gedruckten leiterplatten

Info

Publication number
DE69710089D1
DE69710089D1 DE69710089T DE69710089T DE69710089D1 DE 69710089 D1 DE69710089 D1 DE 69710089D1 DE 69710089 T DE69710089 T DE 69710089T DE 69710089 T DE69710089 T DE 69710089T DE 69710089 D1 DE69710089 D1 DE 69710089D1
Authority
DE
Germany
Prior art keywords
production
application
printed circuits
dielectric surfaces
printable compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69710089T
Other languages
English (en)
Other versions
DE69710089T2 (de
Inventor
Hugh P Craig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Hugh P Craig
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hugh P Craig filed Critical Hugh P Craig
Application granted granted Critical
Publication of DE69710089D1 publication Critical patent/DE69710089D1/de
Publication of DE69710089T2 publication Critical patent/DE69710089T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69710089T 1996-08-16 1997-08-15 Druckfähige zusammensetzungen und deren auftragung auf dielektrische oberflächen für die herstellung von gedruckten leiterplatten Expired - Lifetime DE69710089T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2404696P 1996-08-16 1996-08-16
PCT/IB1997/001033 WO1998008362A1 (en) 1996-08-16 1997-08-15 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards

Publications (2)

Publication Number Publication Date
DE69710089D1 true DE69710089D1 (de) 2002-03-14
DE69710089T2 DE69710089T2 (de) 2002-08-22

Family

ID=21818587

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69710089T Expired - Lifetime DE69710089T2 (de) 1996-08-16 1997-08-15 Druckfähige zusammensetzungen und deren auftragung auf dielektrische oberflächen für die herstellung von gedruckten leiterplatten

Country Status (6)

Country Link
EP (1) EP0933010B1 (de)
JP (1) JP4368946B2 (de)
AU (1) AU3781797A (de)
DE (1) DE69710089T2 (de)
MY (1) MY130828A (de)
WO (1) WO1998008362A1 (de)

Families Citing this family (30)

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US6971163B1 (en) * 1998-04-22 2005-12-06 Dow Corning Corporation Adhesive and encapsulating material with fluxing properties
GB9808587D0 (en) * 1998-04-22 1998-06-24 Craig Hugh P Adhesive and encapsulating material with fluxing properties
JP3414388B2 (ja) 2000-06-12 2003-06-09 株式会社日立製作所 電子機器
CN1269612C (zh) * 2000-12-21 2006-08-16 株式会社日立制作所 焊锡箔、半导体器件、电子器件、半导体组件及功率组件
US6802446B2 (en) * 2002-02-01 2004-10-12 Delphi Technologies, Inc. Conductive adhesive material with metallurgically-bonded conductive particles
JP4142312B2 (ja) 2002-02-28 2008-09-03 ハリマ化成株式会社 析出型はんだ組成物及びはんだ析出方法
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
AU2003289277A1 (en) * 2002-12-09 2004-06-30 Matsushita Electric Industrial Co., Ltd. Electronic part with external electrode
US20060194920A1 (en) * 2003-04-01 2006-08-31 Capote Miguel A Thermally conductive adhesive composition and process for device attachment
EP1795296B1 (de) * 2004-08-31 2014-08-06 Senju Metal Industry Co., Ltd. Flussmittel zum löten
WO2006076603A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Printable electrical conductors
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
KR101086358B1 (ko) 2005-01-25 2011-11-23 아사히 가세이 이-매터리얼즈 가부시키가이샤 도전성 페이스트
US7326369B2 (en) * 2005-03-07 2008-02-05 National Starch And Chemical Investment Holding Corporation Low stress conductive adhesive
WO2006130980A1 (en) * 2005-06-09 2006-12-14 National Starch And Chemical Company Aqueous printable electrical conductors
CN101341557B (zh) * 2005-12-22 2011-08-17 纳美仕有限公司 热固性导电糊以及具有使用其形成的外部电极的层叠陶瓷部件
US20080023665A1 (en) * 2006-07-25 2008-01-31 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
KR101056558B1 (ko) 2006-08-28 2011-08-11 가부시키가이샤 무라타 세이사쿠쇼 도전성 접합재료 및 전자장치
DE102007053277A1 (de) * 2007-11-08 2009-05-14 Robert Bosch Gmbh Verfahren zur Erhöhung der Viskosität einer Schmelze aus einer Metall-Legierung
US8063774B2 (en) * 2008-06-05 2011-11-22 Deere & Company Non-toxic, biodegradable sensor nodes for use with a wireless network
JP2010219492A (ja) * 2009-02-17 2010-09-30 Dainippon Printing Co Ltd 電子モジュール、電子モジュールの製造方法
KR101225497B1 (ko) * 2009-11-05 2013-01-23 (주)덕산테코피아 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치
JP4713682B1 (ja) * 2010-02-25 2011-06-29 パナソニック株式会社 多層配線基板、及び多層配線基板の製造方法
EP2557571B1 (de) * 2011-08-08 2014-07-02 Tyco Electronics Corporation Elektrisch leitfähige Metall-/Kunststoffmischung mit einem Polymermaterial, einem ersten Metall und Metallpartikel eines zweiten Metalls eingebettet in das erste Metall und Herstellungsverfahren dafür
CN104115236B (zh) * 2011-12-13 2017-12-19 道康宁公司 组合物及由其形成的导体
JP6486369B2 (ja) * 2013-09-05 2019-03-20 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 金属焼結フィルム組成物
US10625356B2 (en) 2015-02-11 2020-04-21 Alpha Assembly Solutions Inc. Electrical connection tape
WO2016166751A1 (en) * 2015-04-13 2016-10-20 Printcb Ltd. Printing of multi-layer circuits
IL277107B1 (en) * 2018-03-15 2024-05-01 Printcb Ltd A conductive two-component preparation for printing
TW202316949A (zh) * 2021-09-30 2023-04-16 日商拓自達電線股份有限公司 電磁波屏蔽膜及屏蔽印刷配線板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915729A (en) * 1974-04-09 1975-10-28 Du Pont High temperature solder pastes
JPS53133799A (en) * 1977-04-27 1978-11-21 Idearisaachi Yuugen Electroconductive paint
JPS55160072A (en) * 1979-05-31 1980-12-12 Matsushita Electric Ind Co Ltd Electrically conductive adhesive
DE3564636D1 (en) * 1984-07-31 1988-09-29 Mitsubishi Petrochemical Co Copper-type conductive coating composition
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
AU1182295A (en) * 1993-11-19 1995-06-06 Cts Corporation Metallurgically bonded polymer vias
FR2726001B1 (fr) * 1994-10-19 1996-11-29 Solaic Sa Encre conductrice comprenant des grains metalliques ayant des points de fusion differents
AU4397696A (en) * 1995-01-18 1996-08-07 Coates Brothers Plc Production of electrical circuit boards
DE19511553C2 (de) * 1995-03-29 1997-02-20 Litton Precision Prod Int Verfahren zur Erzeugung elektrisch leitfähiger Strukturen, eine nach dem Verfahren erhaltene elektrisch leitfähige Struktur sowie Kombination zur Erzeugung elektrisch leitfähiger Strukturen

Also Published As

Publication number Publication date
AU3781797A (en) 1998-03-06
DE69710089T2 (de) 2002-08-22
JP2000517092A (ja) 2000-12-19
WO1998008362A1 (en) 1998-02-26
MY130828A (en) 2007-07-31
EP0933010B1 (de) 2002-01-23
EP0933010A1 (de) 1999-08-04
JP4368946B2 (ja) 2009-11-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DOW CORNING CORP., MIDLAND, MICH., US

8381 Inventor (new situation)

Inventor name: CRAIG, HUGH P., USK, GB